LCMXO3L-1300E-5MG256C

The LCMXO3L-1300E-5MG256C is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a flexible, non-volatile FPGA architecture with on-chip memory and a broad I/O count in a compact 256‑VFBGA / CSPBGA package.

Designed for commercial applications, this device combines 1,280 logic elements, 65,536 bits of embedded RAM, and 206 I/Os with features from the MachXO3 family such as flexible on‑chip clocking, pre‑engineered source‑synchronous I/O, and multi‑time non‑volatile configuration to address board‑level control, interface consolidation and system management tasks.

Key Features

• Core Logic  Provides 1,280 logic elements suitable for glue logic, control and interface functions.
• Embedded Memory  65,536 bits of on‑chip RAM for buffering, state storage and small FIFOs.
• I/O and Interfaces  206 general purpose I/Os with the MachXO3 family’s high‑performance, flexible I/O buffer and pre‑engineered source‑synchronous I/O support.
• Configuration and Non‑Volatility  MachXO3 family supports non‑volatile, multi‑time programmable configuration and TransFR reconfiguration capabilities.
• Embedded IP and Peripherals  Includes hardened IP building blocks referenced in the MachXO3 family data such as I²C and SPI cores, timers/counters, and on‑chip oscillator.
• Clocking  Flexible on‑chip clocking with sysCLOCK PLLs and distribution network as described for the MachXO3 family.
• Packaging  Available in a compact 256‑VFBGA (256‑CSFBGA 9×9) CSPBGA surface‑mount package for space‑constrained designs.
• Power and Operating Range  Supply voltage range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS‑compliant.

Typical Applications

• Board-level glue logic  Use the 206 I/Os and 1,280 logic elements to consolidate discrete glue logic and interface translation on a single device.
• Interface bridging and protocol adaptation  Leverage flexible I/O buffering and embedded IP (I²C/SPI) to implement protocol adapters and peripheral interfaces.
• Configuration and system management  Non‑volatile, multi‑time programmable configuration and user flash memory capabilities support system configuration, boot sequencing and small data storage.
• Timing and clock control  On‑chip clocking and PLL features enable local clock generation and distribution for synchronized I/O and system timing functions.

Unique Advantages

• Highly integrated I/O count: 206 I/Os reduce external glue logic and simplify board routing for complex interface requirements.
• Non‑volatile configuration: Multi‑time programmable configuration removes the need for external configuration flash in many designs.
• Compact, surface‑mount package: 256‑VFBGA (256‑CSFBGA 9×9) CSPBGA packaging delivers high integration in a small footprint for space‑constrained PCBs.
• Embedded peripherals and IP: Hardened I²C, SPI, timers and oscillator functionality lower development time and external component count.
• Predictable operating envelope: Clearly defined supply range (1.14–1.26 V) and commercial temperature rating (0 °C–85 °C) simplify system power and thermal planning.
• RoHS compliant: Meets common environmental requirements for commercial electronics production.

Why Choose LCMXO3L-1300E-5MG256C?

The LCMXO3L-1300E-5MG256C positions itself as a compact, flexible and non‑volatile FPGA solution for commercial embedded designs that require moderate logic capacity, significant I/O density, and on‑chip memory. Its MachXO3 family capabilities—flexible clocking, pre‑engineered I/O and hardened peripheral IP—help reduce BOM complexity and accelerate time to market.

This device is well suited to product and system designers seeking a reliable, space‑efficient programmable device for board‑level control, interface consolidation, and system management where predictable electrical and thermal requirements are important.

Request a quote or submit a pricing inquiry to begin procurement for the LCMXO3L-1300E-5MG256C.