LCMXO3L-1300C-5BG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA |
|---|---|
| Quantity | 299 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3L-1300C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA
The LCMXO3L-1300C-5BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) supplied in a 256-ball LFBGA package. It provides 1,280 logic elements and 65,536 bits of on-chip RAM with up to 206 I/Os, delivering a compact, reprogrammable building block for commercial embedded designs.
Designed for commercial-temperature systems, this MachXO3 device combines non-volatile, multi-time programmable configuration with integrated I/O and embedded system features to simplify peripheral control, interface bridging, and system glue logic within a single surface-mount package.
Key Features
- Logic Capacity Approximately 1,280 logic elements for implementing glue logic, finite state machines and small- to mid-scale FPGA functions.
- On-chip Memory 65,536 bits of embedded RAM (sysMEM) suitable for FIFOs, small data buffers, or configuration storage.
- I/O Density Up to 206 general-purpose I/O pins to support wide peripheral connectivity and parallel interfaces.
- Non‑volatile, Multi‑time Programmable Configuration MachXO3 family architecture provides non-volatile configuration and support for reprogramming in-system.
- Embedded Hardened IP Family-level features include hardened I²C and SPI IP cores and timer/counter functionality for offloading common peripheral tasks.
- Clocking and Oscillator On-chip oscillator and support for phase-locked loops (PLLs) for flexible on-chip clocking and timing management as described in the MachXO3 family documentation.
- Package and Mounting 256-LFBGA (supplier package 256-CABGA, 14×14 mm) surface-mount package for compact board integration.
- Power and Operating Range Supported supply range of 2.375 V to 3.465 V and commercial operating temperature from 0 °C to 85 °C.
- System and Test Features Family datasheet details configuration and boundary-scan testability functions to support manufacturing test and in-system programming.
- Compliance RoHS-compliant device for regulatory and manufacturing compliance.
Typical Applications
- Interface Bridging and Glue Logic Use the reprogrammable logic and abundant I/O to consolidate protocol translation, bus interfacing, and glue logic into a single component.
- Peripheral and Sensor Control Leverage embedded timers, SPI/I²C IP and multiple I/Os to manage sensors, actuators and local peripherals without an external microcontroller for simple control tasks.
- System Integration and Prototyping Non-volatile, reprogrammable configuration and on-chip memory make the device suitable for evolving designs and rapid iterations in commercial systems.
Unique Advantages
- Integrated, Reprogrammable Functionality: Non-volatile, multi-time programmable configuration reduces the need for external flash and simplifies system boot architecture.
- High I/O Count in a Compact Package: 206 I/Os in a 256-LFBGA package enable dense connectivity while keeping board space minimal.
- Embedded Peripheral IP: Hardened I²C, SPI and timer/counter blocks accelerate peripheral interfacing and reduce firmware development burden.
- Flexible Clocking: On-chip oscillator and PLL support provide multiple clocking options for timing-critical interfaces without external clock management components.
- Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and manufactured to RoHS standards for commercial product deployment.
Why Choose LCMXO3L-1300C-5BG256C?
The LCMXO3L-1300C-5BG256C positions itself as a compact, reprogrammable solution for commercial embedded systems that require moderate logic capacity, substantial I/O, and on-chip memory. Its MachXO3 family architecture brings non-volatile configuration and embedded peripheral IP to streamline designs and reduce external component count.
This device is well suited to engineers and OEMs building commercial-temperature products that benefit from flexible in-system reprogramming, integrated interface support, and a small-footprint BGA package. The combination of 1,280 logic elements, 65,536 bits of RAM, and 206 I/Os offers a balanced mix of resources for control, interfacing and system integration tasks.
Request a quote or submit a parts inquiry to receive pricing and availability information for the LCMXO3L-1300C-5BG256C.

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