LCMXO3L-1300E-5MG256I

The LCMXO3L-1300E-5MG256I is a MachXO3 family field programmable gate array (FPGA) designed for industrial applications. It combines a flexible MachXO3 architecture with non-volatile, multi-time programmable configuration and a compact 256‑VFBGA package for surface-mount assembly.

With 1280 logic elements, 65,536 bits of on-chip RAM, 206 I/Os and an operating range of -40 °C to 100 °C, this device is suited for industrial control, interface bridging and system glue-logic tasks where reliable I/O count, embedded memory and extended temperature operation are required.

Key Features

• Core Architecture  MachXO3 family flexible architecture with on-chip features such as pre‑engineered source‑synchronous I/O and a clock/control distribution network described in the MachXO3 data sheet.
• Logic Capacity  1280 logic elements suitable for moderate-density glue logic, state machines and control functions.
• Embedded Memory  Approximately 64 Kbits (65,536 bits) of on-chip RAM with support for RAM and ROM modes and memory configurations described in the family data sheet.
• I/O and Timing  206 general-purpose I/Os plus family-level support for source-synchronous I/O and programmable I/O cell features to simplify interfacing.
• Power and Clocking  Low-voltage core operation with a supply range of 1.14 V to 1.26 V and family-level clocking features including sysCLOCK PLLs and on-chip oscillators referenced in the data sheet.
• Package and Mounting  256‑VFBGA (CSPBGA) surface-mount package, listed as 256‑CSFBGA (9×9) by the supplier.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, making it suitable for extended-temperature environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use for control logic, I/O expansion and interface management where the -40 °C to 100 °C operating range and 206 I/Os support robust deployment.
• Interface Bridging and Glue Logic  Ideal for consolidating multiple digital interfaces and implementing protocol adapters thanks to flexible I/O and embedded memory for buffering.
• Edge Logic and Sensor Aggregation  Local preprocessing, sensor interfacing and deterministic control functions benefit from the on-chip RAM and 1280 logic elements.

Unique Advantages

• Highly integrated configuration  Non-volatile, multi-time programmable MachXO3 family configuration reduces the need for external configuration memory.
• Broad I/O capacity  206 available I/Os allow consolidation of multiple signals and interfaces, reducing external glue components.
• Embedded memory flexibility  Approximately 64 Kbits of on-chip RAM supports RAM and ROM modes and memory-cascading options documented in the family data sheet.
• Industrial-ready thermal range  Rated from -40 °C to 100 °C for deployments in extended-temperature environments.
• Compact package  256‑VFBGA surface-mount package delivers a high pin count in a small footprint for space-constrained designs.
• Low-voltage core operation  Narrow supply range (1.14 V–1.26 V) simplifies power-distribution planning for the core domain.

Why Choose LCMXO3L-1300E-5MG256I?

The LCMXO3L-1300E-5MG256I positions MachXO3 family functionality in a compact, industrial-rated package that balances I/O density, embedded memory and programmable logic capacity. Its non‑volatile configuration, flexible I/O features and family-level clocking and IP blocks make it a practical choice for designers needing reliable, board-level glue logic, interface bridging and moderate-density control functions.

This device is suited to engineers and procurement teams looking for a scalable, industrial-temperature FPGA option with straightforward integration into surface-mount assemblies and predictable electrical and thermal characteristics as specified.

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