LCMXO256E-5M100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 78 256 100-LFBGA, CSPBGA |
|---|---|
| Quantity | 583 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LFBGA, CSPBGA | Number of I/O | 78 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO256E-5M100C – MachXO FPGA, 256 Logic Elements, 78 I/O, 100-LFBGA
The LCMXO256E-5M100C is a MachXO family field-programmable gate array (FPGA) in a 100-ball LFBGA/CSPBGA package, designed for compact, reconfigurable glue logic and control applications. It delivers 256 logic elements with up to 78 I/O pins in a surface-mount, commercial-grade device optimized for instant-on, single-chip configuration and flexible I/O integration.
Built on the MachXO architecture, this device targets bus interfacing, power-up control and general control-logic roles where fast startup, in-field reconfiguration and a small form factor reduce system complexity and bill-of-materials.
Key Features
- 256 Logic Elements Provides the programmable logic capacity for glue logic, bus bridging and control tasks.
- 78 I/O Pins High pin count for compact packages, enabling broad interfacing and signal routing in small form-factor designs.
- Non-volatile, Instant-on Architecture MachXO family features instant-on operation with single-chip configuration and no external configuration memory required.
- In-field Reconfiguration Supports TransFR™ reconfiguration for updating SRAM-based logic while the system operates and background programming of non-volatile memory.
- Programmable I/O Support Family-level programmable I/O buffers enable a wide range of interface types and voltage standards, aiding mixed-signal and mixed-voltage designs.
- Sleep Mode Family-level sleep mode provides significant static current reduction for low-power standby operation.
- Package and Mounting Available in a 100-LFBGA (100-CSBGA, 8×8) surface-mount package to support compact board layouts and automated assembly.
- Supply and Thermal Operates within a 1.14 V to 1.26 V supply range and is specified for commercial operating temperatures from 0 °C to 85 °C.
- Compliance RoHS-compliant packaging supports contemporary manufacturing and environmental requirements.
Typical Applications
- Glue Logic and Signal Conditioning Implement combinatorial and small-scale sequential logic to consolidate discrete logic devices and simplify PCB routing.
- Bus Bridging and Interfacing Bridge between bus standards and manage protocol translation with flexible I/O and ample pin availability.
- Power-up and System Control Manage power sequencing, reset logic and startup control with instant-on capability for rapid system availability.
- Control Logic Implement board-level control, monitoring and peripheral orchestration in compact, low-cost systems.
Unique Advantages
- Single-chip, instant-on configuration: Eliminates external configuration memory and delivers microsecond-class startup for faster system readiness.
- In-field programmability: Background programming and TransFR reconfiguration enable updates and fixes without prolonged downtime.
- Flexible I/O and compact package: 78 I/Os in a 100-ball CSPBGA/LFBGA let you integrate multiple interfaces while keeping board area small.
- Low-power standby: Sleep mode provides substantial static current reduction for lower system idle power.
- Commercial-grade predictability: Specified for 0 °C to 85 °C operation and RoHS-compliant packaging for standard commercial product lifecycles.
Why Choose LCMXO256E-5M100C?
The LCMXO256E-5M100C combines MachXO family non-volatile architecture, instant-on behavior and in-field reconfiguration in a compact 100-ball BGA package, making it a focused solution for designers who need reliable glue logic, bus interfacing and system control in space-constrained designs. Its 256 logic elements and 78 I/Os provide the right balance of capacity and connectivity for low- to mid-complexity embedded tasks.
With single-chip configuration, programmable I/O flexibility and support for background programming, this device helps reduce component count and simplify design iterations while maintaining the commercial-grade operating range required for mainstream electronics products.
Request a quote or submit a procurement inquiry to receive pricing, availability and order support for the LCMXO256E-5M100C.