LCMXO3D-9400HC-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 1,506 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN5A992CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3D-9400HC-5BG256I – MachXO3D FPGA; 9,400 logic elements, 206 I/Os, 256‑LFBGA

The LCMXO3D-9400HC-5BG256I is a MachXO3D family Field Programmable Gate Array (FPGA) in a 256‑LFBGA package designed for industrial applications. It combines 9,400 logic elements with on‑chip embedded memory and a high pin count to address interface bridging, system control, and embedded security requirements.

Built with non‑volatile, reconfigurable architecture and dedicated embedded IP blocks, this device targets designs that require flexible I/O, on‑chip memory resources, and industrial temperature operation while supporting a broad supply voltage range.

Key Features

  • Core Logic 9,400 logic elements (cells) support implementation of control, glue logic, and custom peripherals.
  • Embedded Memory Approximately 0.44 Mbits of total RAM bits (442,368 bits) for on‑chip buffering, FIFOs, and small data storage.
  • I/O Density & Flexibility 206 I/O pins provide extensive interfacing capability; datasheet references pre‑engineered source‑synchronous I/O and flexible on‑chip I/O buffering.
  • Dedicated Embedded IP & Security Includes an Embedded Security Block and multiple hardened IP functions (for example, hardened I2C and SPI IP cores and timer/counter blocks) as documented in the MachXO3D family datasheet.
  • Clocking & Reconfiguration Flexible on‑chip clocking with sysCLOCK PLLs and TransFR reconfiguration options are supported per the device family documentation.
  • Power & Voltage Operates from 2.375 V to 3.465 V supply range to accommodate common system rails.
  • Package & Mounting 256‑LFBGA (supplier package 256‑CABGA, 14×14) surface‑mount package for compact, PCB‑mounted system designs.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Standards & On‑Chip Utilities Family datasheet documents on‑chip oscillator, user flash memory (UFM), and enhanced system level support to simplify configuration and system integration.
  • RoHS Compliant Device is RoHS compliant for environmental and regulatory compatibility.

Typical Applications

  • System and Interface Glue Logic Use the device’s 9,400 logic elements and 206 I/Os to consolidate multiple interface components and reduce board-level BOM in control and bridging functions.
  • Embedded Security & Authentication Modules The Embedded Security Block and hardened IP cores support designs that require on‑device security functions and secure configuration.
  • Industrial Control Industrial temperature rating and flexible I/O make this FPGA suitable for motor control front-ends, PLC auxiliary logic, and sensor aggregation in industrial systems.
  • Protocol Bridging & Bus Interfaces High I/O count and pre‑engineered source‑synchronous I/O support implementation of protocol adapters, interface translators, and timing‑sensitive glue logic.

Unique Advantages

  • Highly integrated logic and memory: 9,400 logic elements combined with approximately 0.44 Mbits of embedded RAM enable compact implementation of control and buffering without external memory.
  • Extensive I/O capability: 206 I/Os provide broad interfacing options to reduce the need for external interface ICs.
  • Embedded security and hardened IP: On‑chip Embedded Security Block plus hardened I/O and peripheral IP reduce development time for secure and reliable subsystems.
  • Industrial temperature support: −40 °C to 100 °C rating supports deployment in demanding environments.
  • Flexible supply range: 2.375 V to 3.465 V operation allows integration with common system rails.
  • Compact surface‑mount packaging: 256‑LFBGA (14×14) package optimizes board area while providing the needed pin count for complex systems.

Why Choose LCMXO3D-9400HC-5BG256I?

This MachXO3D device balances mid‑density programmable logic with embedded memory, a high I/O count, and dedicated embedded IP blocks to address a wide range of industrial and system control applications. Its non‑volatile, reconfigurable architecture and family‑level features—such as flexible clocking, on‑chip oscillator, and security functions—provide designers with a compact, integrated building block for interface consolidation and secure control logic.

The combination of industrial temperature rating, RoHS compliance, and a broad supply voltage window offers practical system integration benefits for companies building robust, long‑life equipment. The LCMXO3D-9400HC-5BG256I is well suited to teams needing scalable, reconfigurable logic with embedded utilities documented in the MachXO3D family datasheet.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3D-9400HC-5BG256I and to discuss how it can meet your next design’s interface, security, and control requirements.

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