LCMXO3D-9400HC-6SG72C

The LCMXO3D-9400HC-6SG72C is a MachXO3D family field-programmable gate array (FPGA) in a 72-pin VFQFN exposed-pad package. It combines a flexible FPGA fabric with embedded system features for configuration, security and I/O flexibility. Typical use cases include interface bridging, system control, and on-board logic functions where a compact, non-volatile programmable device with integrated security and flexible I/O is required.

This commercial-grade device provides 9,400 logic elements and approximately 0.44 Mbits of embedded RAM, and operates from a 2.375 V to 3.465 V supply. The 72-VFQFN (10×10) package and surface-mount mounting support compact board-level integration across a 0 °C to 85 °C operating range.

Key Features

• Core Logic — 9,400 logic elements for implementing custom glue logic, protocol conversion, and control functions.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM for buffers, FIFOs and small data structures.
• Flexible I/O — 58 user I/O pins and datasheet-described pre-engineered source-synchronous I/O and high-performance I/O buffer options to support diverse interface needs.
• Security and Configuration — Includes a dedicated embedded security block and non-volatile, reconfigurable architecture for secure boot and protected designs (features described in the MachXO3D family data sheet).
• Clocking and Timing — Flexible on-chip clocking resources including PLLs and source-synchronous support for timing-critical paths (as outlined in the device family documentation).
• Packaging and Mounting — 72-VFQFN exposed pad, supplier package 72-QFN (10×10), surface-mount mounting for compact PCB designs.
• Power and Temperature — Operates from 2.375 V to 3.465 V and rated for commercial temperature operation from 0 °C to 85 °C.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the 58 I/O pins and flexible I/O buffers to implement protocol translation, bus bridging, and board-level glue logic.
• Secure Configuration and Control — Leverage the embedded security block and non-volatile reconfigurability for protected firmware storage and secure system functions.
• Timing-Critical Functions — Employ on-chip PLLs and source-synchronous I/O features for clocking and timing-sensitive signal conditioning.
• Embedded Memory Tasks — Utilize the device’s approximately 0.44 Mbits of RAM for small buffering, FIFOs, and temporary data storage in control or interface applications.

Unique Advantages

• Flexible Integration: Combines programmable logic, on-chip RAM, and flexible I/O in a single 72-pin package to reduce BOM and board complexity.
• Compact Package: The 72-VFQFN (10×10) exposed-pad package supports dense board layouts while providing thermal return path through the exposed pad.
• Secure, Non-Volatile Operation: Built-in security and non-volatile reconfiguration enable protected deployments without external configuration memory.
• Voltage Range Compatibility: Broad supply range (2.375 V–3.465 V) accommodates a variety of system power rails and design constraints.
• Design Scalability: MachXO3D family architectural features (clocking, configurable I/O, embedded IP blocks) allow reuse across multiple designs within the family.

Why Choose LCMXO3D-9400HC-6SG72C?

The LCMXO3D-9400HC-6SG72C positions as a compact, commercial-grade FPGA solution for designs requiring programmable logic, flexible I/O and on-chip memory within a small-footprint QFN package. With 9,400 logic elements, embedded security capabilities, and family-level features for clocking and I/O, it addresses common board-level functions such as interface bridging, secure configuration, and timing-critical control tasks.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with a defined commercial temperature range and a balance of logic density and embedded memory will find this MachXO3D device suitable for space-conscious, integrated system designs.

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