LCMXO3L-1300C-6BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA |
|---|---|
| Quantity | 172 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3L-1300C-6BG256I – MachXO3 Field Programmable Gate Array, 256-LFBGA
The LCMXO3L-1300C-6BG256I is a MachXO3 family FPGA device designed for flexible system integration and control applications. It combines a compact 256-LFBGA package with a multi-time programmable, non-volatile architecture and a broad mix of I/O and embedded resources suited to industrial designs.
Typical use cases include system glue logic, control and interface bridging, and general-purpose programmable logic where a balance of I/O count, embedded memory and industrial operating range matter. The device delivers integration and configurability while operating across a 2.375 V to 3.465 V supply range and an industrial temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 1280 logic elements with 160 logic blocks provide programmable resources for combinational and sequential logic implementations.
- Embedded Memory Approximately 0.0625 Mbits (65,536 bits) of on-chip RAM for data buffering, small FIFOs or state storage.
- I/O Capacity 206 user I/O pins support a wide range of peripheral connections and system interfaces.
- Non-volatile, Multi-time Programmable MachXO3 family architecture supports non-volatile configuration and multi-time programmability for in-system reconfiguration.
- Pre‑engineered I/O and Flexible Buffers Family features include pre‑engineered source-synchronous I/O and high-performance, flexible I/O buffering for robust signal interfacing.
- On-chip Clocking Flexible on‑chip clocking and PLL resources provide clock management for synchronous designs.
- Hardened IP Functions Embedded hardened functions in the MachXO3 family include common system IP such as I²C and SPI cores and timer/counter blocks to simplify design integration.
- Configuration & Reconfiguration TransFR reconfiguration capability and UFM (user flash memory) features in the family enable field updates and system traceability.
- Power and Mounting Surface-mount device with recommended supply range of 2.375 V to 3.465 V for flexible system power architectures.
- Package and Temperature 256-LFBGA (supplier package 256-CABGA, 14×14) with industrial grade operation from −40 °C to 100 °C and RoHS compliance.
Typical Applications
- Industrial Control Implement control logic, interface bridging and sensor aggregation where operation across −40 °C to 100 °C is required.
- Bridge and Interface Logic Use the device’s 206 I/O pins and flexible buffering to adapt legacy buses or to add protocol translation and glue logic.
- Embedded System Glue Integrate small FIFOs or state machines using on-chip RAM and logic elements to offload tasks from a main CPU.
- Configuration and Field Upgrades Leverage non‑volatile, multi‑time programmable configuration and TransFR reconfiguration to enable in-system updates.
Unique Advantages
- Broad I/O Count: 206 user I/O pins let you directly connect numerous peripherals without immediate need for external I/O expanders.
- Non-volatile Programmability: Multi-time programmable, non-volatile configuration reduces the need for external configuration memory in many designs.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
- Compact, High‑density Package: 256-LFBGA (14×14) provides a small footprint for space-constrained PCBs while maintaining signal density.
- Integrated System IP: Hardened I²C and SPI cores plus timer/counter functionality reduce design effort and component count.
- Flexible Power Options: Operates across a wide supply range (2.375 V–3.465 V) to accommodate different system power rails.
Why Choose LCMXO3L-1300C-6BG256I?
The LCMXO3L-1300C-6BG256I is positioned for designs that need a balance of I/O density, modest logic and embedded memory, and reliable operation across an industrial temperature range. As a member of the MachXO3 family, it benefits from architecture features such as flexible on-chip clocking, pre-engineered I/O, hardened IP blocks and non-volatile, multi‑time programmability.
This device is well suited to engineers building industrial controls, interface bridging, configuration-managed systems and other applications where integration, reconfigurability and reliable operation across a wide voltage and temperature window are required.
Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO3L-1300C-6BG256I. Our team can provide the details you need to move your design forward.

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