LCMXO3L-1300E-5UWG36CTR

The LCMXO3L-1300E-5UWG36CTR is a MachXO3 family FPGA in a compact 36-WLCSP package designed for surface-mount applications. It provides approximately 1,280 logic elements, 65,536 bits of embedded RAM and 28 general-purpose I/O pins in a small footprint suitable for space-constrained designs.

This commercial-grade device (0 °C to 85 °C) supports a core supply range of 1.14 V to 1.26 V, and the MachXO3 family datasheet highlights features such as non-volatile multi-time programmability, on-chip clocking/PLLs, hardened serial interfaces, and power-saving modes—making the device suitable for control, I/O bridging and peripheral integration tasks in consumer and general embedded systems.

Key Features

• Core Logic  Approximately 1,280 logic elements suitable for small to mid-size glue-logic and control functions.
• Embedded Memory  65,536 bits of on-chip RAM for local buffering and small data structures.
• I/O and Packaging  28 I/O pins in a 36-UFBGA/WLCSP package (supplier device package: 36-WLCSP, 2.54 × 2.59 mm) designed for surface-mount assembly.
• Power and Temperature  Core supply voltage range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Non‑Volatile Configuration  Family-level datasheet describes non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• Clocking and Timing  On-chip clocking resources including PLLs are documented in the family datasheet for flexible clock management.
• Hardened Peripheral IP  Datasheet lists embedded hardened IP such as I²C, SPI and timer/counter blocks for easier peripheral interfacing.
• System and Power Management  Standby mode and power-saving options are included in the family feature set to support reduced-power system states.
• Compliance  RoHS compliant.

Typical Applications

• Consumer electronics  Implement user-interface control, simple protocol bridging or sensor interfacing where a compact WLCSP footprint and ~1,280 logic elements are sufficient.
• Embedded peripherals and controllers  Use on-chip RAM and hardened I²C/SPI/timer blocks to manage peripheral devices and local buffers within constrained board area.
• System glue logic  Replace discrete logic for address decoding, simple state machines or I/O expansion using the device’s programmable logic and 28 I/O pins.
• Compact industrial or commercial equipment  Control and I/O bridging in systems that operate within the device’s commercial temperature range (0 °C to 85 °C).

Unique Advantages

• Compact WLCSP package: Minimizes board area with a 36-WLCSP (2.54 × 2.59 mm) supplier package while maintaining 28 I/Os.
• Non-volatile, multi-time programmability: MachXO3 family configuration options reduce the need for external configuration memory and enable in-field updates.
• Embedded peripheral IP: Hardened I²C, SPI and timer/counter blocks simplify peripheral integration and reduce design effort.
• Flexible clocking: On-chip PLLs and clock resources (documented in the family datasheet) support a range of timing architectures without extensive external components.
• Surface-mount ready: Surface-mount mounting type supports automated assembly in compact designs.
• Regulatory-friendly: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LCMXO3L-1300E-5UWG36CTR?

The LCMXO3L-1300E-5UWG36CTR positions itself as a compact, commercially graded FPGA option for designs that require programmable logic, modest embedded memory and a small physical footprint. With approximately 1,280 logic elements, 65,536 bits of RAM and a set of family-level features—non-volatile configuration, on-chip clocking/PLLs, hardened peripheral IP and power-management options—the device targets board-level integration tasks such as glue logic, peripheral control and simple state machines.

Designers looking to optimize board space and reduce external component count will find the WLCSP packaging and embedded resources helpful for keeping BOM and area down while delivering reprogrammable logic and peripheral integration in commercial temperature environments.

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