LCMXO3D-4300ZC-2SG72C

The LCMXO3D-4300ZC-2SG72C is a MachXO3D family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, supplied in a 72‑pin VFQFN exposed pad package. It provides a non-volatile, reconfigurable architecture with on‑chip memory and embedded system functions suitable for configurable logic and interface tasks in commercial‑grade designs.

With 4,300 logic elements, approximately 94 kbits of embedded memory, and 58 I/Os, this device targets applications that require flexible I/O, on‑chip clocking, and integrated security and peripheral IP blocks while operating from a 2.375 V to 3.465 V supply and a commercial temperature range.

Key Features

• Core Logic 4,300 logic elements delivering a compact programmable fabric for glue logic, control functions, and custom state machines.
• Embedded Memory Approximately 94 kbits of on‑chip RAM (94,208 total bits) usable for FIFOs, registers, and small data buffers.
• I/O Capacity & Flexibility 58 programmable I/Os with pre‑engineered source‑synchronous support and flexible I/O buffering described in the MachXO3D family data sheet.
• Embedded Hardened IP Family documentation lists an Embedded Security Block plus hardened I2C, SPI, timer/counter and other system IP to simplify common peripheral functions.
• Clocking & Timing Flexible on‑chip clocking with PLLs and an on‑chip oscillator are included in the MachXO3D family architecture for system clock generation and distribution.
• Non‑volatile, Reconfigurable MachXO3D devices are described as non‑volatile and reconfigurable, supporting in‑system reconfiguration modes used across the family.
• Power & Supply Recommended supply range is 2.375 V to 3.465 V, accommodating a range of common digital system voltages.
• Package & Mounting 72‑VFQFN exposed pad package (supplier package: 72‑QFN, 10 × 10 mm) designed for surface‑mount PCB assembly.
• Commercial Grade & Compliance Commercial grade device with an operating temperature of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Interface Bridging and Glue Logic Use the device’s programmable fabric and 58 I/Os to consolidate interface logic and implement protocol adaptation or signal translation.
• Security and Authentication The Embedded Security Block and hardened security IP listed in the family data sheet support on‑device security functions where integrated protection is required.
• Configurable Control and Sequencing Implement control state machines, timing logic, and custom sequencing leveraging the 4,300 logic elements and on‑chip memory.
• Peripheral Interface Offload Offload simple peripheral handling and serial protocols using the hardened SPI/I2C IP and timer/counter resources noted in the MachXO3D documentation.

Unique Advantages

• Non‑volatile, reconfigurable architecture: The MachXO3D family’s non‑volatile configuration removes the need for external configuration memory while enabling in‑system reconfiguration.
• Integrated hardened IP: Built‑in security, SPI, I2C, and timer/counter cores reduce design overhead by providing pre‑engineered functions documented for the family.
• Compact package with exposed pad: The 72‑VFQFN exposed pad (72‑QFN, 10×10) provides a small footprint for space‑constrained PCBs while supporting thermal transfer through the exposed pad.
• Flexible I/O and clocking: Family features include flexible I/O buffering, source‑synchronous I/O support, PLLs and an on‑chip oscillator to simplify timing and interface design.
• Commercial temperature and RoHS compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance facilitate deployment in a wide range of standard electronics applications.

Why Choose LCMXO3D-4300ZC-2SG72C?

The LCMXO3D-4300ZC-2SG72C delivers a balanced combination of programmable logic, embedded memory, flexible I/O, and integrated system IP in a compact surface‑mount package. Its non‑volatile, reconfigurable MachXO3D architecture and family‑level hardened functions make it appropriate for designs that need on‑device configuration retention, peripheral offload, and embedded security within a commercial operating temperature range.

Engineers and procurement teams looking for a small, RoHS‑compliant FPGA with mid‑range logic density, on‑chip memory, and built‑in system IP will find this device suitable for consolidating glue logic, implementing secure control functions, and simplifying interface tasks while maintaining standard supply‑voltage and package requirements.

Request a quote or submit a procurement inquiry for the LCMXO3D-4300ZC-2SG72C to receive pricing and availability information for your next design.