LCMXO3D-9400ZC-3BG256C

The LCMXO3D-9400ZC-3BG256C is a MachXO3D family FPGA IC offering 9,400 logic elements and 1,175 configurable CLBs in a compact 256‑LFBGA package. It provides non-volatile, reconfigurable logic resources with embedded memory, dedicated security and hardened IP blocks as described in the MachXO3D device family datasheet.

Designed for commercial-grade embedded systems, the device targets control, interface and system-management roles where flexible I/O, on-chip RAM and integrated security functions simplify board-level design and system integration.

Key Features

• Core Logic  9,400 logic elements with 1,175 CLBs provide a dense fabric for glue logic, state machines and control functions.
• Embedded Memory  Approximately 0.42 Mbits (442,368 bits) of on-chip RAM suitable for FIFOs, buffers and small data stores.
• I/O Capacity  206 I/O pins support broad interfacing options and board-level signal routing needs.
• Voltage and Temperature  Supports a supply range of 2.375 V to 3.465 V and commercial operating temperature from 0 °C to 85 °C.
• Package & Mounting  256‑LFBGA (supplier package: 256‑CABGA, 14×14) for surface-mount assembly in compact designs.
• Embedded Security & Hardened IP  Includes a dedicated Embedded Security Block and other hardened IP functions referenced in the MachXO3D family datasheet.
• Non-volatile, Reconfigurable Architecture  MachXO3D family features non-volatile configuration and reconfiguration capabilities to retain designs without external volatile configuration memory.
• Standards & Compliance  RoHS compliant for global environmental requirements.

Typical Applications

• System Control & Glue Logic  Implement board-level control, protocol bridging and custom sequencing using the device’s logic elements and CLBs.
• Interface Bridging  Use the 206 I/Os to translate, buffer or aggregate signals between subsystems without adding discrete glue components.
• Security & Configuration Management  Leverage the embedded security block and non-volatile reconfiguration for authenticated boot and protected configuration storage.
• Embedded Memory Functions  On-chip RAM supports small buffers, FIFOs and state storage for real-time data handling in control and communication tasks.

Unique Advantages

• High Logic Density: 9,400 logic elements and 1,175 CLBs bring significant implementation capacity in a single-chip solution, reducing external component count.
• Integrated Memory: Approximately 0.42 Mbits of embedded RAM reduces reliance on external memory for moderate buffering and storage needs.
• Broad I/O Count: 206 I/Os provide flexibility for multi-interface designs and signal-rich applications.
• Non-volatile Reconfiguration: Built-in non-volatile configuration simplifies system boot and removes the need for external configuration flash in many designs.
• Compact, Surface-Mount Package: 256‑LFBGA (14×14 supplier footprint) supports compact board layouts while maintaining a high pin count.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose LCMXO3D-9400ZC-3BG256C?

The LCMXO3D-9400ZC-3BG256C positions itself as a flexible, commercially graded FPGA for embedded system designers who need significant on-chip logic, substantial embedded RAM and a high I/O count in a compact surface-mount package. Its MachXO3D family capabilities—non-volatile reconfiguration and dedicated security/hardened IP—support systems that require retained configuration and integrated security features without adding discrete parts.

This part is well suited to engineers building interface-intensive devices, control modules and system-management logic where reducing BOM complexity and consolidating functions onto a single device improves board area and design simplicity. Its voltage range, RoHS compliance and commercial operating window make it appropriate for mainstream embedded product lines.

If you would like pricing, availability or to request a formal quote for the LCMXO3D-9400ZC-3BG256C, please submit a quote request or contact our sales team to get started.