LCMXO3D-9400ZC-3BG256I

The LCMXO3D-9400ZC-3BG256I is a MachXO3D family FPGA IC from Lattice Semiconductor. It combines reconfigurable non-volatile logic with embedded memory and system-level IP to address industrial embedded control, I/O consolidation, and secure system functions.

With 9,400 logic elements, approximately 0.42 Mbits of embedded memory, and 206 user I/Os in a compact 256-LFBGA (256-CABGA 14×14) surface-mount package, this industrial-grade device targets designs that require flexible I/O, on-chip security primitives, and field reconfigurability within an extended temperature range.

Key Features

• Core Logic — 9,400 logic elements provide programmable fabric suitable for control, glue-logic, and custom peripheral implementations.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (442,368 total bits) for FIFOs, buffers, and small data structures.
• I/O Capacity & Flexibility — 206 user I/Os with pre-engineered source-synchronous I/O support and a high-performance, flexible I/O buffer architecture described in the MachXO3D family data sheet.
• System IP & Security — Includes an Embedded Security Block and multiple hardened IP functions (I2C, SPI, timer/counter and others) to reduce external components and accelerate system integration.
• Clocking & Timing — Flexible on-chip clocking with sysCLOCK PLLs and on-chip oscillator options for local clock generation and deskewing.
• Non-volatile Reconfiguration — Reconfigurable, non-volatile device architecture with TransFR reconfiguration and user flash memory (UFM) support for field updates and configuration storage.
• Power & Voltage — Operates from a supply range of 2.375 V to 3.465 V to accommodate common system rails.
• Package & Mounting — 256-LFBGA (supplier package 256-CABGA, 14×14) surface-mount package for compact board-level integration.
• Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, sensor interfacing, and local I/O aggregation using the device’s logic capacity, embedded memory, and extended temperature rating.
• Secure System Functions — Use the Embedded Security Block and on-chip non-volatile configuration to store and protect keys, manage secure boot flows, or isolate critical system functions.
• I/O Expansion and Interface Bridging — Consolidate multiple interfaces and perform protocol translation or timing adaptation with the device’s flexible I/O buffering and source-synchronous I/O support.
• Embedded Gateware & Peripheral Offload — Offload deterministic tasks (timers, SPI/I2C handling, protocol preprocessing) to hardened IP blocks and programmable logic to free main CPU resources.

Unique Advantages

• Compact, Non‑volatile FPGA — Combines reconfigurable logic with non-volatile configuration to simplify board-level design and eliminate external configuration memories.
• Integrated System IP — Hardened I/O protocols and utility blocks reduce bill of materials and speed development compared with discrete implementations.
• Strong I/O and Memory Balance — 206 I/Os and approximately 0.42 Mbits of embedded RAM support complex interface handling and local buffering without external memories.
• Extended Operating Range — Industrial temperature specification (−40 °C to 100 °C) makes the device suitable for harsher environments.
• Flexible Clocking and Timing — On-chip PLLs and oscillator provide multiple clocking options for synchronous designs and source-synchronous interfaces.
• Industry Compliance — RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose LCMXO3D-9400ZC-3BG256I?

The LCMXO3D-9400ZC-3BG256I is positioned as a versatile, industrial-grade MachXO3D FPGA that balances logic density, embedded memory, and broad I/O capacity in a compact 256-LFBGA package. Its combination of hardened IP, embedded security, and non-volatile reconfiguration addresses designs that need reliable field updates, protocol handling, and system-level consolidation.

This device is well suited for engineers and procurement teams building industrial control systems, secure embedded appliances, and interface-intensive applications where board space, configurability, and thermal robustness matter. The MachXO3D family data sheet provides detailed architecture and implementation guidance for system integration and verification.

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