LCMXO3D-4300HC-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 206 94208 4300 256-LFBGA

Quantity 1,403 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCN5A992CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-5BG256C – MachXO3D Field Programmable Gate Array (FPGA) IC 206 94208 4300 256-LFBGA

The LCMXO3D-4300HC-5BG256C is a MachXO3D family Field Programmable Gate Array (FPGA) offered in a 256-ball LFBGA package. It combines a reconfigurable logic fabric with embedded memory and a high I/O count to address system integration, interface bridging, and control tasks in commercial electronic designs.

Built for flexibility, this device provides 4,300 logic elements, approximately 94,208 bits of embedded RAM, and 206 user I/O pins, while supporting a supply voltage range of 2.375 V to 3.465 V and commercial operating temperatures from 0 °C to 85 °C.

Key Features

  • Logic Fabric 4,300 logic elements (cells) for implementing glue logic, state machines, and custom combinational/sequential functions.
  • Embedded Memory 94,208 bits of on-chip RAM (approximately 0.09 Mbits) for FIFOs, buffering, and small data storage requirements.
  • High I/O Count 206 user I/O pins supporting flexible interfacing and parallel connectivity to peripherals and system buses.
  • Non-volatile, Reconfigurable MachXO3D family supports non-volatile configuration and on-chip user flash memory (UFM) for persistent configuration and data storage.
  • Dedicated Embedded Security Block Family-level embedded security features provide a hardware foundation for device protection and secure functions.
  • Flexible I/O and Clocking Family features include pre‑engineered source-synchronous I/O, flexible on-chip clocking, and PLL support for system timing needs.
  • Package and Mounting 256-LFBGA package (supplier device package: 256-CABGA, 14×14) designed for surface-mount assembly.
  • Power and Operating Range Supported supply voltage range: 2.375 V to 3.465 V. Commercial operating temperature: 0 °C to 85 °C.
  • Regulatory RoHS-compliant.

Typical Applications

  • Interface Bridging and I/O Expansion Use the 206 I/O pins and flexible I/O buffering to bridge disparate interfaces or expand system I/O without major board redesign.
  • System Glue Logic Implement custom control, sequencing, and glue logic with 4,300 logic elements to consolidate discrete components and simplify BOM.
  • Embedded Memory-Backed Functions Leverage approximately 94 Kbits of embedded RAM for FIFOs, small buffers, and transient data storage in data-path and control applications.
  • Secure Configuration and Storage Use the family’s embedded security block and UFM capabilities to store configuration data and support device-level security functions.

Unique Advantages

  • High I/O Density: 206 I/O pins enable extensive peripheral and bus connectivity, reducing the need for additional I/O expanders.
  • Compact, Surface-Mount Package: 256-LFBGA (14×14 CABGA) provides a small footprint for space-constrained PCBs while supporting high pin counts.
  • Non-volatile Reconfiguration: Built-in non-volatile configuration and UFM support stable startup behavior and persistent storage of configuration data.
  • Integrated Memory Resources: On-chip RAM simplifies implementation of buffering and FIFO functions without external memory components.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic applications.
  • RoHS Compliance: Environmentally compliant manufacturing supports regulatory requirements for many commercial products.

Why Choose LCMXO3D-4300HC-5BG256C?

The LCMXO3D-4300HC-5BG256C positions itself as a flexible, reconfigurable solution for designers needing a balance of logic capacity, embedded memory, and high I/O count in a compact surface-mount package. Its MachXO3D family features—such as non‑volatile configuration, embedded security block, and flexible I/O/clocking—make it suitable for system glue logic, interface bridging, and localized control tasks in commercial products.

This device is suited to engineers and procurement teams seeking a commercially graded FPGA with on-chip RAM and extensive I/O for consolidating functions, reducing external components, and shortening design cycles while retaining reconfigurability and persistent configuration options.

Request a quote or submit a request for pricing and availability to evaluate the LCMXO3D-4300HC-5BG256C for your design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up