LCMXO3D-9400ZC-2SG72I

The LCMXO3D-9400ZC-2SG72I is a MachXO3D family FPGA from Lattice Semiconductor Corporation offering non-volatile, reconfigurable logic in an industrial-grade package. Designed for moderate-density logic integration, this device combines approximately 9,400 logic elements with on-chip memory and flexible I/O to address system glue logic, I/O expansion, and security-enabled embedded applications.

Built for surface-mount deployment, the device is supplied in a 72-VFQFN exposed-pad package (72-QFN, 10 × 10 mm) and supports a wide supply range and industrial operating temperatures, making it suitable for robust embedded system designs.

Key Features

• Logic Density  Approximately 9,400 logic elements for implementing mid-range combinational and sequential logic.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for data buffering, FIFOs, and small memory structures.
• I/O Capability  58 general-purpose I/O pins plus family-level support for pre‑engineered source-synchronous I/O and flexible, high-performance I/O buffering.
• Clocking and Timing  Flexible on-chip clocking architecture including PLLs and an on-chip oscillator for system clocking and timing requirements.
• Dedicated Embedded Security Block  Family-level embedded security features to support secure configuration and system-level protection.
• Hardened Embedded IP  Includes family-level hardened IP such as I²C, SPI, and timer/counter functions to simplify common peripheral integration.
• Non-volatile, Reconfigurable  MachXO3D family architecture provides non-volatile configuration and TransFR reconfiguration options at the family level.
• Package and Mounting  72-VFQFN exposed-pad (72-QFN, 10 × 10 mm) surface-mount package for compact board footprint and thermal performance.
• Power and Temperature  Supply voltage range of 2.375 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C.
• Standards and Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Use as configurable control logic, I/O interfacing, and deterministic glue logic within industrial systems operating across an industrial temperature range.
• Interface Bridging & System Glue  Implement protocol conversion, pin remapping and timing adaptation between subsystems using flexible I/O and embedded memory.
• Security-enabled Embedded Systems  Leverage the device’s dedicated embedded security block and non-volatile configuration for protected boot and secure system functions.
• Peripheral Integration  Accelerate integration of common peripherals using hardened I²C, SPI, and timer/counter IP to reduce external component count.

Unique Advantages

• Compact, production-ready package  72-VFQFN exposed-pad (10 × 10 mm) surface-mount package supports compact board designs while providing thermal relief via the exposed pad.
• Industrial operating range  Rated for −40 °C to 100 °C to meet demanding embedded and industrial environment requirements.
• Integrated security and memory  Dedicated Embedded Security Block plus on-chip flash-backed memory capabilities deliver secure configuration and local storage without extra components.
• Flexible I/O and clocking  Pre-engineered source-synchronous I/O, flexible buffer options, PLLs and an on-chip oscillator simplify timing-critical interfacing tasks.
• Reduced BOM and faster integration  Hardened peripheral IP (I²C, SPI, timer/counter) and built-in memory reduce the need for external devices and speed time-to-market.
• RoHS compliant  Meets environmental compliance requirements for lead-free manufacturing.

Why Choose LCMXO3D-9400ZC-2SG72I?

The LCMXO3D-9400ZC-2SG72I positions itself as a flexible, industrial-grade solution for designers needing moderate logic density, embedded memory, and secure, reconfigurable functionality in a compact package. Its combination of approximately 9,400 logic elements, roughly 0.44 Mbits of on-chip RAM, hardened peripheral IP, and dedicated security capabilities addresses common system requirements while reducing external components.

This MachXO3D device is well suited for embedded system designers focused on reliable, reconfigurable I/O bridging, secure boot/configuration needs, and compact board-level integration. Family-level features such as flexible clocking, on-chip oscillator, and enhanced system-level support help ensure scalable deployment across multiple product variants.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical information for the LCMXO3D-9400ZC-2SG72I.