LCMXO3L-1300C-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA

Quantity 969 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3L-1300C-6BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 I/O, 65,536 bits RAM, 1,280 Logic Elements, 256-LFBGA

The LCMXO3L-1300C-6BG256C is a MachXO3 family FPGA that combines non-volatile, multi-time programmable configuration with flexible on-chip resources for system-level integration. Its architecture targets board-level logic integration, I/O customization and embedded control functions by delivering 1,280 logic elements, 65,536 bits of embedded RAM, and 206 user I/O in a 256‑LFBGA package.

Designed with system-level features such as pre‑engineered source‑synchronous I/O, flexible I/O buffering and on-chip clocking, this device is suited for commercial applications requiring compact, reprogrammable logic and extensive I/O connectivity.

Key Features

  • Core Logic 1,280 logic elements for implementing glue logic, finite state machines and small to mid-size configurable logic functions.
  • Embedded Memory (sysMEM) 65,536 bits of on-chip RAM supporting single, dual, pseudo‑dual port and FIFO modes for buffering and data storage.
  • I/O Capacity & Flexibility 206 user I/O with pre‑engineered source‑synchronous I/O and a high‑performance, flexible I/O buffer architecture for interfacing and timing-critical signals.
  • Non-volatile, Multi-time Programmable Configuration On-device non‑volatile configuration enables reprogramming and in-field updates without external configuration memory.
  • Clocking & Timing Flexible on‑chip clocking including sysCLOCK PLLs and an on‑chip oscillator to support a range of timing and synchronization needs.
  • Hardened IP Blocks Embedded hardened functions referenced in the device family include standardized interfaces and timers (examples documented in the MachXO3 family datasheet).
  • Power & Electrical Operates from a 2.375 V to 3.465 V supply range to accommodate common system power rails.
  • Package & Mounting Supplied in a 256‑LFBGA (256‑CABGA, 14 × 14 mm) surface‑mount package for compact board designs.
  • Commercial Grade & Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant.

Typical Applications

  • System Glue / Interface Bridging Use the device's flexible I/O buffering and 206 I/O to implement protocol translation, level translation and board interconnect logic.
  • Embedded Control & Timing Leverage on‑chip clocking, PLLs and hardened timer/counter functions for control logic, timing management and synchronization tasks.
  • Data Buffering and FIFOs Implement small FIFOs and buffering using the 65,536 bits of embedded RAM in single, dual or FIFO configurations for transient data handling.

Unique Advantages

  • High I/O Density: 206 user I/O pins provide extensive connectivity for interfaces, sensors and peripheral devices, reducing the need for external multiplexers.
  • Non‑volatile Reprogrammability: Multi‑time programmable, non‑volatile configuration allows in‑field updates and design iteration without external configuration flash.
  • Compact BGA Package: The 256‑LFBGA (14 × 14 mm) package balances I/O count and board footprint for space‑constrained designs.
  • Flexible Power Range: Support for 2.375 V to 3.465 V supplies enables integration with common system rails and simplifies power sequencing.
  • Embedded Memory Options: 65,536 bits of sysMEM support multiple memory modes (including FIFO), enabling on‑chip buffering and data-path implementations.
  • Commercial Temperature and Compliance: Rated for 0 °C to 85 °C and RoHS‑compliant for standard commercial deployments.

Why Choose LCMXO3L-1300C-6BG256C?

The LCMXO3L-1300C-6BG256C positions itself as a compact, reprogrammable FPGA option for commercial applications that require moderate logic density, significant I/O connectivity and on‑chip memory. Its MachXO3 family attributes—non‑volatile configuration, flexible I/O and embedded system features—make it suitable for board‑level integration tasks such as interface bridging, control logic and data buffering.

For designers seeking a commercially graded, RoHS‑compliant FPGA in a small BGA package with a broad operating voltage range and integrated memory and clocking resources, the LCMXO3L-1300C-6BG256C offers a balanced combination of integration and reconfigurability backed by MachXO3 family architecture.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead‑time information for the LCMXO3L-1300C-6BG256C.

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