LCMXO3D-9400HC-6BG484C

The LCMXO3D-9400HC-6BG484C is a MachXO3D-series Field Programmable Gate Array (FPGA) in a 484-LFBGA package. It delivers a non-volatile, reconfigurable architecture with up to 9,400 logic elements and extensive I/O for use in commercial embedded designs.

With on-chip memory, dedicated embedded security and hardened peripheral IP cores listed in the product data, this device targets applications that require flexible on-chip resources, high I/O density and system-level features such as programmable clocks and configuration storage.

Key Features

• Core Capacity — Approximately 9,400 logic elements supported by 1,175 logic array blocks, enabling medium-density FPGA implementations.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs or small on-chip storage.
• High I/O Density — 383 I/O pins provide broad interfacing options for parallel peripherals and board-level connectivity.
• Non-volatile, Reconfigurable Architecture — MachXO3D family characteristics include non-volatile configuration and support for reconfiguration flows in system designs.
• Dedicated Embedded Security Block — Device family includes a dedicated security block for integrating security functions as described in the datasheet.
• Hardened Peripheral IP — Embedded hardened IP functions such as I²C, SPI and timer/counter cores are included in the device family documentation.
• Flexible On-chip Clocking — Architecture and sysCLOCK Phase Locked Loops (PLLs) are part of the device family to support flexible clocking topologies.
• Programmable I/O and Source-synchronous Support — The family provides programmable I/O cells and source-synchronous I/O options to support a variety of interface standards and timing modes.
• User Flash Memory (UFM) — On-device UFM for application data or configuration storage is part of the MachXO3D feature set.
• Package and Mounting — 484-LFBGA (484-CABGA, 19×19) surface-mount package suitable for compact board-level integration.
• Power and Temperature — Supported supply range of 2.375 V to 3.465 V and commercial operating temperature range from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use as configurable glue logic, interface bridging and system control where medium FPGA capacity and high I/O count are required.
• Security and Configuration Management — Leverage the device’s embedded security block and user flash memory for secure boot configuration or protected keys in commercial products.
• Peripheral and Interface Handling — High I/O density and hardened SPI/I²C IP make the device suitable for handling multiple serial interfaces, sensors and peripheral buses in compact boards.
• Clocking and Timing Control — Integrated PLLs and on-chip clocking resources support applications that require programmable clock distribution and source-synchronous I/O.

Unique Advantages

• Balanced Logic and Memory — The combination of ~9,400 logic elements with ~0.44 Mbits of embedded RAM provides a balanced resource mix for mid-range FPGA functions without requiring external memory for many control and buffering tasks.
• High I/O Integration — 383 I/O pins reduce the need for additional interface components, simplifying BOM and board routing for I/O-heavy designs.
• On-device Security and Hardened IP — Built-in security block and hardened peripheral cores reduce development time for secure and peripheral-rich applications.
• Non-volatile Configuration — Reconfigurable, non-volatile architecture enables stored configuration and field updates without external flash devices.
• Compact Packaging — 484-LFBGA (19×19) delivers high pin count in a compact footprint for space-constrained commercial applications.
• Commercial Temperature Support — Rated for 0 °C to 85 °C operation, matching typical commercial electronics deployment environments.

Why Choose LCMXO3D-9400HC-6BG484C?

The LCMXO3D-9400HC-6BG484C positions itself as a versatile, mid-density MachXO3D FPGA option that balances logic capacity, on-chip memory and exceptional I/O count in a compact 484-LFBGA package. Its on-device security block, hardened peripheral IP and reconfigurable non-volatile architecture make it well suited for commercial embedded systems that require secure configuration, flexible interfacing and integrated clocking resources.

Choose this device when your design needs a single-chip solution to consolidate glue logic, interface handling and control functions while maintaining room for system-level features and future reconfiguration. The MachXO3D family documentation provides additional architectural and IP details to support integration and deployment.

Request a quote or submit your procurement inquiry to receive pricing and lead-time information for the LCMXO3D-9400HC-6BG484C. Our team can assist with availability and ordering for your project needs.