LCMXO2-4000HE-4BG256I

The LCMXO2-4000HE-4BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It combines a flexible logic fabric with on-chip memory and a broad complement of I/O to support control, glue-logic, interface bridging and configuration functions for embedded systems.

Designed for industrial-temperature operation and low-power applications, this device delivers 4,320 logic elements, 206 I/Os and 94,208 bits of on-chip RAM, packaged in a 256-ball LFBGA format suitable for space-constrained board designs.

Key Features

• Logic — 4,320 logic elements provide a compact, reconfigurable logic fabric for glue logic, protocol bridging and simple state machines.
• On-chip Memory — Total on-chip RAM of 94,208 bits (approximately 92 kbits) supports distributed and embedded memory usage for FIFOs, small buffers and control state.
• I/O Density and Flexibility — 206 I/Os in the 256-ball package enable multiple peripheral and bus interfaces directly on-chip, reducing external components.
• Power and Supply — Core voltage specified from 1.14 V to 1.26 V, and family-level low-power architecture with standby modes supports energy-efficient designs.
• Non‑volatile and Instant‑On (family capability) — MachXO2 family devices include on-chip user flash memory and instant-on capability for fast system bring-up and in-field reconfiguration.
• Clocking — Family features include flexible on-chip clocking and up to two analog PLLs for frequency synthesis and timing control.
• Package and Mounting — 256-LFBGA package (supplier package: 256-CABGA, 14×14) with surface-mount construction for compact board integration.
• Industrial Temperature Range — Rated for operation from -40°C to 100°C to support industrial and rugged embedded applications.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Industrial Control — Implement machine control logic, I/O aggregation and protocol translation while meeting extended temperature demands.
• Embedded System Glue Logic — Replace discrete logic and CPLDs with a single reconfigurable device to simplify boards and reduce component count.
• Interface Bridging — Consolidate multiple peripheral interfaces and buffering functions using abundant I/Os and on-chip memory.
• System Management and Configuration — Leverage non-volatile configuration and instant-on behavior (family feature) for fast boot and field updates.

Unique Advantages

• High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA enable rich peripheral connectivity without increasing board area.
• Reconfigurable Logic: 4,320 logic elements allow designers to consolidate glue logic, custom finite-state machines and protocol adapters into one device.
• On-chip Memory Resource: 94,208 bits of on-chip RAM provide local buffering and small data storage for deterministic embedded functions.
• Industrial Temperature Support: Rated from -40°C to 100°C for reliable operation in harsh and industrial environments.
• Low-power Family Architecture: Family-level low-power design and standby modes help reduce system idle power consumption.
• Compact, Surface-mount Package: 256-ball LFBGA (supplier 256-CABGA, 14×14) simplifies board layout while delivering high pin density.

Why Choose LCMXO2-4000HE-4BG256I?

The LCMXO2-4000HE-4BG256I targets embedded and industrial designs that require a balance of reconfigurable logic capacity, substantial I/O resources and on-chip memory in a compact surface-mount package. Its extended operating temperature range and low-power family characteristics make it appropriate for control, interface and system management roles where reliability and space are important.

For teams looking to reduce BOM complexity and consolidate multiple discrete functions into a single device, this MachXO2 family FPGA provides a practical, verifiable option with non-volatile configuration capabilities and flexible clocking and I/O support.

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