LCMXO3D-9400HC-5BG256C

The LCMXO3D-9400HC-5BG256C is a MachXO3D family FPGA IC designed for non-volatile, reconfigurable logic integration. It combines 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and flexible I/O to support mid-density programmable logic tasks.

Built for commercial applications, the device offers integrated on-chip features from the MachXO3D datasheet such as embedded security blocks, programmable I/O buffers, and flexible clocking, together with a compact 256-LFBGA package for surface-mount PCB assembly.

Key Features

• Logic Capacity  9,400 logic elements provide mid-range programmable logic density suitable for glue logic, protocol bridging, and custom control functions.
• On-chip Memory  Approximately 0.44 Mbits of embedded RAM for FIFOs, small data buffers, and state storage.
• I/O Resources  206 user I/Os delivered through programmable I/O cells and flexible I/O buffer architecture described in the MachXO3D family datasheet.
• Power and Voltage  Supports a supply voltage range of 2.375 V to 3.465 V, enabling compatibility with a range of common board supply rails.
• Embedded IP and System Functions  Includes dedicated embedded blocks referenced in the family datasheet such as an Embedded Security Block, on‑chip oscillator, hardened I²C and SPI IP cores, and timer/counter IP to reduce external component count.
• Configuration and Non-Volatility  MachXO3D family features include non-volatile reconfiguration and TransFR reconfiguration options as documented in the datasheet.
• Package and Mounting  256-LFBGA package (supplier package: 256-CABGA 14×14) in a surface-mount form factor for high-density board designs.
• Operating Grade and Temperature  Commercial grade device rated for operation from 0 °C to 85 °C.
• RoHS Compliance  RoHS-compliant manufacturing status.

Unique Advantages

• Mid-range logic density: 9,400 logic elements give designers a practical balance between capability and cost for mid-complexity programmable tasks.
• Compact, high-pin package: 206 I/Os in a 256-LFBGA footprint allow substantial I/O capability in a compact board area.
• Integrated memory: Approximately 0.44 Mbits of embedded RAM reduces reliance on external memory for small buffers and FIFOs.
• Flexible supply compatibility: The 2.375 V–3.465 V supply range supports multiple common logic voltage domains.
• On-chip system IP: Embedded security functions, serial interfaces and timers from the MachXO3D family help simplify system-level design and decrease BOM count.
• Commercial temperature suitability: Rated 0 °C to 85 °C for typical commercial environment deployments.

Why Choose LCMXO3D-9400HC-5BG256C?

This MachXO3D family device positions itself as a versatile, mid-density FPGA solution for commercial designs that need a combination of programmable logic, embedded RAM, and substantial I/O in a compact surface-mount package. Its on-chip system IP and non-volatile configuration options streamline integration for control, interfacing, and glue-logic roles.

Designers seeking a balance of logic capacity, embedded memory, and integrated functions will find the LCMXO3D-9400HC-5BG256C applicable for a variety of board-level programmable tasks where commercial temperature range and RoHS compliance are required.

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