LCMXO3L-1300C-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA

Quantity 299 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3L-1300C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA

The LCMXO3L-1300C-5BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) supplied in a 256-ball LFBGA package. It provides 1,280 logic elements and 65,536 bits of on-chip RAM with up to 206 I/Os, delivering a compact, reprogrammable building block for commercial embedded designs.

Designed for commercial-temperature systems, this MachXO3 device combines non-volatile, multi-time programmable configuration with integrated I/O and embedded system features to simplify peripheral control, interface bridging, and system glue logic within a single surface-mount package.

Key Features

  • Logic Capacity  Approximately 1,280 logic elements for implementing glue logic, finite state machines and small- to mid-scale FPGA functions.
  • On-chip Memory  65,536 bits of embedded RAM (sysMEM) suitable for FIFOs, small data buffers, or configuration storage.
  • I/O Density  Up to 206 general-purpose I/O pins to support wide peripheral connectivity and parallel interfaces.
  • Non‑volatile, Multi‑time Programmable Configuration  MachXO3 family architecture provides non-volatile configuration and support for reprogramming in-system.
  • Embedded Hardened IP  Family-level features include hardened I²C and SPI IP cores and timer/counter functionality for offloading common peripheral tasks.
  • Clocking and Oscillator  On-chip oscillator and support for phase-locked loops (PLLs) for flexible on-chip clocking and timing management as described in the MachXO3 family documentation.
  • Package and Mounting  256-LFBGA (supplier package 256-CABGA, 14×14 mm) surface-mount package for compact board integration.
  • Power and Operating Range  Supported supply range of 2.375 V to 3.465 V and commercial operating temperature from 0 °C to 85 °C.
  • System and Test Features  Family datasheet details configuration and boundary-scan testability functions to support manufacturing test and in-system programming.
  • Compliance  RoHS-compliant device for regulatory and manufacturing compliance.

Typical Applications

  • Interface Bridging and Glue Logic  Use the reprogrammable logic and abundant I/O to consolidate protocol translation, bus interfacing, and glue logic into a single component.
  • Peripheral and Sensor Control  Leverage embedded timers, SPI/I²C IP and multiple I/Os to manage sensors, actuators and local peripherals without an external microcontroller for simple control tasks.
  • System Integration and Prototyping  Non-volatile, reprogrammable configuration and on-chip memory make the device suitable for evolving designs and rapid iterations in commercial systems.

Unique Advantages

  • Integrated, Reprogrammable Functionality:  Non-volatile, multi-time programmable configuration reduces the need for external flash and simplifies system boot architecture.
  • High I/O Count in a Compact Package:  206 I/Os in a 256-LFBGA package enable dense connectivity while keeping board space minimal.
  • Embedded Peripheral IP:  Hardened I²C, SPI and timer/counter blocks accelerate peripheral interfacing and reduce firmware development burden.
  • Flexible Clocking:  On-chip oscillator and PLL support provide multiple clocking options for timing-critical interfaces without external clock management components.
  • Commercial Temperature and RoHS Compliance:  Designed for 0 °C to 85 °C operation and manufactured to RoHS standards for commercial product deployment.

Why Choose LCMXO3L-1300C-5BG256C?

The LCMXO3L-1300C-5BG256C positions itself as a compact, reprogrammable solution for commercial embedded systems that require moderate logic capacity, substantial I/O, and on-chip memory. Its MachXO3 family architecture brings non-volatile configuration and embedded peripheral IP to streamline designs and reduce external component count.

This device is well suited to engineers and OEMs building commercial-temperature products that benefit from flexible in-system reprogramming, integrated interface support, and a small-footprint BGA package. The combination of 1,280 logic elements, 65,536 bits of RAM, and 206 I/Os offers a balanced mix of resources for control, interfacing and system integration tasks.

Request a quote or submit a parts inquiry to receive pricing and availability information for the LCMXO3L-1300C-5BG256C.

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