LCMXO3D-9400HC-6BG400C

The LCMXO3D-9400HC-6BG400C is a MachXO3D family field programmable gate array (FPGA) IC offering 9,400 logic elements with flexible on-chip resources for system control, I/O interfacing and embedded security functions. Built for commercial-grade applications, the device combines reconfigurable logic, embedded memory and a high I/O count in a 400-ball LFBGA package to support compact, integrated designs.

Its architecture includes dedicated on-chip subsystems and hardened IP building blocks (described in the family data sheet), enabling designers to implement interface bridging, glue logic, and secure configuration features while operating within a 2.375 V to 3.465 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Reconfigurable Logic 9,400 logic elements enabling a wide range of programmable functions and custom logic implementations.
• Embedded Memory Approximately 0.44 Mbits of total on-chip RAM (442,368 bits) for buffering, FIFOs and small data storage.
• High I/O Count Up to 335 I/Os for broad peripheral connectivity and multi-channel interfacing in compact system designs.
• Hardened IP and System Blocks Family-level documentation lists embedded hardened IP such as an Embedded Security Block, SPI, I²C and timer/counter functions to accelerate common system functions.
• Flexible Clocking and Oscillator On-chip clocking resources and an internal oscillator (documented for the MachXO3D family) support system timing and PLL-based clock management.
• Non-volatile, Reconfigurable Architecture MachXO3D family devices provide non-volatile reconfiguration to retain programmed functionality after power cycles (family data sheet feature).
• Package and Mounting 400-ball LFBGA package (supplier device package listed as 400-CABGA, 17×17) in a surface-mount form factor for compact board integration.
• Power and Environmental Operates from 2.375 V to 3.465 V with a commercial operating temperature range of 0 °C to 85 °C; RoHS-compliant.
• Board-Level and Test Support Family documentation describes configuration, boundary-scan (IEEE 1149.1) testability and power-on-reset features for production and debug.

Typical Applications

• Interface Bridging and Protocol Conversion Deploy the high I/O count and embedded logic to implement signal translation, bus bridging and protocol adaptation between subsystems.
• System Glue Logic Use reconfigurable logic and on-chip memory to consolidate glue logic, timing control and small state machines traditionally handled by multiple discrete components.
• Secure Configuration and Authentication Modules Leverage the family’s Embedded Security Block and non-volatile reconfiguration to add device-level security and protected boot or configuration functions.
• Peripheral Aggregation and I/O Expansion Take advantage of 335 I/Os for aggregating sensors, switches, displays and other peripherals in compact commercial systems.

Unique Advantages

• Highly Integrated Solution: Combines 9,400 logic elements, embedded memory and hardened IP in a single device to reduce BOM and board area.
• Wide I/O Density: 335 I/Os provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
• Non-volatile Reconfiguration: Maintains programmed functionality across power cycles, simplifying system initialization and reducing external configuration memory needs.
• Commercial Temperature and RoHS Compliance: Designed for commercial deployments with a 0 °C to 85 °C operating range and RoHS-compliant materials.
• Compact Package: 400-ball LFBGA (400-CABGA, 17×17) offers a dense, surface-mount footprint suitable for space-constrained boards.
• On-chip System Support: Family-level features such as internal oscillators, PLLs, user flash and configuration/test resources speed development and validation.

Why Choose LCMXO3D-9400HC-6BG400C?

The LCMXO3D-9400HC-6BG400C delivers a balanced combination of reconfigurable logic density, embedded memory and a large I/O complement in a compact 400-ball package—making it suitable for designers seeking to consolidate board-level functions and accelerate time-to-market for commercial applications. Its family-level system blocks and hardened IP reduce integration time for common tasks like serial interfaces, timing and secure configuration.

This device is well-suited to development teams and procurement groups that need a commercial-grade, surface-mount FPGA with verified family features and clear electrical and environmental operating ranges (2.375 V–3.465 V supply, 0 °C–85 °C). The result is a scalable, maintainable platform for interface logic, control functions and secure configuration in compact embedded systems.

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