LCMXO2-4000HE-4FG484I

The LCMXO2-4000HE-4FG484I is a MachXO2 family FPGA offered by Lattice Semiconductor. This surface-mount, industrial-grade device delivers 4,320 logic elements, 94,208 bits of on-chip RAM and 278 I/O pins in a 484-ball BGA package.

Designed for control, glue logic and I/O-rich system functions, the device combines a flexible logic architecture with non-volatile configuration and on-chip resources that simplify system integration for industrial applications operating from -40 °C to 100 °C.

Key Features

• Logic Capacity — 4,320 logic elements provide a programmable fabric suitable for glue logic, control functions and moderate-density FPGA tasks.
• On-Chip Memory — Total on-chip RAM: 94,208 bits, supporting distributed and embedded memory requirements for FIFOs, buffering and small data stores.
• I/O Density & Flexibility — 278 user I/Os in a 484-ball BGA package (supplier device package: 484-FBGA (23×23)), enabling high pin-count system interfaces and board-level routing flexibility.
• Power Supply — Operates from a single core supply range of 1.14 V to 1.26 V, suitable for designs targeting the MachXO2 HE device family operating points.
• Temperature & Grade — Industrial-grade qualification with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Non-Volatile, Instant-On Architecture — Family-level MachXO2 features include non-volatile user flash and instant-on reconfiguration options for single-chip, secure system boot and field updates.
• System-Level Support — MachXO2 family offers hardened peripherals and features such as SPI, I2C and timer/counter functions to reduce external component count and simplify firmware development.
• Packaging — Available in a 484-BBGA package (Supplier Device Package listed as 484-FBGA (23x23)), supporting high I/O density in a compact footprint.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control — Implement machine control, sensor aggregation and interface bridging where industrial temperature range and robust I/O count are required.
• System Glue Logic — Consolidate multiple glue functions, protocol bridging and peripheral control to reduce BOM and board complexity.
• Memory and Interface Conditioning — Use the device’s programmable I/O and on-chip RAM for DDR/DDRx interface gating, buffering and timing logic in memory-adjacent systems (family-level I/O features support source-synchronous interfaces).
• Peripheral and Communication Interfaces — Implement SPI, I2C and custom serial interfaces using on-chip peripherals to manage sensors, peripherals and system management paths.

Unique Advantages

• High I/O Count: 278 user I/Os enable extensive board-level connectivity without external multiplexers or I/O expanders.
• Compact, High-Density Package: 484-ball BGA footprint (supplier package 484-FBGA (23×23)) provides high pin density in a compact form factor for space-constrained designs.
• Industrial Temperature Range: Rated for -40 °C to 100 °C to meet the environmental demands of industrial deployments.
• On-Chip Memory Resources: 94,208 bits of on-chip RAM support buffering, FIFOs and local data storage without external SRAM.
• Single-Supply Core Operation: Narrow core voltage range (1.14 V–1.26 V) simplifies power rail design for MachXO2 HE devices.
• Integrated System Functions: Family-level hardened SPI, I2C and timer/counter blocks reduce external components and speed integration.

Why Choose LCMXO2-4000HE-4FG484I?

The LCMXO2-4000HE-4FG484I balances moderate logic density with very high I/O capacity and on-chip memory, packaged for industrial use. Its combination of 4,320 logic elements, 94,208 bits of RAM and 278 I/Os makes it well-suited for designs that need substantial interface density, reliable non-volatile configuration and deployment across a wide temperature range.

This part is appropriate for engineers building industrial controllers, interface bridges and embedded systems that require integrated system functions (SPI, I2C, timers), reliable non-volatile operation and reduced BOM through on-chip resources drawn from the MachXO2 family.

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