LCMXO3D-9400HC-5BG484I

The LCMXO3D-9400HC-5BG484I is a MachXO3D family FPGA IC offering non-volatile, reconfigurable logic in a 484-ball LFBGA package. This industrial-grade device integrates approximately 9,400 logic elements, a large I/O count, and embedded memory to support system control, glue-logic and interface consolidation in industrial and embedded designs.

Designed for flexible I/O and on-chip system functions, the device provides a broad operating voltage range and an extended industrial temperature rating to support robust operation in demanding environments.

Key Features

• Logic Capacity  Approximately 9,400 logic elements for implementing glue logic, control functions and mid-density FPGA designs.
• Embedded Memory  Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for FIFOs, buffers and small data stores.
• High I/O Count  383 I/Os to support extensive peripheral connectivity and multi-channel interfaces without external expanders.
• Non-volatile, Reconfigurable Architecture  Family-level features include non-volatile configuration for instant-on behavior and field reconfigurability.
• Dedicated Security and Hardened IP  MachXO3D family documentation highlights a Dedicated Embedded Security Block and hardened IP (for example, I²C, SPI and timer/counter cores) to simplify system integration.
• Flexible On‑Chip Clocking  Family architecture includes PLLs and flexible clock distribution for synchronized, low-jitter designs.
• Source‑Synchronous and Flexible I/O  Pre‑engineered source-synchronous I/O and high-performance I/O buffer options described for robust interface timing.
• On-Chip Utilities  Family features include an on‑chip oscillator and user flash memory (UFM) for system-level functions and configuration storage.
• Power and Electrical  Operating supply range from 2.375 V to 3.465 V for flexible system power architectures.
• Industrial Grade and Mounting  Industrial grade device, surface-mount package with operating temperature from −40 °C to 100 °C.
• Package  484‑LFBGA package (supplier device package: 484‑CABGA, 19 × 19 mm) for compact board-level integration.
• RoHS Compliant  Manufactured to meet RoHS requirements for regulated materials.

Typical Applications

• Industrial Control and Automation  Use the extended −40 °C to 100 °C temperature range and high I/O count to consolidate interfaces, implement control logic, and manage sensor and actuator signals in factory and process-control equipment.
• Interface Bridging and Glue Logic  Leverage the 383 I/Os and flexible I/O buffering to replace multiple discrete translators and glue components, simplifying board design and reducing BOM.
• Secure System Functions  The family-level Dedicated Embedded Security Block and on-chip non-volatile configuration enable secure configuration storage and system-level security functions.
• Embedded System Control  Approximately 9,400 logic elements and embedded RAM support local processing tasks, small FIFOs and protocol handling in embedded controllers and appliances.

Unique Advantages

• Highly Integrated Mid‑Density FPGA:  Combines ~9,400 logic elements, ~0.44 Mbits of embedded RAM and 383 I/Os to reduce the need for external glue logic and memory.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation and supplied in a robust 484‑LFBGA package for durable deployment in industrial environments.
• Flexible Power Options:  Wide supply range (2.375 V–3.465 V) eases integration with diverse system power rails.
• On‑Chip System Features:  Family-level on‑chip oscillator, UFM and hardened IP blocks simplify common system tasks and reduce external component count.
• Rich I/O and Timing Support:  Pre‑engineered source-synchronous I/O, flexible buffering and on‑chip PLLs assist compliant, high‑performance interface implementations.
• RoHS Compliance:  Manufactured to meet environmental material requirements for modern supply chains.

Why Choose LCMXO3D-9400HC-5BG484I?

The LCMXO3D-9400HC-5BG484I delivers a balanced mix of logic capacity, embedded memory and high I/O density in a non-volatile, reconfigurable MachXO3D family device tailored for industrially rated applications. Its combination of flexible I/O, on‑chip system functions and hardened IP reduces system complexity and BOM while supporting robust, long-term deployments.

This device is well suited for engineers and procurement teams designing industrial control, interface bridging and embedded system-control solutions that require mid-density programmable logic, a compact 484‑ball package, and extended temperature operation backed by family-level security and configuration features.

Request a quote or submit an inquiry today to check availability and pricing for the LCMXO3D-9400HC-5BG484I.