LCMXO3D-9400ZC-3BG400I

The LCMXO3D-9400ZC-3BG400I is a MachXO3D family field programmable gate array (FPGA) IC designed for industrial-grade system-level integration. It provides 9,400 logic elements, substantial embedded memory, a high I/O count and an advanced BGA package to support reconfigurable logic, on-chip peripherals and secure system functions.

Built for applications that require non-volatile reconfiguration, flexible on-chip clocking, and hardened system IP, this device targets designs where integration, I/O density and industrial temperature range (-40 °C to 100 °C) are key requirements.

Key Features

• Logic Capacity — 9,400 logic elements to implement glue logic, control functions and mid-density FPGA designs.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs and small embedded data structures.
• I/O Density — 335 I/Os to support large numbers of peripherals, interfaces and board-level signal routing.
• Non-volatile, Reconfigurable — MachXO3D family supports non-volatile configuration and TransFR reconfiguration for in-system updates and persistent configuration.
• Dedicated Security and Hardened IP — Includes an Embedded Security Block and multiple hardened IP functions (for example SPI, I²C and timer/counter) for system-level features without consuming core logic.
• Flexible On-chip Clocking — Built-in PLLs and flexible clock distribution to support multiple clock domains and source-synchronous I/O schemes.
• Advanced I/O and Peripherals — Pre‑engineered source synchronous I/O, high-performance configurable I/O buffers and programmable I/O cells for diverse interface needs.
• Package and Mounting — 400-LFBGA (supplier package 400-CABGA, 17 × 17) for compact, high-density board designs; surface-mount package type.
• Industrial Operating Range — Rated for industrial operation from −40 °C to 100 °C and RoHS compliant.
• Supply Voltage — Supports a supply range of 2.375 V to 3.465 V, enabling common system supply options.

Typical Applications

• System and board-level glue logic — Use the device’s 9,400 logic elements and 335 I/Os to consolidate interface logic and reduce component count on complex boards.
• Secure control and monitoring — Leverage the Embedded Security Block and hardened IP to add protected configuration and secure system functions.
• I/O bridging and protocol adaptation — High I/O density and flexible I/O buffering accommodate protocol translation and source-synchronous interfaces.
• Embedded memory and buffering — Approximately 0.44 Mbits of on-chip RAM supports FIFOs, small frame buffering and temporary data storage for real-time processing.

Unique Advantages

• High integration density: 9,400 logic elements combined with 335 I/Os reduce the need for external glue logic and discrete interface chips.
• Persistent configuration: Non-volatile, reconfigurable architecture enables in-field updates and persistent device configuration without external flash.
• Hardened system IP: Built-in security block and peripheral IP (SPI, I²C, timers) free up programmable fabric for application logic.
• Industrial robustness: Specified for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
• Compact, manufacturable package: 400-LFBGA (17 × 17) provides a compact footprint for space-constrained PCBs while supporting surface-mount assembly.
• Flexible power and clocking: Wide supply range (2.375 V–3.465 V) and on-chip PLL/clocking resources simplify system power and timing design.

Why Choose LCMXO3D-9400ZC-3BG400I?

The LCMXO3D-9400ZC-3BG400I positions itself as a mid-density, industrial-grade FPGA that combines reconfigurable logic, on-chip memory and extensive I/O in a compact 400-LFBGA package. Its MachXO3D family features—non-volatile configuration, embedded security and hardened peripheral IP—make it suitable for designs that require stable, persistent logic and system-level functions without relying solely on external components.

Engineers and procurement teams will value the device for designs that need scalable logic capacity, high I/O count and industrial temperature tolerance, along with the system-level integration benefits provided by the MachXO3D architecture and embedded resources.

Request a quote or submit an inquiry to get pricing and availability for LCMXO3D-9400ZC-3BG400I. Technical sales can provide lead time, volume pricing and additional configuration details.