LCMXO2-4000HE-4BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 1,130 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-4BG332C – MachXO2 Field Programmable Gate Array (FPGA)
The LCMXO2-4000HE-4BG332C is a MachXO2 family FPGA IC designed for flexible system control, I/O expansion and in-field programmability. It combines a mid-range logic capacity with embedded memory and a large I/O count to address a variety of commercial embedded designs.
Built on the MachXO2 architecture, this device provides instant-on non-volatile configuration, on-chip flash memory and a broad set of system-level features for power-sensitive, reconfigurable applications where integration and I/O density matter.
Key Features
- Logic Capacity — Provides 4,320 logic elements to implement glue logic, state machines and moderate-density custom logic.
- Memory — Includes a total of 94,208 bits of on-chip RAM for distributed memory and buffering needs.
- I/O Density — 274 user I/Os for high-pin-count applications and complex interface requirements.
- On‑Chip Non‑Volatile Memory & Reconfiguration — MachXO2 family features include user flash memory and TransFR reconfiguration for in-field logic updates and background programming.
- Programmable I/O Buffer — Family-level programmable sysIO buffer supports a wide range of interfaces and differential standards for flexible board-level interfacing.
- Low Power Architecture — Family-level ultra-low-power process and standby modes are part of the MachXO2 feature set, enabling lower idle power consumption.
- Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and analog PLLs is available across the MachXO2 family for varied timing requirements.
- Power and Thermal — Single-supply operation with a specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
- Package and Mounting — Supplied in a 332-ball FBGA / caBGA footprint (332-FBGA; supplier package: 332-CABGA, 17 × 17 mm), optimized for surface-mount assembly.
- Standards and Compliance — RoHS compliant for environmental compliance in commercial products.
Typical Applications
- Interface Bridging and Protocol Conversion — High I/O count and programmable I/O buffers let the device act as a bridge between heterogeneous interfaces and legacy peripherals.
- System Control and Glue Logic — Logic density and on-chip flash support complex state machines, control paths and configuration storage for embedded systems.
- Display and Synchronous I/O — Family-level pre-engineered source-synchronous I/O and gearing options support display timing and other source-synchronous interfaces.
- In-field Upgrades and Security — Non-volatile user flash and TransFR reconfiguration enable field updates and secure single-chip configuration strategies.
Unique Advantages
- Balanced Logic and I/O — 4,320 logic elements paired with 274 I/Os provide a balanced solution for mixed-signal control and high-pin-count designs.
- On‑Chip Memory for Local Storage — 94,208 bits of embedded RAM provide local buffering and small data-storage capability without external memory.
- Non‑Volatile Instant‑On — On-chip user flash enables instant-on operation and single-chip configuration storage for simplified system boot and reliability.
- Surface-Mount, High-Density Package — 332-ball caBGA/FBGA package enables compact board layouts while supporting large I/O counts.
- Commercial Temperature and Power Envelope — Defined supply range (1.14–1.26 V) and commercial operating temperature (0 °C to 85 °C) make the device suitable for mainstream embedded products.
- Regulatory Compliance — RoHS compliance supports environmental and manufacturing requirements for commercial products.
Why Choose LCMXO2-4000HE-4BG332C?
This MachXO2 device is positioned for designers seeking a reconfigurable, non-volatile FPGA with substantial I/O and mid-range logic capacity. Its combination of 4,320 logic elements, approximately 94 kbits of embedded RAM and 274 I/Os makes it well suited to control, interface and system glue roles in commercial embedded systems.
Choose this part for compact, surface-mount implementations that require in-field updates, instant-on configuration and a feature-rich FPGA architecture with family-level capabilities for low-power operation, flexible I/O and on-chip flash memory.
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