LCMXO3D-4300HC-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 206 94208 4300 256-LFBGA

Quantity 102 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-6BG256I – MachXO3D FPGA, 4300 logic elements, 256-LFBGA

The LCMXO3D-4300HC-6BG256I is a MachXO3D Field Programmable Gate Array (FPGA) IC offering 4,300 logic elements and on-chip, reconfigurable resources in a compact 256-LFBGA package. It provides non-volatile, reconfigurable logic with dedicated embedded system functions described in the MachXO3D family data sheet.

With 206 I/Os, approximately 94,208 bits of embedded memory, an industrial operating temperature range, and a flexible supply voltage range, this device is suited for applications that require reconfigurable logic, broad I/O connectivity, and system-level integration.

Key Features

  • Core Logic  4,300 logic elements provide the programmable fabric for implementing custom logic, state machines, and control functions.
  • Embedded Memory  Approximately 94,208 bits of on-chip RAM support data buffering, FIFOs, and small memory structures described in the MachXO3D family documentation.
  • I/O Capacity  206 user I/Os enable wide peripheral connectivity and signal interfacing for complex board-level designs.
  • Non-volatile, Reconfigurable Architecture  Family-level documentation identifies the MachXO3D devices as non-volatile and reconfigurable, enabling persistent configurations without external volatile storage.
  • Embedded System IP  Family features include a dedicated Embedded Security Block and a range of hardened IP functions as outlined in the MachXO3D data sheet.
  • Power and Temperature  Supported supply voltage range of 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C for industrial environments.
  • Package  256-LFBGA (256-CABGA, 14 × 14) surface-mount package for compact board implementation.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded System Control  Implement control logic and state machines using 4,300 logic elements combined with on-chip RAM and a broad set of I/Os.
  • I/O Expansion and Interface Bridging  Use the 206 I/Os to bridge or expand interfaces between subsystems on dense PCBs.
  • Security-Enhanced Functions  Leverage the family’s dedicated Embedded Security Block and hardened IP functions for designs requiring integrated security features.

Unique Advantages

  • Highly configurable logic fabric: The 4,300 logic elements provide a flexible resource pool for custom digital functions and glue logic.
  • Significant embedded memory: Approximately 94,208 bits of RAM on-chip reduce the need for external memory for buffering and small data storage tasks.
  • Extensive I/O capability: 206 I/Os accommodate complex interfacing needs without excessive external multiplexing.
  • Industrial temperature range: Rated for −40 °C to 100 °C to meet demanding environmental requirements.
  • Wide supply tolerance: Operation across a 2.375 V to 3.465 V supply window supports flexible power-domain design choices.
  • Compact LFBGA package: The 256-LFBGA (14 × 14) package enables dense board layouts while delivering the device’s full feature set.

Why Choose LCMXO3D-4300HC-6BG256I?

The LCMXO3D-4300HC-6BG256I positions itself as a compact, industrial-grade MachXO3D family member that balances programmable logic density, embedded memory, and extensive I/O in a single surface-mount package. Its non-volatile reconfigurable architecture and family-level embedded IP features provide practical system-level integration for designs that require persistent configuration and built-in security functionality.

This device is well suited for engineers and procurement teams designing systems that need moderate logic capacity, substantial I/O, and on-chip memory within an industrial temperature envelope. The MachXO3D family documentation provides additional architecture and embedded IP details to support design and verification.

Request a quote or submit an inquiry for LCMXO3D-4300HC-6BG256I to receive pricing and availability information tailored to your project needs.

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