LCMXO3D-9400ZC-2BG256I

The LCMXO3D-9400ZC-2BG256I is a MachXO3D family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 9,400 logic elements and embedded memory in a non-volatile, reconfigurable architecture suitable for industrial designs.

With 206 I/O, approximately 0.44 Mbits of total on-chip RAM, and support for a 2.375 V to 3.465 V supply range, this device targets system-level control, I/O interfacing and logic integration where industrial temperature operation and compact packaging are required.

Key Features

• Core Logic — 9,400 logic elements (cells) enabling flexible implementation of glue logic, control functions, and user logic.
• Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for FIFOs, buffers, or small data stores.
• I/O Density — 206 user I/O pins to support high pin-count interfacing and signal routing in compact designs.
• Non-volatile Reconfigurable Architecture — MachXO3D family features non-volatile, reconfigurable operation for persistent configuration without external configuration memory.
• Dedicated Security and Hardened IP — Family-level features include a dedicated Embedded Security Block and hardened peripheral IP cores (as described in the MachXO3D datasheet).
• Clocking and Timing — On-chip PLLs and flexible clocking options are part of the MachXO3D architecture to support synchronous designs (see datasheet for details).
• Power and Voltage — Supports supply voltages from 2.375 V to 3.465 V, enabling compatibility with a range of system power rails.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Package — 256-pin LFBGA package; supplier device package listed as 256-CABGA (14×14) to support compact PCB implementations and high-density routing.
• Standards and Support — The MachXO3D family datasheet documents features such as pre-engineered source synchronous I/O, programmable I/O cells, and system-level support functions (refer to the datasheet for full details).

Typical Applications

• Control and Glue Logic — Implement board-level control, protocol bridging, and state machines using the device’s logic elements and on-chip memory.
• I/O Expansion and Interface Bridging — Use the 206 I/Os and on-chip timing resources for bus interfacing, level translation, and signal aggregation.
• Security and Authentication Modules — Leverage the MachXO3D family’s dedicated Embedded Security Block and hardened IP for secure key storage and authentication functions (see datasheet).
• Embedded System Utilities — Implement timers, SPI/I²C interfaces, and other peripheral offloads using the device’s hardened IP and configurable logic.

Unique Advantages

• High Logic Capacity: 9,400 logic elements provide the density to integrate multiple control and interface functions on a single device, reducing board complexity.
• Significant On-Chip Memory: Approximately 0.44 Mbits of embedded RAM supports FIFOs, buffers, and small data structures without external memory.
• Extensive I/O Count: 206 I/Os enable broad connectivity for multi-sensor systems, bus interfaces, and dense peripheral routing.
• Industrial Temperature Range: Operation from −40 °C to 100 °C makes this device suitable for challenging thermal environments.
• Compact, High-Density Package: 256-LFBGA (supplier 256-CABGA 14×14) delivers a small PCB footprint while preserving routing capability for complex designs.
• Flexible Supply Range: Support for 2.375 V to 3.465 V supplies allows integration into a variety of system power architectures.

Why Choose LCMXO3D-9400ZC-2BG256I?

The LCMXO3D-9400ZC-2BG256I combines a moderate logic fabric, substantial embedded RAM, and high I/O density in a non-volatile, reconfigurable MachXO3D architecture. Its industrial temperature rating and flexible voltage range make it a practical choice for embedded systems that require persistent configuration, secure blocks, and integrated peripheral IP.

This device suits engineers who need to consolidate control, interfacing, and security functions into a single compact FPGA package, while relying on the documented MachXO3D feature set for system-level capabilities and integration.

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