LCMXO3D-9400HE-5UTG69ITR
| Part Description |
MachXO3D Field Programmable Gate Array (FPGA) IC 58 442368 9400 69-WFBGA, WLCSP |
|---|---|
| Quantity | 160 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 69-WLCSP (5.19x6.22) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 69-WFBGA, WLCSP | Number of I/O | 58 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3D-9400HE-5UTG69ITR – MachXO3D FPGA, 9,400 Logic Elements, 69‑WLCSP
The LCMXO3D-9400HE-5UTG69ITR is a MachXO3D Field Programmable Gate Array (FPGA) IC designed for programmable logic implementations. It provides a combination of logic capacity, embedded memory, and a compact WLCSP package suitable for surface-mount board designs across industrial temperature ranges.
Key Features
- Logic Capacity 9,400 logic elements with 1,175 LABs to implement custom logic, glue logic, and control functions.
- Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, small data storage, and state retention.
- I/O 58 user I/O pins to support multiple peripheral interfaces and signal routing within a compact footprint.
- Power Core supply range of 1.14 V to 1.26 V for predictable power budgeting and supply design.
- Package and Mounting 69‑WFBGA WLCSP package (supplier device package: 69‑WLCSP, 5.19 × 6.22 mm) optimized for surface-mount assembly and space-constrained layouts.
- Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in temperature-variable environments.
- Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Custom Logic Integration Implement glue logic, protocol translation, and custom state machines using the device's 9,400 logic elements and LAB resources.
- I/O Expansion and Interface Control Use the 58 I/O pins to aggregate peripheral signals and manage board-level interfacing in compact designs.
- On‑Chip Data Buffering Leverage the approximately 0.42 Mbits of embedded RAM for small FIFO/buffer tasks and local data storage.
Unique Advantages
- Balanced Logic and Memory: The combination of 9,400 logic elements and 442,368 bits of RAM supports both control logic and modest data buffering without external memory.
- Compact WLCSP Packaging: The 69‑WLCSP (5.19 × 6.22 mm) package minimizes PCB area while preserving I/O count for dense board designs.
- Industrial Temperature Support: Rated for −40 °C to 100 °C operation to accommodate a wide range of deployment environments.
- Low-Voltage Core: A defined core supply range of 1.14 V to 1.26 V enables tight power-supply design and predictable thermal behavior.
- Surface-Mount Ready: Surface-mount mounting type simplifies automated assembly and integration into modern production workflows.
- RoHS Compliance: Conforms to RoHS requirements for environmentally conscious manufacturing and distribution.
Why Choose LCMXO3D-9400HE-5UTG69ITR?
The LCMXO3D-9400HE-5UTG69ITR provides a practical balance of logic density, embedded memory, and I/O in a compact 69‑WLCSP package, making it suitable for space-constrained, industrial-temperature designs that require on-board programmable logic. Its defined voltage range, surface-mount form factor, and RoHS compliance support straightforward integration into production hardware.
This device is well suited to designers needing a programmable solution that combines moderate logic capacity with local RAM and reliable thermal performance, offering a scalable option within MachXO3D-class FPGA deployments.
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