LCMXO2-4000HE-4BG332C

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 1,130 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-4BG332C – MachXO2 Field Programmable Gate Array (FPGA)

The LCMXO2-4000HE-4BG332C is a MachXO2 family FPGA IC designed for flexible system control, I/O expansion and in-field programmability. It combines a mid-range logic capacity with embedded memory and a large I/O count to address a variety of commercial embedded designs.

Built on the MachXO2 architecture, this device provides instant-on non-volatile configuration, on-chip flash memory and a broad set of system-level features for power-sensitive, reconfigurable applications where integration and I/O density matter.

Key Features

  • Logic Capacity — Provides 4,320 logic elements to implement glue logic, state machines and moderate-density custom logic.
  • Memory — Includes a total of 94,208 bits of on-chip RAM for distributed memory and buffering needs.
  • I/O Density — 274 user I/Os for high-pin-count applications and complex interface requirements.
  • On‑Chip Non‑Volatile Memory & Reconfiguration — MachXO2 family features include user flash memory and TransFR reconfiguration for in-field logic updates and background programming.
  • Programmable I/O Buffer — Family-level programmable sysIO buffer supports a wide range of interfaces and differential standards for flexible board-level interfacing.
  • Low Power Architecture — Family-level ultra-low-power process and standby modes are part of the MachXO2 feature set, enabling lower idle power consumption.
  • Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and analog PLLs is available across the MachXO2 family for varied timing requirements.
  • Power and Thermal — Single-supply operation with a specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
  • Package and Mounting — Supplied in a 332-ball FBGA / caBGA footprint (332-FBGA; supplier package: 332-CABGA, 17 × 17 mm), optimized for surface-mount assembly.
  • Standards and Compliance — RoHS compliant for environmental compliance in commercial products.

Typical Applications

  • Interface Bridging and Protocol Conversion — High I/O count and programmable I/O buffers let the device act as a bridge between heterogeneous interfaces and legacy peripherals.
  • System Control and Glue Logic — Logic density and on-chip flash support complex state machines, control paths and configuration storage for embedded systems.
  • Display and Synchronous I/O — Family-level pre-engineered source-synchronous I/O and gearing options support display timing and other source-synchronous interfaces.
  • In-field Upgrades and Security — Non-volatile user flash and TransFR reconfiguration enable field updates and secure single-chip configuration strategies.

Unique Advantages

  • Balanced Logic and I/O — 4,320 logic elements paired with 274 I/Os provide a balanced solution for mixed-signal control and high-pin-count designs.
  • On‑Chip Memory for Local Storage — 94,208 bits of embedded RAM provide local buffering and small data-storage capability without external memory.
  • Non‑Volatile Instant‑On — On-chip user flash enables instant-on operation and single-chip configuration storage for simplified system boot and reliability.
  • Surface-Mount, High-Density Package — 332-ball caBGA/FBGA package enables compact board layouts while supporting large I/O counts.
  • Commercial Temperature and Power Envelope — Defined supply range (1.14–1.26 V) and commercial operating temperature (0 °C to 85 °C) make the device suitable for mainstream embedded products.
  • Regulatory Compliance — RoHS compliance supports environmental and manufacturing requirements for commercial products.

Why Choose LCMXO2-4000HE-4BG332C?

This MachXO2 device is positioned for designers seeking a reconfigurable, non-volatile FPGA with substantial I/O and mid-range logic capacity. Its combination of 4,320 logic elements, approximately 94 kbits of embedded RAM and 274 I/Os makes it well suited to control, interface and system glue roles in commercial embedded systems.

Choose this part for compact, surface-mount implementations that require in-field updates, instant-on configuration and a feature-rich FPGA architecture with family-level capabilities for low-power operation, flexible I/O and on-chip flash memory.

Request a quote or submit an inquiry for pricing and availability of the LCMXO2-4000HE-4BG332C.

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