LCMXO3D-4300HC-5SG72I
| Part Description |
MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 817 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 58 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 538 | Number of Logic Elements/Cells | 4300 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3D-4300HC-5SG72I – MachXO3D Field Programmable Gate Array (FPGA) IC, 4,300 Logic Elements
The LCMXO3D-4300HC-5SG72I is a MachXO3D family FPGA from Lattice Semiconductor Corporation. This non-volatile, reconfigurable device combines on-chip programmable logic, embedded memory and hardened system IP to support control, interface and security functions in compact board-level designs.
Designed for industrial environments, the device delivers 4,300 logic elements, 58 general-purpose I/Os and a broad supply and temperature range to support embedded control, I/O bridging and system management tasks where integration, configurability and reliability are required.
Key Features
- Programmable Logic — 4,300 logic elements for implementing glue logic, protocol bridges, finite state machines and control functions.
- Embedded Memory — Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for small buffers, FIFOs and state storage.
- I/O Capacity & Flexibility — 58 I/Os with pre‑engineered source-synchronous and flexible I/O buffer support for diverse interface requirements.
- Power and Voltage — Operates from 2.375 V to 3.465 V to match common board power rails.
- Industrial Grade Temperature — Qualified to operate from −40 °C to 100 °C for use in industrial applications.
- Package — 72‑VFQFN exposed pad package (72‑QFN, 10×10 mm) for a compact board footprint and thermal performance.
- Embedded Hardened IP — Includes dedicated blocks such as an Embedded Security Block and hardened peripherals (I2C, SPI, timer/counter) to simplify system integration.
- Clocking & Configuration — Flexible on-chip clocking with PLLs, on-chip oscillator, TransFR reconfiguration and user flash memory (UFM) for system configuration and updates.
- System-Level Support — Features for boundary-scan testability, standby and power-saving modes to assist board-level validation and low-power operation.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement control logic, protocol conversion and I/O handling with the device’s industrial temperature rating and flexible I/O.
- Secure Embedded Systems — Use the Embedded Security Block and hardened peripherals for system authentication, secure boot controllers and protected configuration storage.
- Interface Bridging and Glue Logic — Replace discrete logic for bus bridging, level translation and peripheral aggregation using the programmable logic and on-chip memory.
- Board-Level System Management — Implement reset management, configuration sequencers and monitoring functions leveraging UFM, on-chip oscillator and timers.
Unique Advantages
- Non‑volatile, reconfigurable logic: Enables field updates and persistent functionality without external configuration memory.
- Compact, thermally aware package: 72‑VFQFN with exposed pad offers a small footprint and board-level thermal path for industrial designs.
- Integrated security and hardened IP: Reduces the need for external secure controllers and simplifies implementation of protected functions.
- Wide operating range: 2.375 V–3.465 V supply support and −40 °C to 100 °C operation align with common industrial power rails and ambient conditions.
- Balanced I/O and memory resources: 58 I/Os with built-in memory (≈0.094 Mbits) to support buffering and interface timing without large external RAM.
Why Choose LCMXO3D-4300HC-5SG72I?
The LCMXO3D-4300HC-5SG72I positions itself as a compact, industrial-grade FPGA option for designers who need reconfigurable logic with integrated memory and hardened system IP. Its combination of 4,300 logic elements, 58 I/Os and embedded security and peripheral blocks makes it suitable for control and interface tasks where board-level integration and configurability lower BOM and simplify design.
This device is well suited for engineering teams building industrial and embedded products that require long-term configurability, on-board security features and a proven set of system-level capabilities backed by the MachXO3D family datasheet documentation.
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