LCMXO2-4000HE-4BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 1,656 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-4BG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA
The LCMXO2-4000HE-4BG256C is a MachXO2 family FPGA from Lattice Semiconductor, offering a non-volatile, instant-on programmable fabric with on-chip memory and flexible I/O. This commercial-grade device provides a mid-density logic resource with embedded RAM and a high I/O count, suitable for designs that require configurable logic, in-field updates and compact BGA packaging.
With a supply range of 1.14 V to 1.26 V and an operating temperature of 0 °C to 85 °C, the device is optimized for low-power, instant-on applications where a single-chip, reconfigurable solution simplifies system design.
Key Features
- Logic Capacity Approximately 4,320 logic elements for implementing glue logic, state machines and user-defined digital functions.
- On-chip Memory Approximately 94,208 bits of total on-chip RAM to support distributed memory and small FIFOs; MachXO2 family devices also provide on-chip user flash memory options for non-volatile storage.
- High I/O Count 206 I/O pins available in the 256-LFBGA package, enabling broad connectivity for interfaces and peripherals.
- Flexible I/O and Interface Support Family-level features include programmable sysIO buffers supporting a wide range of standards and programmable differential I/Os; provides options for source-synchronous and DDR-style interfaces.
- Low Power and Instant-On Built on a low-power process with family-level standby modes and options to minimize power consumption; device supports instant-on, single-chip operation.
- Clocking and Timing Family features include multiple primary clocks and up to two PLLs per device for flexible clocking and fractional-n frequency synthesis.
- Non-volatile Reconfiguration On-chip flash and TransFR reconfiguration capability for in-field logic updates and secure single-chip solutions.
- Package and Mounting 256-LFBGA (supplier package: 256-CABGA, 14×14 mm) surface-mount package suitable for compact board layouts; commercial grade operating range 0 °C to 85 °C.
Typical Applications
- Interface Bridging and Glue Logic Use the device to implement signal adaptation, protocol bridging and custom control logic between system components, leveraging its high I/O count and flexible I/O buffer options.
- Embedded Control and System Management Deploy as a system controller for reset, clock control, and peripheral management with on-chip timers, counters and non-volatile configuration.
- Memory and Display Interfaces Support source-synchronous and DDR-style I/O needs with dedicated gearing and DDR register features found in the MachXO2 family.
- Field Updatable Logic Enable in-field updates and feature upgrades using the family’s TransFR reconfiguration and on-chip user flash memory capabilities.
Unique Advantages
- Non-volatile, Instant-On FPGA: Single-chip programmable solution that powers up quickly and retains configuration without external memory.
- High I/O Density in Compact Package: 206 I/Os in a 256-ball BGA footprint enables rich connectivity while minimizing PCB area.
- Embedded Memory Resources: Approximately 94 kbits of on-chip RAM to support distributed storage and FIFO control close to logic.
- Flexible Clocking and PLLs: Multiple primary clocks and PLL support allow designers to implement varied timing domains and frequency synthesis on-chip.
- Field Upgradeability: TransFR reconfiguration and on-chip flash support safe in-field logic updates without replacing hardware.
- Commercial-Grade Thermal Range: Rated for 0 °C to 85 °C operation to match common commercial electronic systems.
Why Choose LCMXO2-4000HE-4BG256C?
The LCMXO2-4000HE-4BG256C positions itself as a versatile, mid-density MachXO2 FPGA option that balances logic capacity, on-chip memory and a high I/O count in a compact 256-LFBGA package. Its non-volatile configuration, low-voltage supply and family-level low-power features make it suitable for designs that require instant-on behavior, in-field reprogrammability and flexible interface support.
Engineers building control, interface, or system management functions will find this device practical for reducing component count and simplifying BOMs while maintaining the ability to update logic in the field. The combination of embedded resources and commercial-grade operating parameters supports scalable deployments across a range of electronic products.
Request a quote or submit a pricing inquiry to get availability and lead-time information for LCMXO2-4000HE-4BG256C.

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