LCMXO3D-4300ZC-3SG72C

The LCMXO3D-4300ZC-3SG72C is a MachXO3D family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. This device integrates 4,300 logic elements and 94,208 bits of on-chip RAM in a compact 72-pin VFQFN package with exposed pad, offering a reconfigurable, non-volatile solution for system control, glue logic, and interface integration.

Designed for commercial applications, the device supports a wide supply voltage range (2.375 V to 3.465 V), 58 I/O pins, and an operating temperature range of 0 °C to 85 °C, delivering flexible I/O and embedded features suitable for embedded system designers and OEM procurement.

Key Features

• Core Logic 4,300 logic elements for implementing custom control, glue logic, and state machines.
• On-chip Memory 94,208 bits of total RAM for embedded data storage, FIFOs, and buffering.
• I/O Count and Flexibility 58 user I/O pins supporting the MachXO3D family’s flexible I/O buffering and pre‑engineered source-synchronous I/O architecture.
• Power and Supply Supported supply voltage range from 2.375 V to 3.465 V to accommodate common single-supply system rails.
• Package and Mounting 72-VFQFN exposed pad package (72-QFN, 10×10) in a surface-mount form factor for compact PCB designs.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-grade deployments.
• Non-volatile, Reconfigurable Architecture Part of the MachXO3D family featuring non-volatile configuration and family-level capabilities such as on-chip clocking, embedded security block, and hardened IP blocks as documented for the family.
• Standards and Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• System Glue Logic Replace discrete logic with a reconfigurable FPGA to consolidate interfaces and simplify board design.
• Peripheral and Interface Bridging Implement custom protocol conversion, level translation, and source-synchronous I/O adaptation across multiple subsystems.
• Embedded Control and State Machines Host control sequencing, startup logic, and feature arbitration within compact embedded systems.
• User Interface and Peripheral Management Drive and manage buttons, indicators, and peripheral control with flexible I/O and embedded memory for buffering.

Unique Advantages

• Compact, Reconfigurable Integration: 4300 logic elements and on-chip RAM reduce PCB BOM by consolidating discrete logic and small microcontroller tasks into a single device.
• Flexible I/O for Mixed Interfaces: 58 I/O pins and MachXO3D family I/O features enable interfacing to diverse peripheral voltages and timing requirements.
• Wide Supply Voltage Support: Operation across 2.375 V to 3.465 V simplifies power-rail compatibility in multi-voltage systems.
• Commercial Temperature Range: Specifications from 0 °C to 85 °C match typical commercial embedded product requirements.
• Space-saving Package: 72-VFQFN exposed pad (10 × 10 mm) offers a small board footprint with thermal pad for board-level thermal management.
• RoHS Compliant: Meets common environmental directives for easier regulatory acceptance.

Why Choose LCMXO3D-4300ZC-3SG72C?

The LCMXO3D-4300ZC-3SG72C delivers a practical balance of logic capacity, embedded memory, and flexible I/O in a compact, surface-mount VFQFN package. Its non-volatile MachXO3D family architecture and documented family-level features make it well-suited for designers seeking to reduce component count, consolidate control functions, and simplify system integration in commercial-grade products.

This device is ideal for OEMs and embedded system designers who need reconfigurable logic with defined supply and temperature ranges, a moderate I/O count, and on-chip RAM for buffering and control tasks. Family-level datasheet details and Lattice Semiconductor documentation provide the technical foundation for deployment and design integration.

Request a quote or submit an inquiry for availability and volume pricing to evaluate the LCMXO3D-4300ZC-3SG72C for your next design.