LCMXO2-4000HE-4BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 184 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-4BG332I – MachXO2 FPGA, 4320 logic elements, 274 I/Os, 332-FBGA
The LCMXO2-4000HE-4BG332I is an industrial-grade MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It combines 4,320 logic elements with 94,208 bits of on-chip RAM and up to 274 I/O pins in a 332-ball caBGA package (17 × 17 mm).
Designed for embedded control, interface bridging and system integration, this device delivers non-volatile, instant-on reconfigurability, a broad set of programmable I/O options and low standby power for space- and power-conscious designs. The device supports an operating range of 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity – 4,320 logic elements suitable for medium-density glue logic, control and interface functions.
- On-chip Memory – 94,208 bits of total RAM to support distributed and embedded memory requirements within designs.
- High I/O Count – 274 user I/Os available in a 332-FBGA package for dense external connectivity and multi-interface implementations.
- Package & Mounting – 332-ball caBGA (17 × 17 mm) surface-mount package for compact board integration.
- Power and Voltage – Single-supply operation with specified supply range of 1.14 V to 1.26 V to match system power rails.
- Temperature Grade – Industrial operating temperature range from −40 °C to 100 °C for demanding environments.
- Non-volatile, Reconfigurable – MachXO2 family features include on-chip user flash memory and instant-on behavior for single-chip, secure configurations and in-field updates.
- Low Power Options – Family-level low power architecture with microamp-level standby modes and other power-saving options referenced in the MachXO2 data sheet.
- Flexible I/O and Memory Interfaces – Family-level programmable sysIO support for a wide range of I/O standards and pre-engineered source-synchronous I/O including DDR, DDRX2/4 and display gearing (family features).
- System-level Functions – On-chip peripherals described for the family include SPI, I2C, timers/counters, on-chip oscillator and IEEE 1149.1 boundary-scan support.
- RoHS Compliant – Device meets RoHS environmental requirements.
Typical Applications
- Interface Bridging and Glue Logic – Use the device’s 274 I/Os and flexible sysIO buffer options to implement protocol translation and board-level interface consolidation.
- Embedded Control and Subsystem Integration – 4,320 logic elements and on-chip RAM enable control, timing and monitoring functions within industrial systems operating across −40 °C to 100 °C.
- Memory and Display Interface – Family-level pre-engineered DDR and display gearing features support source-synchronous memory and display timing functions.
- Secure Configuration and Field Updates – On-chip user flash and TransFR reconfiguration capabilities (family features) allow in-field logic updates and non-volatile configuration storage.
Unique Advantages
- High I/O density: 274 I/Os in a 332-FBGA package let you consolidate multiple external interfaces without adding external logic.
- Integrated memory resources: Approximately 94 kbits of on-chip RAM reduces reliance on external SRAM for many control and buffering tasks.
- Industrial robustness: Specified operation from −40 °C to 100 °C and industrial grade classification provide headroom for demanding environments.
- Instant-on, non-volatile operation: MachXO2 family on-chip flash and single-chip configuration enable secure, immediate startup and background programming options.
- Compact footprint: 332-ball caBGA (17 × 17 mm) surface-mount package balances high I/O count with a manageable PCB area.
- Standby power efficiency: Family-level low-power design options minimize standby consumption for energy-sensitive systems.
Why Choose LCMXO2-4000HE-4BG332I?
The LCMXO2-4000HE-4BG332I positions itself as a versatile, industrial-grade FPGA for designs that require a combination of medium-density logic, substantial I/O bandwidth and on-chip memory in a compact package. Its MachXO2 family features—non-volatile configuration, flexible I/O, and system-level peripherals—help simplify BOMs and accelerate system integration.
This device is well suited for engineers building embedded controllers, interface bridges and subsystem logic where in-field reconfiguration, compact footprint and industrial temperature operation are important. The combination of logic density, embedded RAM and large I/O count provides a scalable platform for evolving product requirements.
Request a quote or submit an inquiry for pricing and availability for the LCMXO2-4000HE-4BG332I to begin integrating this MachXO2 FPGA into your next design.

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