LCMXO3D-9400HC-6SG72I

The LCMXO3D-9400HC-6SG72I is a MachXO3D family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 9,400 logic elements with approximately 0.42 Mbits of embedded RAM, and 58 general-purpose I/O pins in a 72‑VFQFN exposed pad package.

Engineered for industrial applications, this non-volatile, reconfigurable device combines flexible I/O, embedded memory, and dedicated security and system IP blocks described in the MachXO3D family datasheet to support security-enabled embedded designs and I/O-rich control functions.

Key Features

• Logic Capacity — 9,400 logic elements for implementing glue logic, control state machines, and custom digital functions.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (442,368 total bits) for data buffering, LUT storage, and small local memories.
• I/O and Interface — 58 I/O pins with MachXO3D family features such as pre‑engineered source synchronous I/O and flexible on‑chip I/O buffers for a range of interface requirements.
• Security and Hardened IP — Family-level features include a dedicated Embedded Security Block and hardened IP cores (for example: I²C, SPI, timer/counter) to simplify secure and reliable system design.
• Clocking and Timing — Built-in clocking resources including sysCLOCK PLLs and an on‑chip oscillator are part of the MachXO3D family architecture for flexible clock management.
• Non‑volatile Reconfiguration — MachXO3D family supports non‑volatile, reconfigurable operation and TransFR reconfiguration mechanisms described in the datasheet.
• Power and Supply — Operates from a 2.375 V to 3.465 V supply range to support common system voltage rails.
• Package and Mounting — 72‑VFQFN exposed pad (72‑QFN, 10×10 mm) surface‑mount package for compact board integration and thermal performance.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Industrial Control — Implement machine control logic, I/O expansion, and secure configuration storage in industrial systems operating across −40 °C to 100 °C.
• Security‑Enabled Embedded Systems — Use the device’s embedded security block and hardened IP to protect configuration and enable trusted functions in embedded designs.
• I/O Bridging and Interface Conversion — Leverage flexible I/O buffers and source‑synchronous I/O capabilities to create protocol bridges and interface controllers with up to 58 I/Os.
• System Glue Logic — Replace multiple discrete components by implementing custom glue logic, state machines, and small memory-based functions on-chip.

Unique Advantages

• Compact, Surface‑Mount Integration: 72‑VFQFN exposed pad package enables a small PCB footprint with improved thermal dissipation for dense system designs.
• Non‑volatile, Reconfigurable Design: On-chip non‑volatile configuration and MachXO3D reconfiguration features reduce external configuration complexity and enable in-field updates.
• Embedded Security and Hardened IP: Built-in security block and hardened interfaces (I²C, SPI, timers) reduce development time and help centralize critical system functions.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS compliance for deployment in industrial environments.
• Flexible Power Support: Wide supply range (2.375 V–3.465 V) accommodates multiple system rail configurations without requiring specialized power conversion.

Why Choose LCMXO3D-9400HC-6SG72I?

LCMXO3D-9400HC-6SG72I positions itself as a mid-density, industrial-grade MachXO3D FPGA that balances programmable logic capacity, embedded memory, and an array of family-level system features—such as dedicated security, hardened IP, and flexible clocking—into a compact 72‑VFQFN package. Its combination of 9,400 logic elements, ~0.42 Mbits of RAM, and 58 I/Os makes it well suited for engineers seeking a reconfigurable, non‑volatile device for control, interface, and secure embedded tasks.

Backed by the MachXO3D family architecture from Lattice Semiconductor Corporation, this device provides a pathway for scalable designs that require on‑chip security, flexible I/O, and robust temperature performance for industrial applications.

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