LCMXO3L-1300E-5MG121C

The LCMXO3L-1300E-5MG121C is a MachXO3 family Field Programmable Gate Array (FPGA) IC offering non-volatile, multi-time programmable logic in a compact 121‑VFBGA/CSPBGA package. Built around the MachXO3 architecture, this device combines on-chip memory, flexible I/O and embedded hardened IP blocks to address control, interface and glue-logic tasks in commercial electronic systems.

Designed for commercial-grade applications, the device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C range, and is RoHS compliant. The family datasheet highlights flexible on-chip clocking, source-synchronous I/O support, TransFR reconfiguration and a range of system-level features suitable for compact, low-voltage designs.

Key Features

• Core Capacity — 1,280 logic elements providing programmable combinational and sequential logic resources for glue logic, control functions and small to moderate FPGA tasks.
• Embedded Memory — 65,536 bits (64 Kbits) of on-chip RAM for buffering, state storage and small data structures.
• I/O and Interfaces — 100 user I/Os with support for pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture.
• Configuration and Reliability — Non-volatile, multi-time programmable device with TransFR reconfiguration and IEEE 1149.1-compliant boundary-scan testability as described in the MachXO3 family documentation.
• Embedded Hardened IP — Family-level inclusion of hardened I2C and SPI IP cores plus timers/counters and user flash memory (UFM) for common peripheral and control tasks.
• Clocking and Timing — Flexible on-chip clocking with sysCLOCK PLLs and an on-chip oscillator to support a variety of timing architectures.
• Power — Low-voltage operation with recommended supply between 1.14 V and 1.26 V and power-saving/standby modes described in the family datasheet.
• Package and Mounting — Surface-mount 121‑VFBGA (supplier device package: 121‑CSFBGA, 6×6) for compact board footprints.
• Grade and Environmental — Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Embedded System Control — Implement control state machines and glue logic where 1,280 logic elements and on-chip RAM provide compact programmable control functions.
• Interface Bridging and Protocol Handling — Use hardened I2C/SPI IP and flexible I/O to offload peripheral interfacing and protocol translation tasks.
• User Interface and Peripheral Management — Drive and coordinate displays, indicators and input scanning leveraging 100 I/Os and embedded memory for buffering.

Unique Advantages

• Highly integrated solution: Combines logic, on-chip RAM and hardened IP to reduce external components and simplify system design.
• Compact package footprint: 121‑VFBGA (121‑CSFBGA, 6×6) surface-mount package minimizes board area for space-constrained designs.
• Low-voltage operation: 1.14 V to 1.26 V supply range supports modern low-voltage system rails.
• Non-volatile, multi-time programmable: Enables in-field updates and reconfiguration without additional external flash.
• System-level features: On-chip PLLs, oscillator, UFM and boundary-scan support simplify clocking, storage and testability integration.
• Commercial-ready: RoHS compliant and specified for 0 °C to 85 °C operation for mainstream electronic products.

Why Choose LCMXO3L-1300E-5MG121C?

The LCMXO3L-1300E-5MG121C offers a balanced combination of programmable logic, embedded memory and rich I/O in a compact, surface-mount 121‑VFBGA package. Its MachXO3 family attributes — including non-volatile multi-time programmability, flexible on-chip clocking and hardened peripheral IP — make it well suited for commercial designs that require reliable glue logic, interface control and moderate-density programmable functionality.

This part is appropriate for engineers seeking a low-voltage, compact FPGA solution with family-level system features and a documented migration and support path as described in the MachXO3 datasheet.

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