LCMXO3L-1300C-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA

Quantity 172 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3L-1300C-6BG256I – MachXO3 Field Programmable Gate Array, 256-LFBGA

The LCMXO3L-1300C-6BG256I is a MachXO3 family FPGA device designed for flexible system integration and control applications. It combines a compact 256-LFBGA package with a multi-time programmable, non-volatile architecture and a broad mix of I/O and embedded resources suited to industrial designs.

Typical use cases include system glue logic, control and interface bridging, and general-purpose programmable logic where a balance of I/O count, embedded memory and industrial operating range matter. The device delivers integration and configurability while operating across a 2.375 V to 3.465 V supply range and an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  1280 logic elements with 160 logic blocks provide programmable resources for combinational and sequential logic implementations.
  • Embedded Memory  Approximately 0.0625 Mbits (65,536 bits) of on-chip RAM for data buffering, small FIFOs or state storage.
  • I/O Capacity  206 user I/O pins support a wide range of peripheral connections and system interfaces.
  • Non-volatile, Multi-time Programmable  MachXO3 family architecture supports non-volatile configuration and multi-time programmability for in-system reconfiguration.
  • Pre‑engineered I/O and Flexible Buffers  Family features include pre‑engineered source-synchronous I/O and high-performance, flexible I/O buffering for robust signal interfacing.
  • On-chip Clocking  Flexible on‑chip clocking and PLL resources provide clock management for synchronous designs.
  • Hardened IP Functions  Embedded hardened functions in the MachXO3 family include common system IP such as I²C and SPI cores and timer/counter blocks to simplify design integration.
  • Configuration & Reconfiguration  TransFR reconfiguration capability and UFM (user flash memory) features in the family enable field updates and system traceability.
  • Power and Mounting  Surface-mount device with recommended supply range of 2.375 V to 3.465 V for flexible system power architectures.
  • Package and Temperature  256-LFBGA (supplier package 256-CABGA, 14×14) with industrial grade operation from −40 °C to 100 °C and RoHS compliance.

Typical Applications

  • Industrial Control  Implement control logic, interface bridging and sensor aggregation where operation across −40 °C to 100 °C is required.
  • Bridge and Interface Logic  Use the device’s 206 I/O pins and flexible buffering to adapt legacy buses or to add protocol translation and glue logic.
  • Embedded System Glue  Integrate small FIFOs or state machines using on-chip RAM and logic elements to offload tasks from a main CPU.
  • Configuration and Field Upgrades  Leverage non‑volatile, multi‑time programmable configuration and TransFR reconfiguration to enable in-system updates.

Unique Advantages

  • Broad I/O Count: 206 user I/O pins let you directly connect numerous peripherals without immediate need for external I/O expanders.
  • Non-volatile Programmability: Multi-time programmable, non-volatile configuration reduces the need for external configuration memory in many designs.
  • Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
  • Compact, High‑density Package: 256-LFBGA (14×14) provides a small footprint for space-constrained PCBs while maintaining signal density.
  • Integrated System IP: Hardened I²C and SPI cores plus timer/counter functionality reduce design effort and component count.
  • Flexible Power Options: Operates across a wide supply range (2.375 V–3.465 V) to accommodate different system power rails.

Why Choose LCMXO3L-1300C-6BG256I?

The LCMXO3L-1300C-6BG256I is positioned for designs that need a balance of I/O density, modest logic and embedded memory, and reliable operation across an industrial temperature range. As a member of the MachXO3 family, it benefits from architecture features such as flexible on-chip clocking, pre-engineered I/O, hardened IP blocks and non-volatile, multi‑time programmability.

This device is well suited to engineers building industrial controls, interface bridging, configuration-managed systems and other applications where integration, reconfigurability and reliable operation across a wide voltage and temperature window are required.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO3L-1300C-6BG256I. Our team can provide the details you need to move your design forward.

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