LCMXO2-4000HE-4BG332I

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 184 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-4BG332I – MachXO2 FPGA, 4320 logic elements, 274 I/Os, 332-FBGA

The LCMXO2-4000HE-4BG332I is an industrial-grade MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It combines 4,320 logic elements with 94,208 bits of on-chip RAM and up to 274 I/O pins in a 332-ball caBGA package (17 × 17 mm).

Designed for embedded control, interface bridging and system integration, this device delivers non-volatile, instant-on reconfigurability, a broad set of programmable I/O options and low standby power for space- and power-conscious designs. The device supports an operating range of 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity – 4,320 logic elements suitable for medium-density glue logic, control and interface functions.
  • On-chip Memory – 94,208 bits of total RAM to support distributed and embedded memory requirements within designs.
  • High I/O Count – 274 user I/Os available in a 332-FBGA package for dense external connectivity and multi-interface implementations.
  • Package & Mounting – 332-ball caBGA (17 × 17 mm) surface-mount package for compact board integration.
  • Power and Voltage – Single-supply operation with specified supply range of 1.14 V to 1.26 V to match system power rails.
  • Temperature Grade – Industrial operating temperature range from −40 °C to 100 °C for demanding environments.
  • Non-volatile, Reconfigurable – MachXO2 family features include on-chip user flash memory and instant-on behavior for single-chip, secure configurations and in-field updates.
  • Low Power Options – Family-level low power architecture with microamp-level standby modes and other power-saving options referenced in the MachXO2 data sheet.
  • Flexible I/O and Memory Interfaces – Family-level programmable sysIO support for a wide range of I/O standards and pre-engineered source-synchronous I/O including DDR, DDRX2/4 and display gearing (family features).
  • System-level Functions – On-chip peripherals described for the family include SPI, I2C, timers/counters, on-chip oscillator and IEEE 1149.1 boundary-scan support.
  • RoHS Compliant – Device meets RoHS environmental requirements.

Typical Applications

  • Interface Bridging and Glue Logic – Use the device’s 274 I/Os and flexible sysIO buffer options to implement protocol translation and board-level interface consolidation.
  • Embedded Control and Subsystem Integration – 4,320 logic elements and on-chip RAM enable control, timing and monitoring functions within industrial systems operating across −40 °C to 100 °C.
  • Memory and Display Interface – Family-level pre-engineered DDR and display gearing features support source-synchronous memory and display timing functions.
  • Secure Configuration and Field Updates – On-chip user flash and TransFR reconfiguration capabilities (family features) allow in-field logic updates and non-volatile configuration storage.

Unique Advantages

  • High I/O density: 274 I/Os in a 332-FBGA package let you consolidate multiple external interfaces without adding external logic.
  • Integrated memory resources: Approximately 94 kbits of on-chip RAM reduces reliance on external SRAM for many control and buffering tasks.
  • Industrial robustness: Specified operation from −40 °C to 100 °C and industrial grade classification provide headroom for demanding environments.
  • Instant-on, non-volatile operation: MachXO2 family on-chip flash and single-chip configuration enable secure, immediate startup and background programming options.
  • Compact footprint: 332-ball caBGA (17 × 17 mm) surface-mount package balances high I/O count with a manageable PCB area.
  • Standby power efficiency: Family-level low-power design options minimize standby consumption for energy-sensitive systems.

Why Choose LCMXO2-4000HE-4BG332I?

The LCMXO2-4000HE-4BG332I positions itself as a versatile, industrial-grade FPGA for designs that require a combination of medium-density logic, substantial I/O bandwidth and on-chip memory in a compact package. Its MachXO2 family features—non-volatile configuration, flexible I/O, and system-level peripherals—help simplify BOMs and accelerate system integration.

This device is well suited for engineers building embedded controllers, interface bridges and subsystem logic where in-field reconfiguration, compact footprint and industrial temperature operation are important. The combination of logic density, embedded RAM and large I/O count provides a scalable platform for evolving product requirements.

Request a quote or submit an inquiry for pricing and availability for the LCMXO2-4000HE-4BG332I to begin integrating this MachXO2 FPGA into your next design.

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