LCMXO3D-4300HC-5SG72I

IC FPGA 58 I/O 72QFN
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad

Quantity 817 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package72-QFN (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case72-VFQFN Exposed PadNumber of I/O58Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-5SG72I – MachXO3D Field Programmable Gate Array (FPGA) IC, 4,300 Logic Elements

The LCMXO3D-4300HC-5SG72I is a MachXO3D family FPGA from Lattice Semiconductor Corporation. This non-volatile, reconfigurable device combines on-chip programmable logic, embedded memory and hardened system IP to support control, interface and security functions in compact board-level designs.

Designed for industrial environments, the device delivers 4,300 logic elements, 58 general-purpose I/Os and a broad supply and temperature range to support embedded control, I/O bridging and system management tasks where integration, configurability and reliability are required.

Key Features

  • Programmable Logic — 4,300 logic elements for implementing glue logic, protocol bridges, finite state machines and control functions.
  • Embedded Memory — Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for small buffers, FIFOs and state storage.
  • I/O Capacity & Flexibility — 58 I/Os with pre‑engineered source-synchronous and flexible I/O buffer support for diverse interface requirements.
  • Power and Voltage — Operates from 2.375 V to 3.465 V to match common board power rails.
  • Industrial Grade Temperature — Qualified to operate from −40 °C to 100 °C for use in industrial applications.
  • Package — 72‑VFQFN exposed pad package (72‑QFN, 10×10 mm) for a compact board footprint and thermal performance.
  • Embedded Hardened IP — Includes dedicated blocks such as an Embedded Security Block and hardened peripherals (I2C, SPI, timer/counter) to simplify system integration.
  • Clocking & Configuration — Flexible on-chip clocking with PLLs, on-chip oscillator, TransFR reconfiguration and user flash memory (UFM) for system configuration and updates.
  • System-Level Support — Features for boundary-scan testability, standby and power-saving modes to assist board-level validation and low-power operation.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement control logic, protocol conversion and I/O handling with the device’s industrial temperature rating and flexible I/O.
  • Secure Embedded Systems — Use the Embedded Security Block and hardened peripherals for system authentication, secure boot controllers and protected configuration storage.
  • Interface Bridging and Glue Logic — Replace discrete logic for bus bridging, level translation and peripheral aggregation using the programmable logic and on-chip memory.
  • Board-Level System Management — Implement reset management, configuration sequencers and monitoring functions leveraging UFM, on-chip oscillator and timers.

Unique Advantages

  • Non‑volatile, reconfigurable logic: Enables field updates and persistent functionality without external configuration memory.
  • Compact, thermally aware package: 72‑VFQFN with exposed pad offers a small footprint and board-level thermal path for industrial designs.
  • Integrated security and hardened IP: Reduces the need for external secure controllers and simplifies implementation of protected functions.
  • Wide operating range: 2.375 V–3.465 V supply support and −40 °C to 100 °C operation align with common industrial power rails and ambient conditions.
  • Balanced I/O and memory resources: 58 I/Os with built-in memory (≈0.094 Mbits) to support buffering and interface timing without large external RAM.

Why Choose LCMXO3D-4300HC-5SG72I?

The LCMXO3D-4300HC-5SG72I positions itself as a compact, industrial-grade FPGA option for designers who need reconfigurable logic with integrated memory and hardened system IP. Its combination of 4,300 logic elements, 58 I/Os and embedded security and peripheral blocks makes it suitable for control and interface tasks where board-level integration and configurability lower BOM and simplify design.

This device is well suited for engineering teams building industrial and embedded products that require long-term configurability, on-board security features and a proven set of system-level capabilities backed by the MachXO3D family datasheet documentation.

Request a quote or submit a purchase inquiry to receive pricing, availability and lead-time information for the LCMXO3D-4300HC-5SG72I.

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