LCMXO2-640HC-6SG48I

IC FPGA 40 I/O 48QFN
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 40 18432 640 48-VFQFN Exposed Pad

Quantity 925 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package48-QFN (7x7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case48-VFQFN Exposed PadNumber of I/O40Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LCMXO2-640HC-6SG48I – MachXO2 Field Programmable Gate Array (FPGA)

The LCMXO2-640HC-6SG48I is a MachXO2 family FPGA optimized for industrial embedded applications requiring moderate logic density and flexible I/O. It provides 640 logic elements, 40 user I/Os, and 18,432 bits of on-chip RAM in a 48-VFQFN exposed-pad surface-mount package.

As a member of the MachXO2 family, this device delivers family-level capabilities such as non-volatile user flash memory options, flexible I/O standards, instant-on behavior, and system-level peripherals that simplify interface bridging, control and glue-logic roles in industrial systems.

Key Features

  • Core Logic: Approximately 640 logic elements (cells) suitable for glue logic, control functions and modest combinational/sequential logic tasks.
  • On-chip Memory: 18,432 bits of total on-chip RAM. The MachXO2 family provides on-chip user flash memory options (the XO2-640 family member includes UFM as a family feature).
  • Flexible I/O: 40 user I/Os in a 48-VFQFN (48-QFN, 7 × 7 mm) exposed-pad package. The MachXO2 family supports a wide range of I/O standards and programmable buffer options for interface compatibility.
  • Power and Supply Range: Single-supply operation across 2.375 V to 3.465 V, with family-level ultra-low-power capabilities including micro-watt standby modes.
  • Clocking and Timing: Family-level flexible on-chip clocking with support for multiple primary clocks and analog PLLs in applicable devices for a range of timing architectures.
  • System Integration: Hardened functions at the system level (SPI, I2C, timer/counter, on-chip oscillator, and trace ID) to reduce external components and accelerate system design.
  • Reconfiguration and Non-volatile Operation: Instant-on, single-chip non-volatile configuration and in-field TransFR reconfiguration for background updates and flexible deployment.
  • Package and Reliability: Industrial-grade device with operating temperature from −40 °C to 100 °C, RoHS compliant, and surface-mount 48-VFQFN exposed-pad package for thermal performance and PCB assembly.

Typical Applications

  • Industrial Control: Use as glue logic, protocol bridging or local control in industrial systems leveraging industrial temperature rating and flexible I/O.
  • Interface Bridging: Implement custom interface translators and buffering between disparate buses and peripherals using the device’s programmable I/O modes.
  • Human-Machine Interfaces (HMIs): Drive user-interface logic and display interfacing where moderate logic density, fast configuration and system-level peripherals reduce BOM complexity.
  • Embedded System Glue Logic: Replace discrete glue components with a single-chip FPGA solution that integrates logic, memory and peripheral functions.

Unique Advantages

  • Moderate Logic Density in Small Package: 640 logic elements in a compact 48-VFQFN (7 × 7 mm) exposed-pad package enable space-constrained designs without sacrificing capability.
  • Broad I/O Flexibility: Forty user I/Os and MachXO2 family I/O programmability support numerous interface standards, reducing external transceiver requirements.
  • Non-volatile Instant-On: Single-chip non-volatile configuration enables fast power-up behavior and simplifies system boot sequencing.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C for deployment in industrial environments.
  • System-Level Integration: On-chip SPI/I2C/timer functions and oscillator reduce component count and speed integration of peripherals and control logic.
  • Field Reconfiguration: TransFR in-field reconfiguration capability supports in-system updates and iterative firmware/logic rollouts.

Why Choose LCMXO2-640HC-6SG48I?

The LCMXO2-640HC-6SG48I positions itself as a compact, industrial-grade FPGA option for designers who need a balance of logic capacity, flexible I/O and system-level integration in a small QFN footprint. Its combination of 640 logic elements, 40 I/Os, on-chip RAM and family-proven non-volatile configuration features make it well suited to embedded control, interface bridging and HMI applications.

Because it is part of the MachXO2 family, designers benefit from density migration options and family-level features that simplify scaling or moving to higher-density devices while preserving design investments.

Request a quote or submit a quote for LCMXO2-640HC-6SG48I to obtain pricing and availability for your next design.

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