LCMXO3D-4300ZC-2BG256I

The LCMXO3D-4300ZC-2BG256I is a MachXO3D family field programmable gate array provided in a 256-LFBGA package. It delivers 4,300 logic elements and 206 I/Os in a surface-mount 256-CABGA (14×14) footprint, designed for industrial-grade applications with an operating range of -40 °C to 100 °C.

This device combines flexible logic, embedded memory, on-chip system IP and dedicated security capability to support glue-logic, interface bridging and system control functions where reconfigurable, non-volatile FPGA functionality is required. The device accepts a 2.375 V to 3.465 V supply and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 4,300 logic elements for implementing combinational and sequential logic, state machines and glue logic.
• Embedded Memory  Total on-chip RAM of 94,208 bits (approximately 0.094 Mbits) for small buffers, FIFOs and state storage.
• Rich I/O  206 programmable I/O pins to support dense peripheral and interface requirements in compact designs.
• Power and Supply  Wide voltage supply support from 2.375 V to 3.465 V for flexible power-rail integration.
• Industrial Temperature Grade  Rated for -40 °C to 100 °C operation to meet harsher-environment deployment needs.
• Package & Mounting  256-LFBGA (supplier package 256-CABGA, 14×14) in a surface-mount form factor for high-density PCB designs.
• Embedded System IP  Family-level features include a dedicated Embedded Security Block (ESB), hardened peripheral IP (I²C, SPI, timers) and on-chip oscillator options as described in the MachXO3D device documentation.
• Non-volatile, Reconfigurable  MachXO3D family supports non-volatile configuration and field reconfiguration capabilities noted in the device documentation.
• Standards & Compliance  RoHS compliant for environmental compliance in assembly and distribution.

Typical Applications

• Industrial Control and Automation  Use as glue logic, interface management and configurable control functions where industrial temperature range and robust I/O are required.
• Interface Bridging  Dense I/O and on-chip IP make the device suitable for protocol bridging, level translation and board-level interface consolidation.
• Security and Authentication  Leverage the family’s dedicated Embedded Security Block for secure key storage, device authentication and protected configuration workflows.
• Embedded System Glue  Small embedded memories and plentiful logic elements enable peripheral aggregation, power sequencing control and system supervisory tasks.

Unique Advantages

• Highly integrated I/O and logic:  206 I/Os paired with 4,300 logic elements reduce external glue logic and simplify PCB designs.
• Industrial-temperature robustness:  Rated from -40 °C to 100 °C to support extended-temperature deployments without derating key functions.
• Non-volatile configuration:  Built-in reconfigurability with non-volatile storage enables field updates and flexible system upgrades.
• On-chip system IP:  Embedded security, hardened peripheral functions and clocking resources reduce integration time and lower BOM count.
• Compact, manufacturable package:  256-LFBGA surface-mount package in a 14×14 footprint enables high-density board placement while maintaining thermal and electrical compatibility with modern PCBs.

Why Choose LCMXO3D-4300ZC-2BG256I?

The LCMXO3D-4300ZC-2BG256I positions itself as a compact, industrial-grade FPGA option for designers seeking reconfigurable logic with ample I/O and embedded system IP. Its combination of 4,300 logic elements, approximately 0.094 Mbits of on-chip RAM, and a dedicated security block addresses applications that need field-updatable logic, secure configuration and robust interfacing in a single component.

This device is a solid choice for engineers building control, interface and security-sensitive systems that require industrial temperature operation, a wide supply voltage window and a proven package footprint for dense PCB integration. Its family-level system features support scalable designs and faster time-to-market while keeping board-level BOM and complexity lower.

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