LCMXO3D-9400HC-5SG72I

The LCMXO3D-9400HC-5SG72I is a MachXO3D field-programmable gate array (FPGA) IC from Lattice Semiconductor designed for industrial applications. It combines reconfigurable logic, embedded memory, and a range of hardened system IP to implement control, interface and security functions in compact systems.

With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, 58 user I/Os, and support for non-volatile reconfiguration and dedicated security functions, this device is suited for designs that require on-chip integration of glue logic, peripheral bridging and secure configuration in a small QFN package.

Key Features

• Core Logic 9,400 logic elements provide flexible reconfigurable capacity for custom control and interface functions.
• Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for register files, FIFOs and small data buffers.
• I/O and Interface Support 58 user I/Os with pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture to support a variety of interface needs.
• Security and Hardened IP Dedicated Embedded Security Block plus embedded hardened IP functions (including I2C, SPI and timer/counter cores) for system-level integration and reduced external component count.
• Clocking and Timing Flexible on‑chip clocking with sysCLOCK PLLs and an on-chip oscillator for system clock generation and phase-locked loop control.
• Non‑volatile Reconfiguration Non-volatile, reconfigurable architecture with TransFR reconfiguration support for field updates and flexible system provisioning.
• Package and Mounting 72‑VFQFN exposed pad (72‑QFN, 10 × 10) surface-mount package optimized for compact PCB layouts and thermal performance.
• Power and Environmental Supply voltage range 2.375 V to 3.465 V and industrial operating temperature range −40 °C to 100 °C for robust operation in demanding environments.
• Compliance RoHS-compliant for environmental and manufacturing standards.

Typical Applications

• Industrial Control and Automation Implement glue logic, sensor interfacing and embedded control functions using the device’s logic elements, timers and I/O resources within an industrial temperature range.
• Secure System Configuration Use the Embedded Security Block and non-volatile reconfiguration to protect configuration data and enable secure field updates.
• Peripheral Bridging and Interface Conversion Hardened I2C and SPI IP, combined with flexible I/O and source-synchronous support, make the device suitable for protocol bridging and custom interface logic.
• Timing and Clock Management On-chip PLLs and oscillator support clock generation and distribution for subsystem timing and synchronization tasks.

Unique Advantages

• Highly integrated programmable logic: 9,400 logic elements and embedded RAM reduce the need for multiple discrete components, simplifying BOM and board-level design.
• On-chip hardened peripherals: Built-in I2C, SPI and timer/counter IP accelerate development of common system functions and reduce external IC count.
• Non-volatile configuration and security: Dedicated security block and TransFR reconfiguration enable secure device provisioning and field updates without external configuration memory.
• Industrial-grade operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, thermally conscious package: 72‑VFQFN exposed pad (10 × 10) provides a small footprint with an exposed pad for improved thermal performance on surface-mount boards.
• Flexible power domain: Broad supply range (2.375 V–3.465 V) enables integration into diverse system power architectures.

Why Choose LCMXO3D-9400HC-5SG72I?

The LCMXO3D-9400HC-5SG72I positions itself as a compact, industrial-grade FPGA option that balances reconfigurable logic capacity, embedded memory and hardened system IP. Its combination of non-volatile reconfiguration, dedicated security features and flexible I/O/clocking makes it well suited for designs that require integrated control, interface bridging and secure configuration within constrained board space.

Designers seeking a scalable, reliable programmable solution for industrial and system-control applications will find the device’s logic density, on‑chip resources and industrial temperature rating valuable for reducing system complexity and supporting long-term deployment.

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