LCMXO2-640ZE-1MG132C

IC FPGA 79 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 18432 640 132-LFBGA, CSPBGA

Quantity 185 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LCMXO2-640ZE-1MG132C – MachXO2 FPGA, 640 logic elements, 132‑LFBGA

The LCMXO2-640ZE-1MG132C is a MachXO2 family Field Programmable Gate Array (FPGA) offered in a 132‑ball LFBGA (8×8) package for surface-mount applications. It combines 640 logic elements with 18,432 bits of total on-chip RAM and up to 79 I/O pins to address control, interface and glue-logic functions in commercial embedded designs.

Built on an advanced 65 nm low-power process, this device provides non-volatile, instant-on configuration and flexible I/O and memory options that simplify system integration while minimizing standby power and board-level components.

Key Features

  • Core Logic  640 logic elements (cells) suitable for glue logic, interface bridging and control functions.
  • On‑chip Memory  Approximately 18,432 bits of total RAM (EBR SRAM) for small buffering and state storage; on-chip user flash memory available in the MachXO2 family for configuration and user data.
  • I/O Capability  79 available I/Os with programmable sysIO buffer options and on‑chip differential termination to support a wide range of interfaces and signaling standards.
  • Power  Designed on a low‑power 65 nm process with ultra low standby power options; device VCC range listed at 1.14 V to 1.26 V for the ZE device family.
  • Clocking and Timing  Family-level support for multiple primary clocks and on-chip oscillator; fractional-N PLLs are provided on select family members to support flexible clocking.
  • Non‑volatile Configuration  MachXO2 devices are non-volatile and support instant-on operation and in-field reconfiguration through JTAG, SPI or I²C interfaces.
  • Embedded Peripherals  Family-level hardened functions such as SPI, I²C and timer/counter blocks simplify system-level tasks and reduce external components.
  • Package & Temperature  132‑LFBGA (CSPBGA) package, surface-mount mounting type; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Interface Bridging  Use the device to implement protocol conversion and glue logic between legacy and modern peripherals, leveraging flexible I/O standards and on-chip memory for buffering.
  • System Control  Embed control and sequencing functions (timers, state machines) using the logic elements and on-chip flash for non-volatile configuration storage.
  • Display and Memory Interfaces  Employ the family’s source-synchronous I/O and DDR support for display drive or memory interface gating in compact systems.
  • User Interfaces  Implement button, LED, and simple human‑machine interface logic with reduced external component count using the device’s I/O flexibility and embedded peripherals.

Unique Advantages

  • Compact, Surface‑Mount Package: The 132‑LFBGA (8×8) CSP package provides a small footprint and up to 79 I/Os for space-constrained boards.
  • Non‑volatile Instant‑On: MachXO2 family instant-on capability and on-chip user flash simplify startup and remove the need for external configuration memory.
  • Low Power Operation: Advanced 65 nm low-power process and standby modes reduce system idle power draw for battery or always‑on applications.
  • Flexible I/O Support: Programmable sysIO buffer and on-chip differential termination support a wide range of signaling standards to minimize external level‑shifting components.
  • Embedded Peripherals: On‑chip SPI, I²C and timer/counter functions lower BOM and simplify common embedded tasks.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for standard commercial embedded applications.

Why Choose LCMXO2-640ZE-1MG132C?

This MachXO2 ZE‑series device combines 640 logic elements, embedded SRAM (≈18 kbits), and flexible I/O in a compact 132‑LFBGA package to deliver a highly integrated solution for control, interface and glue‑logic roles. Its non‑volatile instant-on behavior, low-power characteristics and on‑chip peripheral functions reduce external components and simplify board-level design.

Choose this part when you need a commercially rated, surface‑mount FPGA that balances small footprint, moderate logic capacity and versatile I/O for embedded systems, display interfaces, and peripheral management. The MachXO2 family-level features provide scalability and configuration options to support evolving design requirements.

Request a quote or submit a product inquiry to obtain pricing, availability and lead-time information for the LCMXO2-640ZE-1MG132C.

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