LCMXO2-640ZE-1MG132C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 18432 640 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 185 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of LCMXO2-640ZE-1MG132C – MachXO2 FPGA, 640 logic elements, 132‑LFBGA
The LCMXO2-640ZE-1MG132C is a MachXO2 family Field Programmable Gate Array (FPGA) offered in a 132‑ball LFBGA (8×8) package for surface-mount applications. It combines 640 logic elements with 18,432 bits of total on-chip RAM and up to 79 I/O pins to address control, interface and glue-logic functions in commercial embedded designs.
Built on an advanced 65 nm low-power process, this device provides non-volatile, instant-on configuration and flexible I/O and memory options that simplify system integration while minimizing standby power and board-level components.
Key Features
- Core Logic 640 logic elements (cells) suitable for glue logic, interface bridging and control functions.
- On‑chip Memory Approximately 18,432 bits of total RAM (EBR SRAM) for small buffering and state storage; on-chip user flash memory available in the MachXO2 family for configuration and user data.
- I/O Capability 79 available I/Os with programmable sysIO buffer options and on‑chip differential termination to support a wide range of interfaces and signaling standards.
- Power Designed on a low‑power 65 nm process with ultra low standby power options; device VCC range listed at 1.14 V to 1.26 V for the ZE device family.
- Clocking and Timing Family-level support for multiple primary clocks and on-chip oscillator; fractional-N PLLs are provided on select family members to support flexible clocking.
- Non‑volatile Configuration MachXO2 devices are non-volatile and support instant-on operation and in-field reconfiguration through JTAG, SPI or I²C interfaces.
- Embedded Peripherals Family-level hardened functions such as SPI, I²C and timer/counter blocks simplify system-level tasks and reduce external components.
- Package & Temperature 132‑LFBGA (CSPBGA) package, surface-mount mounting type; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Interface Bridging Use the device to implement protocol conversion and glue logic between legacy and modern peripherals, leveraging flexible I/O standards and on-chip memory for buffering.
- System Control Embed control and sequencing functions (timers, state machines) using the logic elements and on-chip flash for non-volatile configuration storage.
- Display and Memory Interfaces Employ the family’s source-synchronous I/O and DDR support for display drive or memory interface gating in compact systems.
- User Interfaces Implement button, LED, and simple human‑machine interface logic with reduced external component count using the device’s I/O flexibility and embedded peripherals.
Unique Advantages
- Compact, Surface‑Mount Package: The 132‑LFBGA (8×8) CSP package provides a small footprint and up to 79 I/Os for space-constrained boards.
- Non‑volatile Instant‑On: MachXO2 family instant-on capability and on-chip user flash simplify startup and remove the need for external configuration memory.
- Low Power Operation: Advanced 65 nm low-power process and standby modes reduce system idle power draw for battery or always‑on applications.
- Flexible I/O Support: Programmable sysIO buffer and on-chip differential termination support a wide range of signaling standards to minimize external level‑shifting components.
- Embedded Peripherals: On‑chip SPI, I²C and timer/counter functions lower BOM and simplify common embedded tasks.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for standard commercial embedded applications.
Why Choose LCMXO2-640ZE-1MG132C?
This MachXO2 ZE‑series device combines 640 logic elements, embedded SRAM (≈18 kbits), and flexible I/O in a compact 132‑LFBGA package to deliver a highly integrated solution for control, interface and glue‑logic roles. Its non‑volatile instant-on behavior, low-power characteristics and on‑chip peripheral functions reduce external components and simplify board-level design.
Choose this part when you need a commercially rated, surface‑mount FPGA that balances small footprint, moderate logic capacity and versatile I/O for embedded systems, display interfaces, and peripheral management. The MachXO2 family-level features provide scalability and configuration options to support evolving design requirements.
Request a quote or submit a product inquiry to obtain pricing, availability and lead-time information for the LCMXO2-640ZE-1MG132C.