LCMXO2280E-5TN144C

The LCMXO2280E-5TN144C is a MachXO family field programmable gate array (FPGA) offering a non-volatile, instant-on single-chip architecture optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. The device integrates 2,280 logic elements with on-chip RAM and flexible programmable I/O in a 144-pin LQFP package for commercial temperature range designs.

Built for applications that require reconfigurable logic with low integration overhead, the MachXO family combines FPGA-like LUT-based logic with non-volatile configuration and system-level features such as boundary scan and in-system programming.

Key Features

• Logic Capacity — 2,280 logic elements for implementing glue logic, control state machines, and low-to-medium density FPGA tasks.
• On‑Chip Memory — Total on-chip RAM of 28,262 bits to support distributed memory and small embedded data stores.
• I/O — 113 user I/Os available in the 144-LQFP package for flexible peripheral and bus interfacing.
• Programmable I/O Buffer — Family-level sysIO buffer options support a wide range of interface standards (examples listed in the MachXO family datasheet), enabling diverse connectivity and signaling options.
• Non-Volatile, Instant-On Architecture — MachXO family devices provide single-chip non-volatile configuration that powers up rapidly and does not require external configuration memory.
• In-Field Reconfiguration — Supports TransFR reconfiguration for in-field logic updates while the system operates and background programming of non-volatile memory.
• Power — Operates with a core supply range of 1.14 V to 1.26 V and includes sleep mode functionality for substantial static current reduction.
• Package & Temperature — Available in a 144-LQFP (supplier package 144-TQFP, 20×20 mm) with a commercial operating temperature range of 0 °C to 85 °C.
• System-Level Support — Includes features from the MachXO family such as IEEE 1149.1 boundary scan, JTAG programming and in-system programming capabilities.
• Compliance — Lead-free / RoHS compliant.

Typical Applications

• Glue Logic and Board-Level Control — Implement address decoding, bus arbitration and control-state machines with compact, reconfigurable logic.
• Bus Bridging and Interfacing — Map and buffer signals between different buses or voltage domains using the device’s flexible I/O and programmable buffers.
• Power-Up and Reset Management — Centralize startup sequencing and power-control supervision leveraging non-volatile configuration and instant-on behavior.
• Embedded Control Logic — Replace discrete hand-wired logic for user interfaces, device control, and protocol translation with a single integrated FPGA device.

Unique Advantages

• Single-Chip Non-Volatile Design: Eliminates the need for external configuration memory and enables rapid power-up.
• Instant-On Behavior: Powers up in microseconds to support applications where fast availability is important.
• Flexible, High I/O Count: 113 user I/Os in a 144-LQFP package allow dense pin utilization for mid-range embedded systems.
• In-Field Reconfiguration: TransFR and background programming permit updates to non-volatile logic without removing the device from the system.
• Low-Power Modes: Sleep mode enables significant reductions in static current for power-sensitive applications.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and supplied in RoHS-compliant packaging for mainstream electronics.

Why Choose LCMXO2280E-5TN144C?

The LCMXO2280E-5TN144C positions itself as a compact, non-volatile FPGA solution for designers who need instant-on reconfigurable logic with a balanced mix of logic capacity, on-chip memory, and I/O in a standard 144-LQFP package. It is well-suited for engineers implementing board-level control, interface bridging, and power-up sequencing where single-chip integration and flexibility reduce BOM complexity.

Leveraging MachXO family capabilities—such as in-system programming, reconfiguration, and a broad programmable I/O model—this device supports scalable design approaches and in-field updates while meeting commercial temperature and RoHS requirements.

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