LCMXO3D-9400ZC-2SG72C

The LCMXO3D-9400ZC-2SG72C is a MachXO3D family FPGA IC offering 9,400 logic elements and on-chip non-volatile reconfigurable architecture. Designed for board-level integration, this surface-mount device delivers flexible I/O, embedded memory, and hardened system-level IP to address glue-logic, interface bridging and control functions in commercial electronic designs.

With a compact 72‑VFQFN exposed-pad package and a wide supply range, the device targets space-constrained, low- to mid-complexity digital designs that require in-field reconfiguration, embedded memory, and integrated system functions.

Key Features

• Programmable Core 9,400 logic elements for implementing combinational and sequential logic functions and custom finite-state machines.
• Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for data buffering, FIFOs and small memory structures.
• I/O Capacity & Flexibility 58 user I/O pins supported by the MachXO3D family’s high-performance, flexible I/O buffer architecture and pre‑engineered source‑synchronous I/O features described in the family data sheet.
• Embedded Security & Hardened IP Includes a dedicated Embedded Security Block (ESB) and multiple embedded hardened IP functions (I2C, SPI, timer/counter) as part of the MachXO3D family feature set.
• Clocking & Timing Flexible on‑chip clocking with PLLs and clock distribution options included in the family architecture for synchronized system timing.
• Non-volatile, Reconfigurable MachXO3D family devices provide non-volatile configuration and support reconfiguration mechanisms referenced in the family data sheet.
• Package & Mounting 72‑VFQFN exposed pad (supplier package: 72‑QFN, 10×10 mm) in a surface-mount form factor for compact PCB integration and thermal path through the exposed pad.
• Power & Temperature Supported supply range: 2.375 V to 3.465 V. Commercial operating temperature range: 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic Use the device’s flexible I/O and 9,400 logic elements to implement protocol translation and board-level glue reduction.
• Sensor and Control Aggregation On-chip RAM and embedded timers/counters simplify buffering and timing for sensor interfaces and control tasks.
• Boot and Configuration Management Non-volatile reconfigurable capability supports system initialization, in-field updates and configurable boot logic.
• Compact Embedded Systems The 72‑VFQFN exposed-pad package and surface-mount mounting suit compact PCBs where thermal path and board space matter.

Unique Advantages

• Integrated Logic and Memory: 9,400 logic elements paired with approximately 0.42 Mbits of embedded RAM reduce the need for external glue logic and RAM in many designs.
• System-Level IP Onboard: Dedicated Embedded Security Block and hardened I2C/SPI/timer IP from the MachXO3D family accelerate development of common system functions.
• Flexible I/O and Clocking: Pre‑engineered source-synchronous I/O and on‑chip PLLs provide adaptable timing and interface options for a variety of peripherals and buses.
• Compact, Thermally-Aware Package: 72‑pin VFQFN with exposed pad (10×10 mm supplier package) enables compact board layouts with a direct thermal path to the PCB.
• Wide Supply Compatibility: Operates across a 2.375 V to 3.465 V supply window to accommodate typical commercial logic domains.
• Compliance and Assembly: Surface-mount package and RoHS compliance support modern PCB assembly and environmental requirements.

Why Choose LCMXO3D-9400ZC-2SG72C?

The LCMXO3D-9400ZC-2SG72C positions itself as a practical, compact FPGA option for commercial embedded designs that require moderate logic density, embedded memory and hardened system functions. Its combination of 9,400 logic elements, approximately 0.42 Mbits of on‑chip RAM and dedicated security/IP blocks makes it suitable for control, interface and configuration tasks where integration and board space are priorities.

Engineers designing compact, reconfigurable systems will find the device’s package, voltage range and I/O capacity a clear fit for applications demanding in-field reconfiguration, protocol adaptation, and embedded control without moving to larger FPGA families.

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