LCMXO3D-9400HC-5SG72C

IC FPGA 58 I/O 72QFN
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 58 442368 9400 72-VFQFN Exposed Pad

Quantity 420 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package72-QFN (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case72-VFQFN Exposed PadNumber of I/O58Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN5A992CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3D-9400HC-5SG72C – MachXO3D FPGA IC, 9,400 Logic Elements, 58 I/O, 72-VFQFN

The LCMXO3D-9400HC-5SG72C is a MachXO3D family field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides 9,400 logic elements and approximately 0.44 Mbits of embedded RAM in a compact 72-VFQFN exposed-pad package, targeting mid-density programmable logic and interface tasks.

Engineered for commercial-grade designs, this surface-mount FPGA combines non-volatile reconfigurability, on-chip system memory, and embedded security and peripheral IP to support control, interface bridging, and security-enabled system functions where predictable I/O and compact integration matter.

Key Features

  • Core Logic  9,400 logic elements provide mid-range programmable capacity for glue logic, protocol bridging, and custom control functions.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffering, FIFOs, and small data structures without external memory.
  • I/O and Interfaces  58 available I/O pins with support for flexible I/O buffering and pre-engineered source-synchronous I/O as described in the MachXO3D family data sheet.
  • Non-volatile, Reconfigurable Architecture  MachXO3D family features non-volatile configuration and TransFR reconfiguration modes to retain and update designs without external configuration flash.
  • Embedded Security and Hardened IP  Dedicated Embedded Security Block (ESB) and hardened peripheral IP (including SPI and timer/counter cores) are available in the device family to support protected configuration and common system functions.
  • Clocking and Timing  On-chip clocking resources including PLLs and an on-chip oscillator enable flexible system clock generation and source-synchronous interfaces.
  • Power and Supply  Single-supply operation across 2.375 V to 3.465 V simplifies integration with a range of logic-domain power rails.
  • Package and Mounting  72-VFQFN exposed pad (72-QFN, 10×10 mm) surface-mount package for compact board footprint and thermal performance.
  • Commercial Operating Range  Rated for 0 °C to 85 °C operation and specified as commercial grade.
  • Standards and Manufacturing  RoHS compliant.

Typical Applications

  • Interface Bridging  Implement protocol translators, level shifters, and I/O multiplexing using the device’s flexible I/O and embedded memory resources.
  • System Control  Use the FPGA for embedded control logic, state machines, and peripheral management in compact electronic systems.
  • Security-Enabled Modules  Leverage the MachXO3D family’s Embedded Security Block and hardened IP to add configuration protection and secure features to designs.
  • Sensor and Peripheral Hubs  Aggregate sensor data, implement small FIFOs, and manage timing with on-chip RAM and clocking resources.

Unique Advantages

  • Mid-density logic in a compact package: 9,400 logic elements in a 72-VFQFN (10×10 mm) footprint supports significant integration without a large board area.
  • On-chip memory reduces BOM: Approximately 0.44 Mbits of embedded RAM provide local buffering and FIFO capability, lowering dependence on external memory components.
  • Flexible supply support: The 2.375 V to 3.465 V supply range eases interoperability with common system power rails.
  • Built-in security and hardened IP: Dedicated security resources and hardened SPI/timer/IP block options simplify implementation of protected and reliable system functions.
  • Commercial temperature operation: Rated 0 °C to 85 °C for many consumer and commercial applications requiring predictable environmental performance.
  • RoHS compliant: Meets common environmental compliance requirements for modern electronic assemblies.

Why Choose LCMXO3D-9400HC-5SG72C?

This MachXO3D FPGA provides a balance of programmable logic density, embedded memory, and built-in system IP in a space-efficient QFN package—well suited for designs that need mid-range logic capability, flexible I/O, and on-chip security features without a large component count. Its non-volatile reconfigurability and integrated clocking and memory resources make it a practical choice for control, interface, and secure configuration tasks in commercial electronic products.

Designers seeking a compact, RoHS-compliant FPGA with clear electrical and thermal packaging parameters, a defined supply range, and commercial operating temperature coverage will find the LCMXO3D-9400HC-5SG72C applicable to a wide set of embedded use cases where board space and integration are priorities.

Request a quote or submit an order inquiry to get pricing, availability, and support for integrating the LCMXO3D-9400HC-5SG72C into your next design.

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