LCMXO256C-3MN100I

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 447 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256C-3MN100I – MachXO Field Programmable Gate Array (FPGA) IC

The LCMXO256C-3MN100I is a MachXO family FPGA optimized for glue logic, bus interfacing, power-up control and compact control tasks. It combines non-volatile configuration, instant-on capability and a compact logic fabric—providing a single-chip programmable solution for industrial applications.

With 256 logic elements and 78 I/O pins in a 100-ball LFBGA/CSPBGA package, this device targets designs that require rapid startup, flexible I/O and industrial temperature operation while minimizing external components.

Key Features

  • Non-volatile, instant-on configuration  Single-chip non-volatile architecture enables power-up in microseconds without external configuration memory.
  • Reconfigurable logic  Infinitely reconfigurable fabric supports in-field updates; SRAM-based logic can be reconfigured in milliseconds and non-volatile memory can be programmed through JTAG.
  • Low-power modes  Sleep mode capability reduces static current by up to 100× for power-sensitive designs.
  • TransFR™ in-field reconfiguration  Supports background logic updates while the system remains operational for minimal downtime.
  • Logic density  Approximately 256 logic elements (LUTs) provide compact programmable logic for glue logic and control functions.
  • I/O and package  78 available I/Os in a 100-LFBGA / 100-CSBGA (8×8 mm) package for high pin-to-logic density in compact board layouts.
  • Flexible I/O standards  Programmable I/O buffer support for multiple interface standards (including various LVCMOS levels, LVTTL, PCI, LVDS family) to simplify board-level interface design.
  • Voltage and temperature range  Supports a wide supply range from 1.71 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C.
  • Embedded and distributed memory (family)  The MachXO family includes distributed RAM capability; the family datasheet lists approximately 2.0 Kbits of distributed RAM for the LCMXO256 member.
  • System support  Includes IEEE 1149.1 boundary scan and supports in-system programming (IEEE 1532) and JTAG-based memory programming.

Typical Applications

  • Glue logic and bus bridging  Implement address decoding, bus arbitration and interface translation in compact systems where rapid startup and reconfigurability are required.
  • Power-up and system control  Use instant-on configuration for power sequencing, reset management and supply monitoring in industrial equipment.
  • Peripheral and sensor interfacing  Flexible I/O and multiple supported standards enable direct interfacing with sensors, memory and peripheral buses.
  • Embedded control and state machines  Deploy compact control logic and deterministic state-machine implementations with low BOM impact.

Unique Advantages

  • Single-chip non-volatile solution: Reduces BOM and removes the need for external configuration memory by storing configuration on-chip.
  • Fast system availability: Instant-on capability enables microsecond-scale startup for applications that require immediate operation after power-up.
  • Field reprogrammability: TransFR and JTAG access allow in-field updates and background programming without removing the device from the system.
  • Compact, high pin-to-logic density: 78 I/Os with ~256 logic elements in a 100-ball BGA package supports dense designs in space-constrained boards.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and available in RoHS-compliant packaging suitable for industrial environments.
  • Flexible power and I/O support: Wide supply range (1.71 V–3.465 V) and programmable I/O standards simplify integration across voltage domains.

Why Choose LCMXO256C-3MN100I?

The LCMXO256C-3MN100I positions itself as a compact, industrial-grade programmable device for designs that need instant-on behavior, reliable non-volatile configuration, and flexible I/O in a small BGA footprint. It is well suited for engineers replacing discrete glue logic or adding adaptable control and interface functions while minimizing component count.

Backed by MachXO family architecture and ispLEVER design tool support (as described in the family datasheet), this device offers a practical path for scalable development, on-site reprogramming and long-term maintenance in embedded systems.

If you would like pricing information, a lead-time estimate or to request a quote for LCMXO256C-3MN100I, submit your request or inquiry and our team will respond with the next steps.

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