LCMXO256C-4M100C

IC FPGA 78 I/O 100CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

Quantity 1,511 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LFBGA, CSPBGANumber of I/O78Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO256C-4M100C – MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA

The LCMXO256C-4M100C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines instant-on, single-chip configuration with a compact 100-ball LFBGA/csBGA package and a flexible I/O set—making it suited for space- and board-constrained commercial embedded designs.

This device provides 256 logic elements across 32 logic blocks, up to 78 I/Os, support for a wide supply voltage range, and commercial-grade operating conditions to meet typical embedded system requirements.

Key Features

  • Non-volatile instant-on — Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory.
  • Reconfigurable architecture — Supports in-field reconfiguration and background programming of non-volatile memory through JTAG, enabling updates while systems are in operation.
  • Logic resources — 256 logic elements implemented across 32 logic blocks for glue logic, state machines, and control functions.
  • I/O density and flexibility — 78 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling (family-level support).
  • Embedded and distributed memory — Family documentation indicates distributed RAM resources for implementing small FIFOs and state storage; on-chip non-volatile memory stores configuration without external flash.
  • Low-power modes — Sleep mode provides significant static current reduction for power-sensitive designs.
  • System-level features — JTAG boundary-scan and on-board oscillator support simplifies board-level integration and testing.
  • Package and mounting — Surface-mount 100-LFBGA / csBGA (100-ball, 8×8 mm supplier package) for compact board layouts.
  • Power and temperature — Operates from 1.71 V to 3.465 V and rated for commercial temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Glue Logic and Bus Bridging — Implement protocol adaptation, bus interfacing and timing control using the device’s programmable logic and flexible I/O.
  • Power-Up and Reset Control — Instant-on, single-chip configuration and on-board oscillator simplify power sequencing and system initialization tasks.
  • Control Logic and State Machines — Compact logic resource set supports control paths, finite state machines, and peripheral management in embedded systems.
  • Field Upgrades — In-field reconfiguration features allow logic updates and bug fixes without external configuration memory or extended downtime.

Unique Advantages

  • Single-chip configuration: Eliminates the need for external configuration memory, reducing BOM and simplifying board design.
  • Instant-on behavior: Powers up in microseconds for faster system availability and simplified startup sequences.
  • Flexible I/O signaling: Broad sysIO buffer options enable interface compatibility across multiple voltage standards and differential signaling families.
  • Field reprogrammability: Background programming and TransFR reconfiguration enable updates while preserving system operation.
  • Compact package: 100-ball LFBGA/csBGA packaging supports high pin count in a small footprint for board-constrained applications.
  • Commercial-grade qualification: Rated 0 °C to 85 °C and RoHS compliant for mainstream embedded product deployments.

Why Choose LCMXO256C-4M100C?

The LCMXO256C-4M100C offers a balanced mix of non-volatile instant-on convenience, reconfigurability, and compact packaging for commercial embedded designs that require reliable glue logic, bus interfacing, or control logic. With 256 logic elements, 78 I/Os, a wide supply voltage range, and family-level I/O signaling support, it is well suited for space-constrained boards and systems that need in-field update capability and simplified power-up behavior.

Its single-chip configuration approach reduces component count and simplifies system integration, while RoHS compliance and commercial temperature ratings make it appropriate for a broad range of commercial embedded applications backed by the MachXO family feature set.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO256C-4M100C.

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