LCMXO3L-1300C-5BG256I

The LCMXO3L-1300C-5BG256I is a MachXO3 family FPGA offering a compact, non-volatile programmable fabric in a 256‑LFBGA (14 × 14) package. It combines 1,280 logic elements, approximately 65,536 bits of embedded RAM, and up to 206 I/Os to address control, glue-logic and interface consolidation needs in industrial designs.

With a wide supply range (2.375 V to 3.465 V) and industrial operating temperature (−40 °C to 100 °C), this device targets systems that require on-board configurability, integrated peripheral IP and flexible I/O in a small-footprint package.

Key Features

• Core Logic 1,280 logic elements organized across the MachXO3 architecture for programmable combinational and sequential logic functions.
• Embedded Memory Approximately 65,536 bits of on-chip RAM for small buffers, FIFOs or lookup tables and single/dual-port memory modes.
• High I/O Count Up to 206 general-purpose I/Os to support extensive peripheral interfacing and board-level signal routing.
• Packaging and Mounting 256‑LFBGA (256‑CABGA, 14 × 14) surface-mount package for compact board integration.
• Voltage and Temperature Supported supply range from 2.375 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C.
• Non-volatile Configuration MachXO3 family includes non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• On-chip System Resources Integrated features described in the MachXO3 family datasheet such as on-chip oscillators, PLLs, and embedded hardened IP (I²C, SPI, timers/counters) for system-level functions.
• Reliability and Testability Device architecture supports configuration and testing modes including IEEE 1149.1-compliant boundary scan as described in the family datasheet.

Typical Applications

• Industrial Control Systems – Leverage the industrial temperature rating and 206 I/Os for glue logic, sensor interfacing and peripheral aggregation in factory automation equipment.
• Interface Bridging and Protocol Conversion – Use on-chip logic and embedded IP to consolidate multiple I/O standards and simplify board-level protocol conversions.
• Embedded Subsystem Integration – Implement custom control, timers/counters and small buffering functions using the device’s logic elements and embedded RAM to reduce external components.

Unique Advantages

• Compact, high-density I/O: 206 I/Os in a 14 × 14 256‑LFBGA package lets you maximize board connectivity in a small footprint.
• Non-volatile programming: Multi-time programmable non-volatile configuration removes the need for an external configuration flash for many use cases.
• Industrial-ready thermal range: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Flexible power options: Wide supply range (2.375 V to 3.465 V) accommodates a variety of system power rails and simplifies integration.
• Embedded system IP: Hardened I²C, SPI and timer/counter IP reduce development time and bill-of-materials for common peripheral functions.
• On-chip clocking and timing: Built-in PLLs and on-chip oscillator options enable flexible clocking strategies without requiring additional components.

Why Choose LCMXO3L-1300C-5BG256I?

The LCMXO3L-1300C-5BG256I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that require moderate logic density, significant I/O capacity and on-chip RAM in a small 256‑LFBGA package. Its non-volatile configuration model and integrated system resources—such as PLLs, on-chip oscillator and hardened peripheral IP—allow designers to reduce external components and simplify system architecture.

This device is well suited for engineers building industrial control modules, interface bridges, or embedded subsystems where temperature range, flexible I/O and on-board configurability matter. The MachXO3 family datasheet documents the architecture and system-level features that support robust implementation and testing in production designs.

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