LCMXO3D-9400ZC-3BG400C

The LCMXO3D-9400ZC-3BG400C is a MachXO3D family field programmable gate array (FPGA) offered in a 400-ball LFBGA (17×17) package for surface-mount applications. It provides 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and a high-density I/O count of 335, making it suitable for commercial embedded systems that require compact, reconfigurable logic with integrated system-level features.

Designed with a flexible architecture and on-chip system support, the device targets applications that need non-volatile reconfiguration, flexible on-chip clocking, and embedded security and IP building blocks for streamlined implementation of interface, control, and security functions.

Key Features

• Core Capacity  9,400 logic elements for mid-density FPGA implementations and 1,175 programmable fabric blocks.
• Embedded Memory  Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) supporting RAM, ROM and FIFO configurations for buffering and storage.
• High I/O Density  335 I/O pins to support extensive peripheral and interface connectivity, including source-synchronous I/O options described in the family datasheet.
• Non-volatile, Reconfigurable  MachXO3D family devices provide non-volatile reconfiguration capability so designs retain configuration without external volatile memory.
• Embedded Security & Hardened IP  Datasheet references an Embedded Security Block and hardened IP functions (for example, Hardened I2C, SPI and timers) to support secure and reliable system functions.
• Clocking and Timing  Flexible on-chip clocking, including PLLs and an on-chip oscillator, for adaptable clock management.
• Package & Mounting  400-LFBGA (supplier package: 400-CABGA, 17×17) in a surface-mount package for board-level integration.
• Power  Supply voltage range of 2.375 V to 3.465 V suitable for a range of commercial system power rails.
• Operating Grade  Commercial grade with operating temperature range of 0 °C to 85 °C.
• System Support  Family-level features include TransFR reconfiguration, user flash memory (UFM), and enhanced system-level support as described in the MachXO3D datasheet.
• Compliance  RoHS compliant.

Typical Applications

• Embedded System Control  Use as system glue logic and control functions in commercial embedded platforms that require reconfigurable logic and on-board non-volatile configuration.
• Interface Bridging and I/O Expansion  High I/O count and source-synchronous I/O support make the device well suited for protocol bridging, signal aggregation, and peripheral interfacing.
• Security and Authentication  Embedded security block and hardened IP cores support implementation of security-related functions and protected system features.
• Memory Buffering and Data Flow  On-chip RAM and FIFO-capable memory modes enable buffering, temporary storage, and data rate adaptation for streaming or burst data applications.

Unique Advantages

• High integration in a compact package  Combines 9,400 logic elements and 335 I/Os in a 400-LFBGA (17×17) package to reduce board area and BOM complexity.
• Non-volatile reconfiguration  Built-in non-volatile configuration avoids the need for external configuration memory and simplifies system boot flow.
• Embedded system features  On-chip oscillator, PLLs, UFM and hardened IP reduce the need for external components and speed time-to-market.
• Flexible memory modes  Approximately 0.44 Mbits of embedded RAM supports RAM, ROM and FIFO operation modes for adaptable data handling.
• Broad I/O connectivity  335 I/Os allow direct interfacing to numerous peripherals and sensors without extensive external glue logic.
• Commercial temperature suitability  Operates across 0 °C to 85 °C for a wide range of commercial applications.

Why Choose LCMXO3D-9400ZC-3BG400C?

The LCMXO3D-9400ZC-3BG400C positions itself as a mid-density, non-volatile FPGA option for commercial embedded designs that demand high I/O density, integrated memory, and system-level features such as embedded security and hardened IP. Its combination of 9,400 logic elements, approximately 0.44 Mbits of on-chip RAM, and flexible clocking makes it suitable for designers who need reconfigurable logic with minimized external component count.

For teams focused on reducing BOM complexity and accelerating development of interface-heavy or security-aware systems, this MachXO3D device offers a compact, RoHS-compliant platform with a commercial temperature range and a package optimized for surface-mount assembly.

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