LCMXO3L-1300E-5MG121I

The LCMXO3L-1300E-5MG121I is a MachXO3 family FPGA IC from Lattice Semiconductor Corporation offering non-volatile, multi-time programmable logic in a compact 121-VFBGA (6×6 mm) package. It combines a flexible logic fabric with embedded memory, hardened peripheral IP and flexible I/O to address system control, interface bridging and glue-logic roles.

With 1,280 logic elements, 65,536 bits of on-chip RAM and 100 user I/Os, this industrial-grade device is specified for an extended temperature range and low-voltage operation, making it suitable for designs that require persistent configuration and robust I/O flexibility.

Key Features

• Core Logic  1,280 logic elements implemented across 160 CLBs provide reprogrammable logic capacity for control, glue logic and simple state machines.
• Embedded Memory  65,536 bits of on-chip RAM for small data buffers, FIFOs or lookup tables.
• I/O Capacity and Flexibility  100 user I/Os with high-performance, flexible I/O buffer architecture and pre‑engineered source-synchronous I/O support for a variety of interfacing needs.
• Clocking and Timing  Flexible on-chip clocking resources including PLLs and an on-chip oscillator enable local clock generation and distribution (features described in the MachXO3 family datasheet).
• Configuration and Non-Volatile Storage  Multi-time programmable non-volatile configuration and User Flash Memory (UFM) support persistent device configuration and small data storage across power cycles.
• Hardened Peripheral IP  Embedded hardened functions such as I²C, SPI and timer/counter blocks provide offload of common peripheral functions and reduce external component count.
• Power and Low-Power Modes  Standby mode and power saving options (documented in the MachXO3 family datasheet) help manage system-level power consumption.
• Industrial Grade and Environmental  Industrial operating temperature range from −40 °C to 100 °C and RoHS-compliant construction for deployment in industrial environments.
• Package and Mounting  Available in a 121-VFBGA / 121-CSFBGA (6×6) package for surface-mount assembly, enabling compact board integration.
• Supply Voltage  Core supply range specified from 1.14 V to 1.26 V for predictable power-rail design.

Typical Applications

• Industrial Control  Use as embedded control and glue logic in automated equipment, leveraging the industrial temperature rating and persistent configuration.
• Interface Bridging  Serve as an I/O expander or protocol bridge where flexible I/O buffers and pre‑engineered source-synchronous I/O simplify signal interfacing between subsystems.
• System Configuration and Security  Store boot configuration or small system parameters in UFM and use the device’s non-volatile, multi-time programmable configuration to manage field updates.
• Peripheral Offload  Implement I²C/SPI masters, timers or simple peripheral logic internally using hardened IP blocks to reduce BOM and board complexity.

Unique Advantages

• Non-volatile, Field-Programmable Configuration: Multi-time programmable configuration and UFM enable persistent device behavior and field updates without external configuration memory.
• Integrated Peripheral IP: Hardened I²C, SPI and timer/counter blocks reduce the need for discrete peripheral ICs and simplify firmware integration.
• Compact, Production-Ready Package: The 121-VFBGA (6×6) package and surface-mount mounting support compact PCB layouts and automated assembly.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Predictable Power Rails: Narrow core supply window (1.14 V to 1.26 V) simplifies power-supply design and margin planning.
• Family-Level System Support: MachXO3 family features such as flexible clocking, reconfiguration (TransFR) and enhanced system-level support help ease integration across related devices.

Why Choose LCMXO3L-1300E-5MG121I?

The LCMXO3L-1300E-5MG121I balances reprogrammable logic, embedded memory and hardened peripheral IP in a compact, industrial-grade package. Its non-volatile configuration, flexible I/O and on-chip resources make it well suited to designs that require persistent logic, reliable interfacing and reduced external component count.

Designed within the MachXO3 family, this device is an option for engineers seeking a low-to-moderate density FPGA with integrated peripherals and extended temperature capability, providing a scalable, field-updateable building block for control, interfacing and system-management functions.

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