LCMXO3D-4300ZC-3SG72I

The LCMXO3D-4300ZC-3SG72I is a MachXO3D family Field Programmable Gate Array (FPGA) IC in a 72-pin VFQFN exposed pad package. It combines up to 4,300 logic elements with embedded RAM and a flexible I/O complement for industrial designs that require non-volatile, reconfigurable logic and system-level integration.

Targeted at industrial applications, this device provides on-chip memory, a dedicated embedded security block and hardened peripheral IP described in the MachXO3D family datasheet, enabling compact, integrated solutions where deterministic control, I/O interfacing and configuration flexibility are required.

Key Features

• Core Logic  Approximately 4,300 logic elements suitable for glue logic, state machines and mid-density programmable logic tasks.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM for data buffering, LUT-based storage and small FPGA-local memory requirements.
• I/O Density  58 programmable I/O pins to support multi-interface designs and board-level glue logic in a single device.
• Voltage Supply  Operates from 2.375 V to 3.465 V, allowing flexible integration with common system rail voltages.
• Industrial Temperature Range  Rated for –40 °C to 100 °C operation for deployment in industrial environments.
• Package  72-pin VFQFN with exposed pad (supplier package: 72-QFN, 10 × 10 mm) for compact board footprint and thermal performance.
• Non-volatile, Reconfigurable Family Features  Family-level capabilities described in the MachXO3D datasheet include embedded security, pre-engineered source-synchronous I/O, on-chip oscillator and hardened IP blocks for common system functions.
• Compliance  RoHS-compliant construction.

Typical Applications

• Industrial control and automation  Use as glue logic, control sequencing and interface bridging in industrial systems—leveraging 4,300 logic elements and 58 I/Os within an industrial temperature range.
• System configuration and security  Implement device configuration and protected functionality using the MachXO3D family’s dedicated embedded security block and non-volatile reconfiguration capability.
• Interface consolidation  Consolidate multiple board-level functions and I/O standards into a single 72-QFN package to reduce BOM and board complexity.

Unique Advantages

• Compact, thermally manageable package  The 72-VFQFN exposed pad (10 × 10 mm QFN footprint) provides a small PCB footprint while supporting thermal dissipation via the exposed pad.
• Industrial-grade operating range  Rated from –40 °C to 100 °C, suitable for many industrial deployments requiring extended temperature tolerance.
• Flexible power integration  Broad supply range of 2.375 V to 3.465 V simplifies interfacing with standard system rails.
• Balanced logic and memory  4,300 logic elements paired with approximately 94,208 bits of RAM provide the resources to implement complex glue logic plus local buffering without external memory.
• Family-level hardened IP and security  MachXO3D family features include hardened peripheral IP and a dedicated embedded security block to support system-level functions and secure configuration.
• RoHS compliant  Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose LCMXO3D-4300ZC-3SG72I?

This MachXO3D-family FPGA offers a mid-density programmable logic option with a balance of logic, embedded RAM and I/O in a compact 72-QFN package rated for industrial temperatures. It is well suited for designers seeking a non-volatile, reconfigurable device that combines system-level integration, security features (as described for the MachXO3D family) and a flexible power range for streamlined board-level designs.

Choose this device when you need a scalable, industrial-grade programmable logic element that reduces external components, consolidates interfaces and leverages family-level hardened IP for faster time-to-market and robust system integration.

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