LCMXO3D-9400ZC-3SG72C

The LCMXO3D-9400ZC-3SG72C is a MachXO3D field programmable gate array (FPGA) from Lattice Semiconductor. It provides a flexible, non-volatile FPGA architecture with on-chip memory and embedded system features suitable for glue logic, interface bridging, and integrated control functions in commercial-grade designs. The device combines 9,400 logic elements, a comprehensive I/O set, and family-level capabilities such as embedded security and flexible on-chip clocking to simplify system integration and reduce board-level complexity.

Key Features

• Core Logic  Approximately 9,400 logic elements (cells) provide programmable fabric for glue logic, state machines, and control functions.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for FIFOs, buffering, and small data storage.
• I/O Capacity  58 configurable I/O pins support flexible interface implementation and signal routing.
• Supply Voltage  Wide operating supply range from 2.375 V to 3.465 V to accommodate common digital I/O standards and system rails.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications.
• Package and Mounting  72-VFQFN exposed pad (supplier package: 72-QFN, 10×10) in a surface-mount package for compact PCB layouts and thermal anchoring.
• Family-Level Features  MachXO3D family capabilities include flexible architecture, dedicated embedded security block, pre‑engineered source-synchronous I/O, high-performance flexible I/O buffers, flexible on‑chip clocking, and TransFR reconfiguration (as documented in the MachXO3D device family data sheet).
• Regulatory  RoHS compliant.

Typical Applications

• System Glue Logic  Implement board-level control, bus bridging, and customization of digital interfaces where flexible logic and on-chip RAM reduce external components.
• I/O Expansion and Interface Bridging  Use the device’s 58 I/Os and flexible I/O buffering to adapt between different logic standards and manage signal routing between subsystems.
• Embedded Control and Sequencing  Deploy as a control engine for device sequencing, mode management, and small state-machine implementations using the on-chip logic and memory.
• Secure Configuration and System Protection  Leverage the MachXO3D family’s embedded security block for secured device configuration and protection workflows as part of system-level design.

Unique Advantages

• Compact, Surface-Mount Package: The 72-VFQFN exposed-pad package (72-QFN, 10×10) enables dense PCB implementation and efficient thermal dissipation.
• Balanced Logic and Memory: 9,400 logic elements paired with approximately 0.44 Mbits of embedded RAM supports a wide range of control and buffering use cases without large external memory.
• Flexible Power Integration: Wide voltage supply window (2.375 V to 3.465 V) fits many common digital system rails and simplifies supply design.
• Design-Level Security: Family-level embedded security resources help protect configuration and support secure system features.
• Commercial-Grade Availability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments.

Why Choose LCMXO3D-9400ZC-3SG72C?

The LCMXO3D-9400ZC-3SG72C delivers a practical combination of programmable logic density, on-chip RAM, and flexible I/O in a compact surface-mount package for commercial designs. It is well suited for engineers seeking to consolidate glue logic and interface functions into a single, reconfigurable device while leveraging MachXO3D family capabilities such as embedded security and flexible clocking.

This part is a fit for teams building compact, integrated systems that require reliable commercial-temperature operation, moderate logic capacity, and versatile I/O in a RoHS-compliant package.

Request a quote or submit a product inquiry to start the procurement process for LCMXO3D-9400ZC-3SG72C and evaluate its fit for your next design.