LCMXO2-4000HC-6QN84I

IC FPGA 68 I/O 84QFN
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 68 94208 4320 84-VFQFN Dual Rows, Exposed Pad

Quantity 223 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package84-QFN (7x7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case84-VFQFN Dual Rows, Exposed PadNumber of I/O68Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HC-6QN84I – MachXO2 FPGA IC, 84-VFQFN

The LCMXO2-4000HC-6QN84I is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for flexible, non-volatile logic integration in industrial applications. This surface-mount device provides 4,320 logic elements, approximately 94 kbits of on-chip RAM, and 68 general-purpose I/Os in a compact 84-pin VFQFN (7 × 7 mm) package with an exposed pad. It targets control, glue-logic, and system-integration tasks where instant-on, reconfigurability, and a wide operating range are important.

Key Features

  • Core Logic — 4,320 logic elements suitable for complex glue logic, control functions and mid-density programmable logic tasks.
  • Embedded Memory — Approximately 94 kbits of on-chip RAM to support FIFOs, small buffers and state storage.
  • I/O Capacity & Flexibility — 68 I/Os with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL 2.5/1.8 and HSTL 1.8.
  • Non-Volatile, Instant-On — On-chip user Flash memory capability and single-chip non-volatile configuration enable instant-on behavior and in-field updates.
  • Power & Low-Power Modes — Designed on an advanced 65 nm low-power process with standby power as low as 22 μW and a single power supply operating range of 2.375 V to 3.465 V.
  • Clocking & PLL — Flexible on-chip clocking with multiple primary clocks and support for up to two analog PLLs per device for fractional-n frequency synthesis and wide input frequency range.
  • Reconfiguration & System Features — TransFR™ in-field reconfiguration, background programming options, on-chip SPI/I2C/JTAG interfaces, IEEE 1149.1 boundary scan and other system-level management functions.
  • Package & Temperature — 84-VFQFN dual-row package (84-QFN, 7 × 7 mm) with exposed pad, surface-mount mounting and industrial-grade operating temperature from -40 °C to 100 °C.
  • Compliance — RoHS compliant for environmental requirements.

Typical Applications

  • Industrial Control — Implement real-time glue logic, protocol bridging and sensor interfacing with durable operation across an industrial temperature range.
  • Display and Interface Bridging — Use pre-engineered source synchronous I/O and DDR gearing to support display interfaces and high-speed data lanes.
  • Embedded System Glue Logic — Replace multiple discrete components by integrating control, timers, and serial interfaces (SPI, I2C) into a single programmable device.
  • In-Field Upgradable Systems — Enable field updates and background programming for products that require remote or iterative feature enhancements.

Unique Advantages

  • Highly Integrated Solution: Combines 4,320 logic elements, embedded RAM and on-chip flash to reduce BOM and board area compared with multi-chip alternatives.
  • Flexible I/O Support: Programmable sysIO buffers and a broad list of supported signaling standards simplify interface design and enable mixed-signal connectivity.
  • Instant-On and Reconfigurable: Non-volatile configuration and TransFR™ reconfiguration support fast power-up and in-field updates without external configuration hardware.
  • Low Standby Power: Advanced low-power process and standby modes help minimize power draw in energy-sensitive systems.
  • Industrial Robustness: Specified for -40 °C to 100 °C operation and supplied in a compact 7 × 7 mm QFN with exposed pad for reliable thermal performance.
  • System-Level Support: On-chip SPI, I2C, timers and boundary-scan capability simplify system integration and diagnostics.

Why Choose LCMXO2-4000HC-6QN84I?

The LCMXO2-4000HC-6QN84I positions itself as a mid-density, non-volatile FPGA that balances logic capacity, embedded memory and flexible I/O in a compact industrial-grade package. Its combination of instant-on capability, in-field reconfiguration and broad interface support makes it well suited for engineers designing control systems, interface bridges, and embedded systems that benefit from reduced component count and flexible updates.

Designed for products requiring robust temperature tolerance, compact footprint and programmable system-level features, this device delivers practical scalability and long-term design flexibility backed by the MachXO2 family feature set.

Request a quote or submit a purchase inquiry for the LCMXO2-4000HC-6QN84I to begin integrating this MachXO2 FPGA into your next design.

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