LCMXO3D-9400ZC-2BG400C

The LCMXO3D-9400ZC-2BG400C is a MachXO3D family FPGA device offering non-volatile, reconfigurable logic in a 400-ball LFBGA package. It combines approximately 9,400 logic elements, extensive I/O and embedded memory to address system control, interface bridging and configurable logic needs in commercial-grade designs.

Designed for surface-mount assembly, this device supports a wide supply voltage range (2.375 V to 3.465 V) and operates across a commercial temperature range of 0 °C to 85 °C, providing a balance of integration and configurability for embedded systems and interface-centric applications.

Key Features

• Core Logic — Approximately 9,400 logic elements enable complex glue logic, protocol adaptation and custom control functions.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffering, FIFOs or small local storage implementations as documented in the MachXO3D family data sheet.
• High I/O Count — 335 configurable I/O pins to support wide parallel interfaces, multiple peripherals or dense signal routing.
• Non-volatile, Reconfigurable Architecture — Family-level capability for non-volatile configuration and in-field reconfiguration mechanisms described in the MachXO3D data sheet.
• Embedded Security and Hardened IP — Includes a dedicated Embedded Security Block (ESB) IP core and other hardened functions referenced in the family data sheet for system-level features.
• Flexible I/O and Clocking — Pre-engineered source-synchronous I/O, flexible on-chip clocking and I/O buffer options are included in the MachXO3D family documentation.
• Package & Mounting — 400-LFBGA (400-CABGA, 17 × 17 mm) surface-mount package for compact board-level integration.
• Power and Temperature — Supply range 2.375 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s high I/O count and reconfigurable logic to implement signal adaptation and protocol translation between disparate subsystems.
• Embedded Control — Implement custom state machines, control logic and peripheral supervision leveraging the available logic elements and on-chip memory.
• Peripheral Aggregation — Aggregate and manage multiple sensor or I/O channels with the device’s dense pinout and embedded RAM for buffering.
• Security-Aware Designs — Integrate system-level security functions using the family’s dedicated Embedded Security Block and hardened IP cores.

Unique Advantages

• Highly configurable logic resources: Approximately 9,400 logic elements let you implement tailored digital functions without changing silicon.
• Significant on-chip buffering: Around 0.44 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
• Extensive I/O flexibility: 335 I/Os support dense connectivity for multi‑interface and multi‑sensor applications, simplifying PCB routing and BOM.
• Compact, production-ready package: 400-LFBGA (17×17 mm) surface-mount package balances board space and thermal considerations for commercial products.
• Configurable security and IP blocks: Embedded security and hardened IP functions provide building blocks for protected designs and common system functions.
• Broad supply tolerance: Operates across a 2.375 V to 3.465 V supply range to accommodate common system power rails.

Why Choose LCMXO3D-9400ZC-2BG400C?

The LCMXO3D-9400ZC-2BG400C positions itself as a flexible, non-volatile FPGA solution for commercial embedded systems that require a balance of logic capacity, I/O density and on-chip memory. Its MachXO3D family architecture—including dedicated security and hardened IP blocks—helps reduce external components while enabling in-field configurability and system-level integration.

This device is well suited for designers building interface-rich products, control subsystems and compact embedded modules who need verified family-level features and a production-ready 400-LFBGA package backed by the MachXO3D family documentation.

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