LCMXO3D-4300HC-6BG256I
| Part Description |
MachXO3D Field Programmable Gate Array (FPGA) IC 206 94208 4300 256-LFBGA |
|---|---|
| Quantity | 102 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 538 | Number of Logic Elements/Cells | 4300 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3D-4300HC-6BG256I – MachXO3D FPGA, 4300 logic elements, 256-LFBGA
The LCMXO3D-4300HC-6BG256I is a MachXO3D Field Programmable Gate Array (FPGA) IC offering 4,300 logic elements and on-chip, reconfigurable resources in a compact 256-LFBGA package. It provides non-volatile, reconfigurable logic with dedicated embedded system functions described in the MachXO3D family data sheet.
With 206 I/Os, approximately 94,208 bits of embedded memory, an industrial operating temperature range, and a flexible supply voltage range, this device is suited for applications that require reconfigurable logic, broad I/O connectivity, and system-level integration.
Key Features
- Core Logic 4,300 logic elements provide the programmable fabric for implementing custom logic, state machines, and control functions.
- Embedded Memory Approximately 94,208 bits of on-chip RAM support data buffering, FIFOs, and small memory structures described in the MachXO3D family documentation.
- I/O Capacity 206 user I/Os enable wide peripheral connectivity and signal interfacing for complex board-level designs.
- Non-volatile, Reconfigurable Architecture Family-level documentation identifies the MachXO3D devices as non-volatile and reconfigurable, enabling persistent configurations without external volatile storage.
- Embedded System IP Family features include a dedicated Embedded Security Block and a range of hardened IP functions as outlined in the MachXO3D data sheet.
- Power and Temperature Supported supply voltage range of 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C for industrial environments.
- Package 256-LFBGA (256-CABGA, 14 × 14) surface-mount package for compact board implementation.
- Compliance RoHS compliant.
Typical Applications
- Embedded System Control Implement control logic and state machines using 4,300 logic elements combined with on-chip RAM and a broad set of I/Os.
- I/O Expansion and Interface Bridging Use the 206 I/Os to bridge or expand interfaces between subsystems on dense PCBs.
- Security-Enhanced Functions Leverage the family’s dedicated Embedded Security Block and hardened IP functions for designs requiring integrated security features.
Unique Advantages
- Highly configurable logic fabric: The 4,300 logic elements provide a flexible resource pool for custom digital functions and glue logic.
- Significant embedded memory: Approximately 94,208 bits of RAM on-chip reduce the need for external memory for buffering and small data storage tasks.
- Extensive I/O capability: 206 I/Os accommodate complex interfacing needs without excessive external multiplexing.
- Industrial temperature range: Rated for −40 °C to 100 °C to meet demanding environmental requirements.
- Wide supply tolerance: Operation across a 2.375 V to 3.465 V supply window supports flexible power-domain design choices.
- Compact LFBGA package: The 256-LFBGA (14 × 14) package enables dense board layouts while delivering the device’s full feature set.
Why Choose LCMXO3D-4300HC-6BG256I?
The LCMXO3D-4300HC-6BG256I positions itself as a compact, industrial-grade MachXO3D family member that balances programmable logic density, embedded memory, and extensive I/O in a single surface-mount package. Its non-volatile reconfigurable architecture and family-level embedded IP features provide practical system-level integration for designs that require persistent configuration and built-in security functionality.
This device is well suited for engineers and procurement teams designing systems that need moderate logic capacity, substantial I/O, and on-chip memory within an industrial temperature envelope. The MachXO3D family documentation provides additional architecture and embedded IP details to support design and verification.
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