LCMXO2-4000HC-6QN84I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 68 94208 4320 84-VFQFN Dual Rows, Exposed Pad |
|---|---|
| Quantity | 223 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-QFN (7x7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 84-VFQFN Dual Rows, Exposed Pad | Number of I/O | 68 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-6QN84I – MachXO2 FPGA IC, 84-VFQFN
The LCMXO2-4000HC-6QN84I is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for flexible, non-volatile logic integration in industrial applications. This surface-mount device provides 4,320 logic elements, approximately 94 kbits of on-chip RAM, and 68 general-purpose I/Os in a compact 84-pin VFQFN (7 × 7 mm) package with an exposed pad. It targets control, glue-logic, and system-integration tasks where instant-on, reconfigurability, and a wide operating range are important.
Key Features
- Core Logic — 4,320 logic elements suitable for complex glue logic, control functions and mid-density programmable logic tasks.
- Embedded Memory — Approximately 94 kbits of on-chip RAM to support FIFOs, small buffers and state storage.
- I/O Capacity & Flexibility — 68 I/Os with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL 2.5/1.8 and HSTL 1.8.
- Non-Volatile, Instant-On — On-chip user Flash memory capability and single-chip non-volatile configuration enable instant-on behavior and in-field updates.
- Power & Low-Power Modes — Designed on an advanced 65 nm low-power process with standby power as low as 22 μW and a single power supply operating range of 2.375 V to 3.465 V.
- Clocking & PLL — Flexible on-chip clocking with multiple primary clocks and support for up to two analog PLLs per device for fractional-n frequency synthesis and wide input frequency range.
- Reconfiguration & System Features — TransFR™ in-field reconfiguration, background programming options, on-chip SPI/I2C/JTAG interfaces, IEEE 1149.1 boundary scan and other system-level management functions.
- Package & Temperature — 84-VFQFN dual-row package (84-QFN, 7 × 7 mm) with exposed pad, surface-mount mounting and industrial-grade operating temperature from -40 °C to 100 °C.
- Compliance — RoHS compliant for environmental requirements.
Typical Applications
- Industrial Control — Implement real-time glue logic, protocol bridging and sensor interfacing with durable operation across an industrial temperature range.
- Display and Interface Bridging — Use pre-engineered source synchronous I/O and DDR gearing to support display interfaces and high-speed data lanes.
- Embedded System Glue Logic — Replace multiple discrete components by integrating control, timers, and serial interfaces (SPI, I2C) into a single programmable device.
- In-Field Upgradable Systems — Enable field updates and background programming for products that require remote or iterative feature enhancements.
Unique Advantages
- Highly Integrated Solution: Combines 4,320 logic elements, embedded RAM and on-chip flash to reduce BOM and board area compared with multi-chip alternatives.
- Flexible I/O Support: Programmable sysIO buffers and a broad list of supported signaling standards simplify interface design and enable mixed-signal connectivity.
- Instant-On and Reconfigurable: Non-volatile configuration and TransFR™ reconfiguration support fast power-up and in-field updates without external configuration hardware.
- Low Standby Power: Advanced low-power process and standby modes help minimize power draw in energy-sensitive systems.
- Industrial Robustness: Specified for -40 °C to 100 °C operation and supplied in a compact 7 × 7 mm QFN with exposed pad for reliable thermal performance.
- System-Level Support: On-chip SPI, I2C, timers and boundary-scan capability simplify system integration and diagnostics.
Why Choose LCMXO2-4000HC-6QN84I?
The LCMXO2-4000HC-6QN84I positions itself as a mid-density, non-volatile FPGA that balances logic capacity, embedded memory and flexible I/O in a compact industrial-grade package. Its combination of instant-on capability, in-field reconfiguration and broad interface support makes it well suited for engineers designing control systems, interface bridges, and embedded systems that benefit from reduced component count and flexible updates.
Designed for products requiring robust temperature tolerance, compact footprint and programmable system-level features, this device delivers practical scalability and long-term design flexibility backed by the MachXO2 family feature set.
Request a quote or submit a purchase inquiry for the LCMXO2-4000HC-6QN84I to begin integrating this MachXO2 FPGA into your next design.

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