LCMXO256C-4M100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,511 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LFBGA, CSPBGA | Number of I/O | 78 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO256C-4M100C – MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA
The LCMXO256C-4M100C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines instant-on, single-chip configuration with a compact 100-ball LFBGA/csBGA package and a flexible I/O set—making it suited for space- and board-constrained commercial embedded designs.
This device provides 256 logic elements across 32 logic blocks, up to 78 I/Os, support for a wide supply voltage range, and commercial-grade operating conditions to meet typical embedded system requirements.
Key Features
- Non-volatile instant-on — Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory.
- Reconfigurable architecture — Supports in-field reconfiguration and background programming of non-volatile memory through JTAG, enabling updates while systems are in operation.
- Logic resources — 256 logic elements implemented across 32 logic blocks for glue logic, state machines, and control functions.
- I/O density and flexibility — 78 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling (family-level support).
- Embedded and distributed memory — Family documentation indicates distributed RAM resources for implementing small FIFOs and state storage; on-chip non-volatile memory stores configuration without external flash.
- Low-power modes — Sleep mode provides significant static current reduction for power-sensitive designs.
- System-level features — JTAG boundary-scan and on-board oscillator support simplifies board-level integration and testing.
- Package and mounting — Surface-mount 100-LFBGA / csBGA (100-ball, 8×8 mm supplier package) for compact board layouts.
- Power and temperature — Operates from 1.71 V to 3.465 V and rated for commercial temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Glue Logic and Bus Bridging — Implement protocol adaptation, bus interfacing and timing control using the device’s programmable logic and flexible I/O.
- Power-Up and Reset Control — Instant-on, single-chip configuration and on-board oscillator simplify power sequencing and system initialization tasks.
- Control Logic and State Machines — Compact logic resource set supports control paths, finite state machines, and peripheral management in embedded systems.
- Field Upgrades — In-field reconfiguration features allow logic updates and bug fixes without external configuration memory or extended downtime.
Unique Advantages
- Single-chip configuration: Eliminates the need for external configuration memory, reducing BOM and simplifying board design.
- Instant-on behavior: Powers up in microseconds for faster system availability and simplified startup sequences.
- Flexible I/O signaling: Broad sysIO buffer options enable interface compatibility across multiple voltage standards and differential signaling families.
- Field reprogrammability: Background programming and TransFR reconfiguration enable updates while preserving system operation.
- Compact package: 100-ball LFBGA/csBGA packaging supports high pin count in a small footprint for board-constrained applications.
- Commercial-grade qualification: Rated 0 °C to 85 °C and RoHS compliant for mainstream embedded product deployments.
Why Choose LCMXO256C-4M100C?
The LCMXO256C-4M100C offers a balanced mix of non-volatile instant-on convenience, reconfigurability, and compact packaging for commercial embedded designs that require reliable glue logic, bus interfacing, or control logic. With 256 logic elements, 78 I/Os, a wide supply voltage range, and family-level I/O signaling support, it is well suited for space-constrained boards and systems that need in-field update capability and simplified power-up behavior.
Its single-chip configuration approach reduces component count and simplifies system integration, while RoHS compliance and commercial temperature ratings make it appropriate for a broad range of commercial embedded applications backed by the MachXO family feature set.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO256C-4M100C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016