LCMXO3D-4300ZC-2BG256C

The LCMXO3D-4300ZC-2BG256C is a MachXO3D family field programmable gate array (FPGA) IC offering 4,300 logic elements and 206 I/O pins in a 256-LFBGA package. The device is designed for non-volatile, reconfigurable system functions and includes on-chip resources for memory, clocking and hardened peripheral IP.

With features described across the MachXO3D data sheet — including an embedded security block, flexible I/O buffering and pre-engineered source-synchronous I/O — this device targets system control, interface bridging and security-aware configuration tasks in commercial-temperature applications.

Key Features

• Core Logic — 4,300 logic elements for implementing glue logic, state machines and moderate-density combinational/sequential logic.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM (sysMEM block RAM) supporting single/dual/ FIFO modes and memory cascading.
• High-Density I/O — 206 I/O pins with flexible per-bank I/O buffer options and support for pre-engineered source-synchronous interfaces.
• Dedicated Security and Hardened IP — Includes a dedicated Embedded Security Block (ESB) and hardened peripheral IP blocks such as SPI, I²C and timer/counter functionality as described in the family data sheet.
• Flexible Clocking — On-chip oscillator and sysCLOCK Phase-Locked Loops (PLLs) for on-chip clock generation and distribution.
• Non-volatile, Reconfigurable — MachXO3D family supports non-volatile configuration and TransFR reconfiguration options for system-level flexibility.
• Configuration & Test — IEEE 1149.1-compliant boundary scan testability and user flash memory (UFM) capabilities described in the data sheet.
• Package & Supply — 256-LFBGA (supplier package: 256-CABGA, 14×14) surface-mount package; recommended supply range 2.375 V to 3.465 V.
• Commercial Temperature & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS-compliant.

Typical Applications

• System Glue Logic — Implement board-level control, protocol bridging and peripheral arbitration using the device’s logic capacity and high I/O count.
• Interface Bridging — Use pre-engineered source-synchronous I/O and flexible I/O buffering to connect disparate buses and timing domains.
• Secure Configuration & Authentication — Leverage the Embedded Security Block and user flash memory for secure boot, key storage and authenticated configuration flows.
• Clocking and Timing Functions — Use on-chip oscillator and PLL resources for local clock generation, deskewing and timing control in system designs.

Unique Advantages

• Highly integrated solution: Combines logic, on-chip RAM and hardened peripheral IP in a single non-volatile FPGA to reduce external components and simplify system design.
• Flexible I/O capability: 206 I/Os and configurable I/O banks provide design flexibility for mixed-signal interfaces and board-level connectivity.
• Security-focused building blocks: Dedicated Embedded Security Block and UFM support secure configuration and key storage without external secure elements.
• On-chip clocking and memory: Integrated PLLs, oscillator and sysMEM block RAM enable local timing and buffering functions without adding discrete clock or memory devices.
• Production-ready packaging and supply: Surface-mount 256-LFBGA package with a specified supply range (2.375 V–3.465 V) and commercial temperature rating for standard electronic products.

Why Choose LCMXO3D-4300ZC-2BG256C?

The LCMXO3D-4300ZC-2BG256C positions itself as a compact, non-volatile FPGA suited for commercial-temperature system designs that require moderate logic capacity, substantial I/O density and integrated security and configuration features. Its combination of on-chip memory, hardened IP and flexible clocking makes it appropriate for designs that need reliable interface bridging, system control and secure configuration without a large external component count.

Designed to work within a 2.375 V–3.465 V supply range and packaged in a 256-LFBGA surface-mount form factor, this MachXO3D device offers a balanced feature set for embedded engineers and procurement teams seeking a reconfigurable, RoHS-compliant FPGA for commercial applications.

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