LCMXO3D-9400ZC-2BG256C

The LCMXO3D-9400ZC-2BG256C is a member of the MachXO3D FPGA family, offering a non-volatile, reconfigurable fabric with integrated system-level features. It targets moderate-density logic designs that require flexible I/O and on-chip memory for glue logic, control functions, and interface bridging.

With 9,400 logic elements, 206 user I/Os and approximately 0.44 Mbits of embedded RAM, this surface-mount 256-LFBGA device provides a compact, configurable platform for consumer and communications applications that operate within a commercial 0 °C to 85 °C range and a 2.375 V to 3.465 V supply window.

Key Features

• Logic Capacity — 9,400 logic elements suitable for moderate-density FPGA designs and control logic integration.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffers, small FIFOs, and state storage; includes User Flash Memory (UFM) capability in the MachXO3D family.
• I/O and Interfaces — 206 general-purpose I/Os with support for pre-engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture described in the family datasheet.
• Security and Hardened IP — Dedicated Embedded Security Block and a selection of hardened IP building blocks (including hardened I2C, SPI and timer/counter functions) as part of the MachXO3D family feature set.
• Clocking and Reconfiguration — Flexible on-chip clocking with PLL support, on-chip oscillator and TransFR reconfiguration options for in-system updates and clock management.
• Package and Mounting — 256-LFBGA package (supplier reference 256-CABGA, 14×14 mm) in a surface-mount form factor for compact PCB implementations.
• Power and Temperature — Operates from 2.375 V to 3.465 V and is specified for commercial-grade operation from 0 °C to 85 °C; includes standby and power-saving options in the device family documentation.
• Compliance — RoHS compliant.

Typical Applications

• Consumer Electronics — Glue logic, user interface control and protocol bridging where compact package and non-volatile configuration are required.
• Communications Equipment — Control plane functions, packet buffering and interface adaptation using flexible I/O and on-chip memory resources.
• IoT and Edge Devices — Local aggregation, pre-processing and secure control functions leveraging embedded security and reconfigurable logic.
• Test, Measurement and Prototyping — Rapid hardware iteration and customizable I/O for instrumentation front-ends and evaluation platforms.

Unique Advantages

• Non-volatile, reconfigurable architecture: Eliminates the need for external configuration flash while enabling in-field updates and persistent device state.
• Balanced logic and memory: 9,400 logic elements combined with approximately 0.44 Mbits of embedded RAM supports diverse glue-logic, buffering and control implementations without large external RAM requirements.
• High I/O count in a compact package: 206 I/Os in a 256-LFBGA (14×14 mm) package enables dense connectivity for multi-interface designs while conserving PCB area.
• Integrated system IP and security: Dedicated embedded security and hardened peripheral IP reduce development time for secure and deterministic system functions.
• Flexible clocking and reconfiguration: On-chip oscillator, PLLs and TransFR support enable adaptable timing architectures and convenient in-system updates.
• Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS-compliant materials for mainstream electronics production.

Why Choose LCMXO3D-9400ZC-2BG256C?

The LCMXO3D-9400ZC-2BG256C fits designs that need a moderate-density, non-volatile FPGA with ample I/O and on-chip memory in a compact surface-mount package. Its MachXO3D-family capabilities — including dedicated security blocks, hardened peripheral IP, flexible on-chip clocking and reconfiguration options — make it well suited for consumer, communications and edge applications that require reliable, configurable logic without external configuration storage.

This device is appropriate for engineering teams seeking a scalable, documented FPGA platform with a balanced mix of logic, memory and connectivity to simplify board-level design and reduce BOM complexity.

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