LCMXO3D-9400ZC-3SG72I

The LCMXO3D-9400ZC-3SG72I is a MachXO3D family FPGA IC offering non-volatile, reconfigurable logic in an industrial-grade package. It pairs 9,400 logic elements with approximately 0.42 Mbits of embedded RAM and 58 user I/O to address mid-density, reconfigurable control and interface tasks.

This device targets industrial and embedded applications that require flexible on-chip resources, secure features and a compact surface-mount 72‑VFQFN exposed‑pad package with a broad supply and temperature operating range.

Key Features

• Core Logic  9,400 logic elements provide a mid-density programmable fabric for glue logic, protocol bridging and control functions.
• Embedded Memory  Approximately 0.42 Mbits (442,368 bits) of on‑chip RAM for FIFOs, buffering and small data tables.
• I/O and Interface  58 user I/O pins with pre‑engineered source synchronous I/O and flexible I/O buffer support as described in the device family data sheet.
• Security and Hardened IP  Dedicated Embedded Security Block and multiple embedded hardened IP functions are included in the MachXO3D family to support protected system functions and common peripherals.
• Clocking and Timing  Flexible on‑chip clocking with sysCLOCK phase‑locked loops (PLLs) and an on‑chip oscillator for system and peripheral timing.
• Non‑volatile, Reconfigurable  The family provides non‑volatile, reconfigurable operation and TransFR reconfiguration support as detailed in the data sheet.
• Package and Mounting  72‑VFQFN exposed pad (supplier package: 72‑QFN, 10×10) for compact surface‑mount PCB designs and improved thermal performance through the exposed pad.
• Power and Temperature  Operates from 2.375 V to 3.465 V and across an industrial temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control systems  Use the device’s 9,400 logic elements, 58 I/O and industrial temperature range for deterministic control, I/O aggregation and protocol bridging in factory and process equipment.
• Embedded system glue logic  Implement custom interface logic, buffering and state machines using on‑chip memory and flexible I/O buffering.
• Security‑aware designs  Leverage the embedded security block and hardened IP to implement protected boot, secure configuration storage and authenticated interfaces.

Unique Advantages

• Compact, reconfigurable integration: Combines mid‑density programmable logic and embedded RAM in a 72‑VFQFN package to reduce PCB area and BOM count.
• Industrial readiness: Rated for −40 °C to 100 °C and RoHS compliant, making it suitable for industrial applications that require extended temperature operation.
• Flexible power interface: Broad supply voltage window (2.375 V to 3.465 V) simplifies integration with common system rails.
• System-level IP and security: Built‑in security and hardened peripheral IP reduce development effort for secure and feature‑rich system designs.
• On‑chip clocking and timing options: Integrated PLLs and oscillator support system timing and source‑synchronous interfaces without external clock complexification.

Why Choose LCMXO3D-9400ZC-3SG72I?

This MachXO3D device delivers a balanced mix of programmable logic, embedded memory and system IP aimed at industrial and embedded designs that need reconfigurable functionality in a compact package. With 9,400 logic elements, approximately 0.42 Mbits of RAM, flexible I/O and dedicated security features, it is positioned for applications where integration, configuration flexibility and industrial temperature operation matter.

Designers benefit from reduced BOM complexity and on‑chip resources that support interface bridging, control logic and secure functionality, backed by the MachXO3D family architecture and documented device features in the manufacturer data sheet.

Request a quote or submit a quote referencing part number LCMXO3D-9400ZC-3SG72I to obtain pricing and availability from your preferred distributor or supplier.